- Series:
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- Operating Temperature:
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- Mounting Type:
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- Type:
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- Termination:
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- Housing Material:
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- Number of Positions or Pins (Grid):
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- Contact Finish - Mating:
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- Contact Finish Thickness - Mating:
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- Contact Material - Mating:
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- Pitch - Post:
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- Contact Finish - Post:
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- Contact Finish Thickness - Post:
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- Contact Material - Post:
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- Conditions sélectionnées:
Découvrez les produits 674
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Operating Temperature | Mounting Type | Type | Features | Termination | Housing Material | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | ||
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Operating Temperature | Mounting Type | Type | Features | Termination | Housing Material | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | ||
ASSMANN WSW Components |
24,224
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC SOCKET PLCC 44POS TIN SMD
|
Tube | - | -40°C ~ 105°C | Surface Mount | PLCC | Closed Frame | Solder | Polyamide (PA9T),Nylon 9T,Glass Filled | 44 (4 x 11) | Tin | 160μin (4.06μm) | Phosphor Bronze | 0.050" (1.27mm) | Tin | 160μin (4.06μm) | Phosphor Bronze | ||||
ASSMANN WSW Components |
21,261
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET PLCC 44POS TIN
|
Tube | - | -40°C ~ 105°C | Through Hole | PLCC | Closed Frame | Solder | Polybutylene Terephthalate (PBT) | 44 (4 x 11) | Tin | 160μin (4.06μm) | Phosphor Bronze | 0.100" (2.54mm) | Tin | 160μin (4.06μm) | Phosphor Bronze | ||||
3M |
6,300
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET PLCC 32POS TIN
|
Tape & Reel (TR) | 8400 | -40°C ~ 105°C | Surface Mount | PLCC | Closed Frame | Solder | Polybutylene Terephthalate (PBT),Glass Filled | 32 (2 x 7,2 x 9) | Tin | 160μin (4.06μm) | Copper Alloy | 0.050" (1.27mm) | Tin | 160μin (4.06μm) | Copper Alloy | ||||
3M |
6,697
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET PLCC 32POS TIN
|
Cut Tape (CT) | 8400 | -40°C ~ 105°C | Surface Mount | PLCC | Closed Frame | Solder | Polybutylene Terephthalate (PBT),Glass Filled | 32 (2 x 7,2 x 9) | Tin | 160μin (4.06μm) | Copper Alloy | 0.050" (1.27mm) | Tin | 160μin (4.06μm) | Copper Alloy | ||||
3M |
6,697
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET PLCC 32POS TIN
|
- | 8400 | -40°C ~ 105°C | Surface Mount | PLCC | Closed Frame | Solder | Polybutylene Terephthalate (PBT),Glass Filled | 32 (2 x 7,2 x 9) | Tin | 160μin (4.06μm) | Copper Alloy | 0.050" (1.27mm) | Tin | 160μin (4.06μm) | Copper Alloy | ||||
Mill-Max Manufacturing Corp. |
2,842
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET PLCC 44POS TIN
|
Tube | 940 | -55°C ~ 125°C | Surface Mount | PLCC | Closed Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT),Polyester | 44 (4 x 11) | Tin | 150μin (3.81μm) | Beryllium Copper | 0.050" (1.27mm) | Tin | 200μin (5.08μm) | Brass Alloy | ||||
3M |
1,440
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET PLCC 44POS TIN
|
Tape & Reel (TR) | 8400 | -40°C ~ 105°C | Surface Mount | PLCC | Closed Frame | Solder | Polybutylene Terephthalate (PBT),Glass Filled | 44 (4 x 11) | Tin | 160μin (4.06μm) | Copper Alloy | 0.050" (1.27mm) | Tin | 160μin (4.06μm) | Copper Alloy | ||||
3M |
1,583
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET PLCC 44POS TIN
|
