- Packaging：
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- Series：
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- Operating Temperature：
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- Mounting Type：
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- Features：
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- Termination：
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- Housing Material：
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- Number of Positions or Pins (Grid)：
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- Pitch - Mating：
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- Contact Finish - Mating：
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- Contact Finish Thickness - Mating：
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- Contact Material - Mating：
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- Pitch - Post：
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- Contact Finish Thickness - Post：
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- Contact Material - Post：
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- Conditions sélectionnées:
Découvrez les produits 123
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Operating Temperature | Mounting Type | Features | Termination | Housing Material | Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | |
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Operating Temperature | Mounting Type | Features | Termination | Housing Material | Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | |
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Samtec Inc. |
Enquête
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-
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MOQ: 1 MPQ: 1
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CONN SOCKET BGA 181POS GOLD
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Bulk | MHA | - | Through Hole | Open Frame | Solder | - | 181 (15 x 15) | 0.100" (2.54mm) | Gold | - | - | 0.100" (2.54mm) | Gold | - | - | ||
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3M |
Enquête
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- |
-
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MOQ: 1 MPQ: 1
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CONN SOCKET BGA 49POS GOLD
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- | Textool | - | Through Hole | Closed Frame | - | - | 49 (Verification Required) | 0.039" (1.00mm) | Gold | - | - | - | - | - | - | ||
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3M |
Enquête
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- |
-
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MOQ: 1 MPQ: 1
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CONN SOCKET BGA CUSTOM
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- | Textool | - | Through Hole | Custom | - | - | Custom | 0.026" ~ 0.050" (0.65mm ~ 1.27mm) | Custom | Custom | - | - | - | - | - | ||
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Preci-Dip |
Enquête
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- |
-
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MOQ: 1 MPQ: 1
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BGA PIN ADAPTER 1.27MM SMD
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Bulk | 550 | -55°C ~ 125°C | Through Hole | Closed Frame | Solder | FR4 Epoxy Glass | 192 (16 x 16) | 0.050" (1.27mm) | Gold | 10μin (0.25μm) | Beryllium Copper | 0.050" (1.27mm) | Gold | 10μin (0.25μm) | Brass | |||
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Preci-Dip |
Enquête
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- |
-
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MOQ: 1 MPQ: 1
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CONN SOCKET BGA 192POS GOLD
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Bulk | 514 | -55°C ~ 125°C | Surface Mount | Open Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester，Glass Filled | 192 (16 x 16) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Tin | - | Brass | |||
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Preci-Dip |
Enquête
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- |
-
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MOQ: 1 MPQ: 1
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CONN SOCKET BGA 192POS GOLD
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Bulk | 514 | -55°C ~ 125°C | Surface Mount | Open Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester，Glass Filled | 192 (16 x 16) | 0.100" (2.54mm) | Gold | 29.5μin (0.75μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | - | Brass | |||
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Preci-Dip |
Enquête
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- |
-
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MOQ: 1 MPQ: 1
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BGA PIN ADAPTER 1.27MM SMD
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Bulk | 550 | -55°C ~ 125°C | Through Hole | Closed Frame | Solder | FR4 Epoxy Glass | 255 (16 x 16) | 0.050" (1.27mm) | Gold | 10μin (0.25μm) | Beryllium Copper | 0.050" (1.27mm) | Gold | 10μin (0.25μm) | Brass | |||
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Preci-Dip |
Enquête
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- |
-
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MOQ: 1 MPQ: 1
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CONN SOCKET BGA 255POS GOLD
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Bulk | 514 | -55°C ~ 125°C | Surface Mount | Open Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester，Glass Filled | 255 (16 x 16) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Tin | - | Brass | |||
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Preci-Dip |
Enquête
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- |
-
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MOQ: 1 MPQ: 1
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BGA PIN ADAPTER 1.27MM SMD
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Bulk | 550 | -55°C ~ 125°C | Through Hole | Closed Frame | Solder | FR4 Epoxy Glass | 256 (20 x 20) | 0.050" (1.27mm) | Gold | 10μin (0.25μm) | Beryllium Copper | 0.050" (1.27mm) | Gold | 10μin (0.25μm) | Brass | |||
