- Packaging：
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- Operating Temperature：
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- Mounting Type：
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- Housing Material：
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- Number of Positions or Pins (Grid)：
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- Contact Finish - Mating：
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- Contact Finish Thickness - Mating：
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- Contact Material - Mating：
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- Contact Finish - Post：
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- Contact Material - Post：
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- Conditions sélectionnées:
Découvrez les produits 8
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Operating Temperature | Mounting Type | Type | Features | Housing Material | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Contact Finish - Post | Contact Material - Post | |
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Operating Temperature | Mounting Type | Type | Features | Housing Material | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Contact Finish - Post | Contact Material - Post | |
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TE Connectivity AMP Connectors |
Enquête
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-
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MOQ: 1 MPQ: 1
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CONN IC DIP SOCKET 8POS GOLD
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Tube | 800 | -55°C ~ 105°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Polyester | 8 (2 x 4) | Gold | 25μin (0.63μm) | Copper Alloy | Gold | Copper Alloy | ||
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TE Connectivity AMP Connectors |
Enquête
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- |
-
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MOQ: 1 MPQ: 1
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CONN IC DIP SOCKET 8POS GOLD
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Tube | 500 | -55°C ~ 125°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Closed Frame | - | 8 (2 x 4) | Gold | 5μin (0.127μm) | Beryllium Copper | Gold | Brass | |||
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TE Connectivity AMP Connectors |
Enquête
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- |
-
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MOQ: 1 MPQ: 1
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CONN IC DIP SOCKET 16POS GOLD
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Bulk | 500 | -55°C ~ 125°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Closed Frame | Polyester | 16 (2 x 8) | Gold | 5μin (0.127μm) | Beryllium Copper | Tin-Lead | Beryllium Copper | |||
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TE Connectivity AMP Connectors |
Enquête
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- |
-
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MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 28POS GOLD
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Bulk | 500 | -55°C ~ 125°C | Through Hole | DIP，0.6" (15.24mm) Row Spacing | Closed Frame | Polyester | 28 (2 x 14) | Gold | 5μin (0.127μm) | Beryllium Copper | Tin-Lead | Brass，Copper | |||
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TE Connectivity AMP Connectors |
Enquête
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- |
-
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MOQ: 1 MPQ: 1
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CONN IC DIP SOCKET 16POS TINLEAD
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- | - | - | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Closed Frame，Elevated | Thermoplastic，Polyester，Glass Filled | 16 (2 x 8) | Tin-Lead | 3μin (0.08μm) | Beryllium Copper | Tin-Lead | Brass | |||
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TE Connectivity AMP Connectors |
Enquête
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- |
-
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MOQ: 1 MPQ: 1
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CONN IC DIP SOCKET 4POS GOLD
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Tape & Reel (TR) | - | -55°C ~ 125°C | Surface Mount | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Thermoplastic，Polyester | 4 (2 x 2) | Gold | 5μin (0.127μm) | Beryllium Copper | Gold | Brass | |||
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TE Connectivity AMP Connectors |
Enquête
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- |
-
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MOQ: 1 MPQ: 1
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CONN IC DIP SOCKET 8POS GOLD
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Tape & Reel (TR) | - | -55°C ~ 125°C | Surface Mount | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Thermoplastic，Polyester | 8 (2 x 4) | Gold | 5μin (0.127μm) | Beryllium Copper | Gold | Brass | |||
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TE Connectivity AMP Connectors |
Enquête
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- |
-
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MOQ: 1 MPQ: 1
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CONN IC DIP SOCKET 14POS GOLD
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Tape & Reel (TR) | - | -55°C ~ 125°C | Surface Mount | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Thermoplastic，Polyester | 14 (2 x 7) | Gold | 5μin (0.127μm) | Beryllium Copper | Gold | Brass |