Cut Tape (CT) | 8400 | -40°C ~ 105°C | Surface Mount | PLCC | Closed Frame | Solder | Polybutylene Terephthalate (PBT),Glass Filled | 44 (4 x 11) | Tin | 160μin (4.06μm) | Copper Alloy | 0.050" (1.27mm) | Tin | 160μin (4.06μm) | Copper Alloy | ||||
3M |
1,583
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET PLCC 44POS TIN
|
- | 8400 | -40°C ~ 105°C | Surface Mount | PLCC | Closed Frame | Solder | Polybutylene Terephthalate (PBT),Glass Filled | 44 (4 x 11) | Tin | 160μin (4.06μm) | Copper Alloy | 0.050" (1.27mm) | Tin | 160μin (4.06μm) | Copper Alloy | ||||
ASSMANN WSW Components |
11,029
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET PLCC 68POS TIN
|
Tube | - | -40°C ~ 105°C | Through Hole | PLCC | Closed Frame | Solder | Polybutylene Terephthalate (PBT) | 68 (4 x 17) | Tin | 160μin (4.06μm) | Phosphor Bronze | 0.100" (2.54mm) | Tin | 160μin (4.06μm) | Phosphor Bronze | ||||
3M |
3,289
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET PLCC 44POS TIN
|
Tube | 8400 | -40°C ~ 105°C | Surface Mount | PLCC | Closed Frame | Solder | Polybutylene Terephthalate (PBT),Glass Filled | 44 (4 x 11) | Tin | 160μin (4.06μm) | Copper Alloy | 0.050" (1.27mm) | Tin | 160μin (4.06μm) | Copper Alloy | ||||
Mill-Max Manufacturing Corp. |
4,274
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET PLCC 32POS TIN
|
Tube | 540 | -55°C ~ 125°C | Surface Mount | PLCC | Closed Frame | Solder | Polyphenylene Sulfide (PPS) | 32 (2 x 7,2 x 9) | Tin | 150μin (3.81μm) | Copper Alloy | 0.050" (1.27mm) | Tin | 150μin (3.81μm) | Copper Alloy | ||||
Amphenol FCI |
8,538
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET PLCC 44POS TIN
|
Tube | - | -40°C ~ 105°C | Through Hole | PLCC | Closed Frame | Solder | Polyphenylene Sulfide (PPS) | 44 (4 x 11) | Tin | 100μin (2.54μm) | Copper Alloy | 0.050" (1.27mm) | Tin | 100μin (2.54μm) | Copper Alloy | ||||
CnC Tech |
5,739
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET PLCC 44POS TIN
|
Tube | - | -55°C ~ 105°C | Surface Mount | PLCC | Closed Frame | Solder | Polybutylene Terephthalate (PBT),Glass Filled | 44 (4 x 11) | Tin | - | Phosphor Bronze | 0.050" (1.27mm) | Tin | - | Phosphor Bronze | ||||
ASSMANN WSW Components |
2,051
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET PLCC 20POS TIN
|
Tube | - | -40°C ~ 105°C | Surface Mount | PLCC | Closed Frame | Solder | Polyamide (PA9T),Nylon 9T,Glass Filled | 20 (4 x 5) | Tin | 160μin (4.06μm) | Phosphor Bronze | 0.050" (1.27mm) | Tin | 160μin (4.06μm) | Phosphor Bronze | ||||
ASSMANN WSW Components |
9,135
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC PLCC SOCKET 32POS TIN SMD
|
Tube | - | -40°C ~ 105°C | Surface Mount | PLCC | Closed Frame | Solder | Polyamide (PA9T),Nylon 9T,Glass Filled | 32 (4 x 8) | Tin | 160μin (4.06μm) | Phosphor Bronze | 0.050" (1.27mm) | Tin | 160μin (4.06μm) | Phosphor Bronze | ||||
ASSMANN WSW Components |
2,252
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET PLCC 28POS TIN
|
Tube | - | -40°C ~ 105°C | Through Hole | PLCC | Closed Frame | Solder | Polybutylene Terephthalate (PBT) | 28 (4 x 7) | Tin | 160μin (4.06μm) | Phosphor Bronze | 0.100" (2.54mm) | Tin | 160μin (4.06μm) | Phosphor Bronze | ||||
ASSMANN WSW Components |
4,031
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET PLCC 32POS TIN
|
Tube | - | -40°C ~ 105°C | Through Hole | PLCC | Closed Frame | Solder | Polybutylene Terephthalate (PBT) | 32 (4 x 8) | Tin | 160μin (4.06μm) | Phosphor Bronze | 0.100" (2.54mm) | Tin | 160μin (4.06μm) | Phosphor Bronze | ||||
Mill-Max Manufacturing Corp. |
1,197
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET PLCC 20POS TIN
|
Tube | 940 | -55°C ~ 125°C | Surface Mount | PLCC | Closed Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT),Polyester | 20 (4 x 5) | Tin | 150μin (3.81μm) | Beryllium Copper | 0.050" (1.27mm) | Tin | 200μin (5.08μm) | Brass Alloy | ||||
Mill-Max Manufacturing Corp. |
2,577
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET PLCC 28POS TIN
|
Tube | 940 | -55°C ~ 125°C | Surface Mount | PLCC | Closed Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT),Polyester | 28 (4 x 7) | Tin | 150μin (3.81μm) | Beryllium Copper | 0.050" (1.27mm) | Tin | 200μin (5.08μm) | Brass Alloy |