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Preci-Dip |
Enquête
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- |
-
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MOQ: 1 MPQ: 1
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BGA PIN ADAPTER 1.27MM SMD
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Bulk | 550 | -55°C ~ 125°C | Through Hole | Closed Frame | Solder | FR4 Epoxy Glass | 256 (16 x 16) | 0.050" (1.27mm) | Gold | 10μin (0.25μm) | Beryllium Copper | 0.050" (1.27mm) | Gold | 10μin (0.25μm) | Brass | |||
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Preci-Dip |
Enquête
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- |
-
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MOQ: 1 MPQ: 1
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CONN SOCKET BGA 256POS GOLD
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Bulk | 514 | -55°C ~ 125°C | Surface Mount | Open Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester，Glass Filled | 256 (16 x 16) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Tin | - | Brass | |||
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Preci-Dip |
Enquête
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- |
-
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MOQ: 1 MPQ: 1
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CONN SOCKET BGA 256POS GOLD
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Bulk | 514 | -55°C ~ 125°C | Surface Mount | Open Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester，Glass Filled | 256 (20 x 20) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Tin | - | Brass | |||
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Preci-Dip |
Enquête
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- |
-
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MOQ: 1 MPQ: 1
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BGA PIN ADAPTER 1.27MM SMD
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Bulk | 550 | -55°C ~ 125°C | Through Hole | Closed Frame | Solder | FR4 Epoxy Glass | 272 (20 x 20) | 0.050" (1.27mm) | Gold | 10μin (0.25μm) | Beryllium Copper | 0.050" (1.27mm) | Gold | 10μin (0.25μm) | Brass | |||
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Preci-Dip |
Enquête
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- |
-
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MOQ: 1 MPQ: 1
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CONN SOCKET BGA 272POS GOLD
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Bulk | 514 | -55°C ~ 125°C | Surface Mount | Open Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester，Glass Filled | 272 (20 x 20) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Tin | - | Brass | |||
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Preci-Dip |
Enquête
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- |
-
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MOQ: 1 MPQ: 1
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BGA SOLDER TAIL
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Bulk | 550 | -55°C ~ 125°C | Through Hole | Closed Frame | Solder | FR4 Epoxy Glass | 192 (16 x 16) | 0.050" (1.27mm) | Gold | 10μin (0.25μm) | Brass | 0.050" (1.27mm) | Gold | 10μin (0.25μm) | Brass | |||
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Preci-Dip |
Enquête
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- |
-
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MOQ: 1 MPQ: 1
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BGA PIN ADAPTER 1.27MM SMD
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Bulk | 550 | -55°C ~ 125°C | Through Hole | Closed Frame | Solder | FR4 Epoxy Glass | 292 (20 x 20) | 0.050" (1.27mm) | Gold | 10μin (0.25μm) | Beryllium Copper | 0.050" (1.27mm) | Gold | 10μin (0.25μm) | Brass | |||
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Preci-Dip |
Enquête
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- |
-
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MOQ: 1 MPQ: 1
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CONN SOCKET BGA 292POS GOLD
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Bulk | 514 | -55°C ~ 125°C | Surface Mount | Open Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester，Glass Filled | 292 (20 x 20) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Tin | - | Brass | |||
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Preci-Dip |
Enquête
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- |
-
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MOQ: 1 MPQ: 1
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BGA SURFACE MOUNT 1.27MM
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Bulk | 558 | -55°C ~ 125°C | Surface Mount | Closed Frame | Solder | FR4 Epoxy Glass | 192 (16 x 16) | 0.050" (1.27mm) | Gold | 10μin (0.25μm) | Brass | 0.050" (1.27mm) | Gold | 10μin (0.25μm) | Brass | |||
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Preci-Dip |
Enquête
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- |
-
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MOQ: 1 MPQ: 1
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CONN SOCKET BGA 255POS GOLD
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Bulk | 514 | -55°C ~ 125°C | Surface Mount | Open Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester，Glass Filled | 255 (16 x 16) | 0.100" (2.54mm) | Gold | 29.5μin (0.75μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | - | Brass | |||
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Preci-Dip |
Enquête
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- |
-
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MOQ: 1 MPQ: 1
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CONN SOCKET BGA 256POS GOLD
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Bulk | 514 | -55°C ~ 125°C | Surface Mount | Open Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester，Glass Filled | 256 (16 x 16) | 0.100" (2.54mm) | Gold | 29.5μin (0.75μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | - | Brass |
