- Operating Temperature：
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- Mounting Type：
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- Type：
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- Features：
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- Housing Material：
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- Number of Positions or Pins (Grid)：
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- Contact Material - Mating：
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- Contact Finish - Post：
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- Contact Material - Post：
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- Conditions sélectionnées:
Découvrez les produits 52
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Operating Temperature | Mounting Type | Type | Features | Housing Material | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish - Post | Contact Material - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Operating Temperature | Mounting Type | Type | Features | Housing Material | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish - Post | Contact Material - Post | |
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TE Connectivity AMP Connectors |
2,356
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 14POS GOLD
|
Tube | 500 | -55°C ~ 125°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Closed Frame | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 14 (2 x 7) | Beryllium Copper | Gold | Nickel | ||
|
|
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TE Connectivity AMP Connectors |
1,852
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 16POS GOLD
|
Tube | 500 | -55°C ~ 125°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Closed Frame | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 16 (2 x 8) | Beryllium Copper | Gold | Nickel | ||
|
|
|
TE Connectivity AMP Connectors |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 32POS GOLD
|
Tube | 500 | -55°C ~ 125°C | Through Hole | DIP，0.6" (15.24mm) Row Spacing | Closed Frame | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 32 (2 x 16) | Beryllium Copper | Gold | Nickel | ||
|
|
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TE Connectivity AMP Connectors |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 40POS GOLD
|
Tube | 500 | -55°C ~ 125°C | Through Hole | DIP，0.6" (15.24mm) Row Spacing | Closed Frame | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 40 (2 x 20) | Beryllium Copper | Gold | Nickel | ||
|
|
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TE Connectivity AMP Connectors |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 28POS GOLD
|
Tube | 500 | -55°C ~ 125°C | Through Hole | DIP，0.6" (15.24mm) Row Spacing | Closed Frame | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 28 (2 x 14) | Beryllium Copper | Gold | Nickel | ||
|
|
|
TE Connectivity AMP Connectors |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 24POS GOLD
|
Tube | 500 | -55°C ~ 125°C | Through Hole | DIP，0.6" (15.24mm) Row Spacing | Closed Frame | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 24 (2 x 12) | Beryllium Copper | Gold | Nickel | ||
|
|
TE Connectivity AMP Connectors |
384
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 40POS GOLD
|
Tube | 500 | -55°C ~ 125°C | Through Hole | DIP，0.6" (15.24mm) Row Spacing | Closed Frame | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 40 (2 x 20) | Beryllium Copper | Gold | Beryllium Copper | |||
|
|
TE Connectivity AMP Connectors |
9,550
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 8POS GOLD
|
Tube | 800 | -55°C ~ 105°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 8 (2 x 4) | Beryllium Copper | Gold | Copper | |||
|
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TE Connectivity AMP Connectors |
14,336
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 8POS GOLD
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Tube | 500 | -55°C ~ 125°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Closed Frame | - | 8 (2 x 4) | Copper Alloy | Gold | Copper Alloy | |||
|
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TE Connectivity AMP Connectors |
7
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 28POS GOLD
|
Tube | 500 | -55°C ~ 125°C | Through Hole | DIP，0.6" (15.24mm) Row Spacing | Closed Frame | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 28 (2 x 14) | Beryllium Copper | Gold | Beryllium Copper | |||
|
|
TE Connectivity AMP Connectors |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 8POS GOLD
|
Tube | 500 | -55°C ~ 125°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Closed Frame | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 8 (2 x 4) | Beryllium Copper | Gold | Beryllium Copper | |||
|
|
TE Connectivity AMP Connectors |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 8POS GOLD
|
Tube | 500 | -55°C ~ 125°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Closed Frame | Polyester | 8 (2 x 4) | Copper Alloy | Gold | Copper Alloy | |||
|
|
TE Connectivity AMP Connectors |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 14POS GOLD
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Tube | 500 | -55°C ~ 125°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Closed Frame | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 14 (2 x 7) | Beryllium Copper | Gold | Beryllium Copper | |||
|
|
TE Connectivity AMP Connectors |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 14POS GOLD
|
Tube | 500 | -55°C ~ 125°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Closed Frame | - | 14 (2 x 7) | Beryllium Copper | Gold | Copper Alloy | |||
|
|
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TE Connectivity AMP Connectors |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 18POS GOLD
|
Tube | 500 | -55°C ~ 125°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Closed Frame | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 18 (2 x 9) | Beryllium Copper | Gold | Nickel | ||
|
|
|
TE Connectivity AMP Connectors |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 20POS GOLD
|
Tube | 500 | -55°C ~ 125°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Closed Frame | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 20 (2 x 10) | Beryllium Copper | Gold | Nickel | ||
|
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TE Connectivity AMP Connectors |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 24POS GOLD
|
Tube | 500 | -55°C ~ 125°C | Through Hole | DIP，0.6" (15.24mm) Row Spacing | Closed Frame | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 24 (2 x 12) | Beryllium Copper | Gold | Beryllium Copper | |||
|
|
|
TE Connectivity AMP Connectors |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 36POS GOLD
|
Tube | 500 | -55°C ~ 125°C | Through Hole | DIP，0.6" (15.24mm) Row Spacing | Closed Frame | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 36 (2 x 18) | Beryllium Copper | Gold | Nickel | ||
|
|
|
Omron Electronics Inc-EMC Div |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 32POS GOLD
|
Bulk | XR2 | -55°C ~ 125°C | Through Hole | DIP，0.6" (15.24mm) Row Spacing | Open Frame | Polybutylene Terephthalate (PBT)，Glass Filled | 32 (2 x 16) | Beryllium Copper | Gold | Beryllium Copper | ||
|
|
TE Connectivity AMP Connectors |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 32POS GOLD
|
Tube | 500 | -55°C ~ 125°C | Through Hole | DIP，0.6" (15.24mm) Row Spacing | Closed Frame | Polyester | 32 (2 x 16) | Beryllium Copper | Gold | Beryllium Copper |
