Douilles pour circuits intégrés, transistors - Zui Ai Technology（Taiwan）Company.

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Image	Numéro de pièce	Fabricant	Quantité	Délai de livraison	Prix unitaire	Acheter	Description	Packaging	Series	Operating Temperature	Mounting Type	Type	Features	Housing Material	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Pitch - Post	Contact Finish Thickness - Post	Contact Material - Post
Image	Numéro de pièce	Fabricant	Quantité	Délai de livraison	Prix unitaire	Acheter	Description	Packaging	Series	Operating Temperature	Mounting Type	Type	Features	Housing Material	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Pitch - Post	Contact Finish Thickness - Post	Contact Material - Post
	1050281001	Molex，LLC	96,800	3 jours	-	CONN CAM SOCKET 32POS GOLD MOQ: 1 MPQ: 1	CONN CAM SOCKET 32POS GOLD	Tape & Reel (TR)	105028	-	Surface Mount	Camera Socket	Open Frame	Thermoplastic	32 (4 x 8)	0.035" (0.90mm)	Gold	12μin (0.30μm)	Copper Alloy	0.035" (0.90mm)	50μin (1.27μm)	Copper Alloy
	1050281001	Molex，LLC	97,189	3 jours	-	CONN CAM SOCKET 32POS GOLD MOQ: 1 MPQ: 1	CONN CAM SOCKET 32POS GOLD	Cut Tape (CT)	105028	-	Surface Mount	Camera Socket	Open Frame	Thermoplastic	32 (4 x 8)	0.035" (0.90mm)	Gold	12μin (0.30μm)	Copper Alloy	0.035" (0.90mm)	50μin (1.27μm)	Copper Alloy
	1050281001	Molex，LLC	97,189	3 jours	-	CONN CAM SOCKET 32POS GOLD MOQ: 1 MPQ: 1	CONN CAM SOCKET 32POS GOLD	-	105028	-	Surface Mount	Camera Socket	Open Frame	Thermoplastic	32 (4 x 8)	0.035" (0.90mm)	Gold	12μin (0.30μm)	Copper Alloy	0.035" (0.90mm)	50μin (1.27μm)	Copper Alloy
	475939000	Molex，LLC	Enquête	-	-	CONN SOCKET LGA 1366POS NICKEL MOQ: 1 MPQ: 1	CONN SOCKET LGA 1366POS NICKEL	-	47594	-	Surface Mount	LGA	Closed Frame	-	1366 (32 x 41)	-	Nickel	3μin (0.08μm)	-	-	3μin (0.08μm)	-
	AW127-20/Z-T-R	ASSMANN WSW Components	Enquête	-	-	SOCKET 20 CONTACTS SINGLE ROW MOQ: 1 MPQ: 1	SOCKET 20 CONTACTS SINGLE ROW	Bulk	-	-40°C ~ 105°C	Through Hole	-	-	Polyphenylene Sulfide (PPS)，Glass Filled	20 (1 x 20)	0.100" (2.54mm)	Nickel	78.7μin (2.00μm)	Brass	0.100" (2.54mm)	78.7μin (2.00μm)	Brass
	9-1437504-5	TE Connectivity AMP Connectors	Enquête	-	-	CONN SOCKET TRANSIST TO-3 3POS MOQ: 1 MPQ: 1	CONN SOCKET TRANSIST TO-3 3POS	Bulk	-	-55°C ~ 125°C	Chassis Mount	Transistor，TO-3	Closed Frame	Phenolic	3 (Oval)	-	Gold	30μin (0.76μm)	Beryllium Copper	-	50μin (1.27μm)	Beryllium Copper
	9-1437504-6	TE Connectivity AMP Connectors	Enquête	-	-	CONN SOCKET TRANSIST TO-3 3POS MOQ: 1 MPQ: 1	CONN SOCKET TRANSIST TO-3 3POS	Bulk	-	-55°C ~ 125°C	Chassis Mount	Transistor，TO-3	Closed Frame	Diallyl Phthalate (DAP)	3 (Oval)	-	Gold	30μin (0.76μm)	Beryllium Copper	-	50μin (1.27μm)	Beryllium Copper
	9-1437504-9	TE Connectivity AMP Connectors	Enquête	-	-	CONN SOCKET TRANSIST TO-3 3POS MOQ: 1 MPQ: 1	CONN SOCKET TRANSIST TO-3 3POS	Bulk	-	-55°C ~ 125°C	Chassis Mount	Transistor，TO-3	Closed Frame	Diallyl Phthalate (DAP)	3 (Oval)	-	Gold	30μin (0.76μm)	Beryllium Copper	-	50μin (1.27μm)	Beryllium Copper

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