- Operating Temperature:
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- Mounting Type:
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- Type:
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- Features:
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- Housing Material:
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- Number of Positions or Pins (Grid):
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- Pitch - Mating:
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- Contact Finish Thickness - Mating:
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- Pitch - Post:
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- Contact Finish - Post:
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- Contact Finish Thickness - Post:
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- Contact Material - Post:
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- Conditions sélectionnées:
Découvrez les produits 618
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Operating Temperature | Mounting Type | Type | Features | Housing Material | Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish Thickness - Mating | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Operating Temperature | Mounting Type | Type | Features | Housing Material | Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish Thickness - Mating | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | ||
Aries Electronics |
2,527
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 14POS GOLD
|
- | Through Hole | DIP,0.3" (7.62mm) Row Spacing | Open Frame | Polyamide (PA46),Nylon 4/6,Glass Filled | 14 (2 x 7) | 0.100" (2.54mm) | 10μin (0.25μm) | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass | ||||
Aries Electronics |
6,009
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 8POS GOLD
|
- | Surface Mount | DIP,0.3" (7.62mm) Row Spacing | Open Frame | Polyamide (PA46),Nylon 4/6,Glass Filled | 8 (2 x 4) | 0.100" (2.54mm) | 10μin (0.25μm) | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass | ||||
Aries Electronics |
1,734
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 40POS GOLD
|
- | Through Hole | DIP,0.6" (15.24mm) Row Spacing | Open Frame | Polyamide (PA46),Nylon 4/6,Glass Filled | 40 (2 x 20) | 0.100" (2.54mm) | 10μin (0.25μm) | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass | ||||
Aries Electronics |
1,290
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET SIP 40POS GOLD
|
- | Through Hole | SIP | Open Frame | Polyamide (PA46),Nylon 4/6,Glass Filled | 40 (1 x 40) | 0.100" (2.54mm) | 10μin (0.25μm) | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass | ||||
Aries Electronics |
4,578
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 8POS GOLD
|
- | Through Hole | DIP,0.3" (7.62mm) Row Spacing | Open Frame | Polyamide (PA46),Nylon 4/6,Glass Filled | 8 (2 x 4) | 0.100" (2.54mm) | 10μin (0.25μm) | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass | ||||
Aries Electronics |
8,359
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET SIP 8POS GOLD
|
- | Through Hole | SIP | Open Frame | Polyamide (PA46),Nylon 4/6,Glass Filled | 8 (1 x 8) | 0.100" (2.54mm) | 10μin (0.25μm) | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass | ||||
Aries Electronics |
2,109
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 16POS GOLD
|
- | Through Hole | DIP,0.3" (7.62mm) Row Spacing | Open Frame | Polyamide (PA46),Nylon 4/6,Glass Filled | 16 (2 x 8) | 0.100" (2.54mm) | 10μin (0.25μm) | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass | ||||
Aries Electronics |
1,199
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 18POS GOLD
|
- | Through Hole | DIP,0.3" (7.62mm) Row Spacing | Open Frame | Polyamide (PA46),Nylon 4/6,Glass Filled | 18 (2 x 9) | 0.100" (2.54mm) | 10μin (0.25μm) | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass | ||||
Aries Electronics |
1,526
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 28POS GOLD
|
- | Through Hole | DIP,0.6" (15.24mm) Row Spacing | Open Frame | Polyamide (PA46),Nylon 4/6,Glass Filled | 28 (2 x 14) | 0.100" (2.54mm) | 10μin (0.25μm) | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass | ||||
Aries Electronics |
4,385
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 32POS GOLD
|
- | Through Hole | DIP,0.6" (15.24mm) Row Spacing | Open Frame | Polyamide (PA46),Nylon 4/6,Glass Filled | 32 (2 x 16) | 0.100" (2.54mm) | 10μin (0.25μm) | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass | ||||
Aries Electronics |
743
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET SIP 40POS GOLD
|
- | Through Hole | SIP | Open Frame | Polyamide (PA46),Nylon 4/6,Glass Filled | 40 (1 x 40) | 0.100" (2.54mm) | 10μin (0.25μm) | 0.100" (2.54mm) | Gold | 10μin (0.25μm) | Brass | ||||
Aries Electronics |
225
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 48POS GOLD
|
- | Through Hole | DIP,0.6" (15.24mm) Row Spacing | Open Frame | Polyamide (PA46),Nylon 4/6,Glass Filled | 48 (2 x 24) | 0.100" (2.54mm) | 10μin (0.25μm) | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass | ||||
Aries Electronics |
287
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 14POS GOLD
|
- | Through Hole | DIP,0.3" (7.62mm) Row Spacing | Open Frame | Polyamide (PA46),Nylon 4/6,Glass Filled | 14 (2 x 7) | 0.100" (2.54mm) | 10μin (0.25μm) | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass | ||||
Aries Electronics |
166
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET SIP 20POS GOLD
|
- | Surface Mount | SIP | Open Frame | Polyamide (PA46),Nylon 4/6,Glass Filled | 20 (1 x 20) | 0.100" (2.54mm) | 10μin (0.25μm) | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass | ||||
Aries Electronics |
524
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET SIP 10POS GOLD
|
- | Through Hole | SIP | Open Frame | Polyamide (PA46),Nylon 4/6,Glass Filled | 10 (1 x 10) | 0.100" (2.54mm) | 10μin (0.25μm) | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass | ||||
Aries Electronics |
895
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 20POS GOLD
|
- | Through Hole | DIP,0.3" (7.62mm) Row Spacing | Open Frame | Polyamide (PA46),Nylon 4/6,Glass Filled | 20 (2 x 10) | 0.100" (2.54mm) | 10μin (0.25μm) | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass | ||||
Aries Electronics |
263
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 28POS GOLD
|
- | Through Hole | DIP,0.3" (7.62mm) Row Spacing | Open Frame | Polyamide (PA46),Nylon 4/6,Glass Filled | 28 (2 x 14) | 0.100" (2.54mm) | 10μin (0.25μm) | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass | ||||
Aries Electronics |
575
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET SIP 6POS GOLD
|
- | Through Hole | SIP | Open Frame | Polyamide (PA46),Nylon 4/6,Glass Filled | 6 (1 x 6) | 0.100" (2.54mm) | 10μin (0.25μm) | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass | ||||
Aries Electronics |
191
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET SIP 6POS GOLD
|
- | Through Hole | SIP | Open Frame | Polyamide (PA46),Nylon 4/6,Glass Filled | 6 (1 x 6) | 0.100" (2.54mm) | 10μin (0.25μm) | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass | ||||
Aries Electronics |
171
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 8POS GOLD
|
- | Through Hole | DIP,0.3" (7.62mm) Row Spacing | Open Frame | Polyamide (PA46),Nylon 4/6,Glass Filled | 8 (2 x 4) | 0.100" (2.54mm) | 10μin (0.25μm) | 0.100" (2.54mm) | Gold | 10μin (0.25μm) | Brass |