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- Mounting Type：
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- Features：
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- Termination：
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- Housing Material：
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- Number of Positions or Pins (Grid)：
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- Pitch - Mating：
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- Contact Material - Mating：
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- Conditions sélectionnées:
Découvrez les produits 21
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Series | Mounting Type | Type | Features | Termination | Housing Material | Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | |
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Series | Mounting Type | Type | Features | Termination | Housing Material | Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | |
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3M |
683
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3 jours |
-
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MOQ: 1 MPQ: 1
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CONN SOCKET SOIC 8POS GOLD
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Textool | Through Hole | SOIC | Closed Frame | Solder | Polyethersulfone (PES)，Glass Filled | 8 (2 x 4) | - | Gold | 30μin (0.76μm) | Beryllium Copper | - | Gold | 30μin (0.76μm) | Beryllium Copper | ||
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|
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3M |
337
|
3 jours |
-
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MOQ: 1 MPQ: 1
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CONN SOCKET SOIC 16POS GOLD
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Textool | Through Hole | SOIC | Closed Frame | Solder | Polyethersulfone (PES)，Glass Filled | 16 (2 x 8) | - | Gold | - | Beryllium Copper | - | Gold | 30μin (0.76μm) | Beryllium Copper | ||
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|
|
3M |
149
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET PGA ZIF 121POS GOLD
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Textool | Through Hole | PGA，ZIF (ZIP) | - | Solder | Polyethersulfone (PES) | 121 (11 x 11) | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | ||
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|
|
3M |
110
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET PGA ZIF 225POS GOLD
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Textool | - | PGA，ZIF (ZIP) | - | - | Polyethersulfone (PES) | 225 (15 x 15) | 0.100" (2.54mm) | - | - | - | 0.100" (2.54mm) | - | - | - | ||
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|
|
3M |
198
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET SOIC 28POS GOLD
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Textool | Through Hole | SOIC | Closed Frame | Solder | Polyethersulfone (PES)，Glass Filled | 28 (2 x 14) | - | Gold | - | Beryllium Copper | - | Gold | 30μin (0.76μm) | Beryllium Copper | ||
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|
|
3M |
140
|
3 jours |
-
|
MOQ: 1 MPQ: 1
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CONN SOCKET PGA ZIF 169POS GOLD
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Textool | Through Hole | PGA，ZIF (ZIP) | - | Solder | Polyethersulfone (PES) | 169 (13 x 13) | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | ||
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|
|
3M |
155
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET SOIC 14POS GOLD
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Textool | Through Hole | SOIC | Closed Frame | Solder | Polyethersulfone (PES)，Glass Filled | 14 (2 x 7) | - | Gold | - | Beryllium Copper | - | Gold | 30μin (0.76μm) | Beryllium Copper | ||
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|
|
3M |
45
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3 jours |
-
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MOQ: 1 MPQ: 1
|
CONN TRANSIST TO-3/TO-66 3POS
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Textool | Through Hole | Transistor，TO-3 and TO-66 | Closed Frame | Solder | Polyphenylene Sulfide (PPS)，Glass Filled | 3 (Rectangular) | - | Gold | 30μin (0.76μm) | Beryllium Copper | 0.234" (5.94mm) | Gold | 30μin (0.76μm) | Beryllium Copper | ||
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|
|
3M |
39
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET SOIC 16POS GOLD
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Textool | Through Hole | SOIC | Closed Frame | Solder | Polyethersulfone (PES)，Glass Filled | 16 (2 x 8) | - | Gold | - | Beryllium Copper | - | Gold | 30μin (0.76μm) | Beryllium Copper | ||
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|
|
3M |
83
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET PGA ZIF 100POS GOLD
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Textool | Through Hole | PGA，ZIF (ZIP) | - | Solder | Polyethersulfone (PES) | 100 (10 x 10) | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | ||
|
|
|
3M |
95
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET PGA ZIF 289POS GOLD
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Textool | Through Hole | PGA，ZIF (ZIP) | - | Solder | Polyethersulfone (PES) | 289 (17 x 17) | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | ||
|
|
|
3M |
64
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET PGA ZIF 361POS GOLD
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Textool | Through Hole | PGA，ZIF (ZIP) | - | Solder | Polyethersulfone (PES) | 361 (19 x 19) | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | ||
|
|
|
3M |
25
|
3 jours |
-
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MOQ: 1 MPQ: 1
|
CONN SOCKET PGA ZIF 441POS GOLD
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Textool | Through Hole | PGA，ZIF (ZIP) | - | Solder | Polyethersulfone (PES) | 441 (21 x 21) | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | ||
|
|
|
3M |
12
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET SOIC 20POS GOLD
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Textool | Through Hole | SOIC | Closed Frame | Solder | Polyethersulfone (PES)，Glass Filled | 20 (2 x 10) | - | Gold | - | Beryllium Copper | - | Gold | 30μin (0.76μm) | Beryllium Copper | ||
|
|
|
3M |
35
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET SOIC 24POS GOLD
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Textool | Through Hole | SOIC | Closed Frame | Solder | Polyethersulfone (PES)，Glass Filled | 24 (2 x 12) | - | Gold | - | Beryllium Copper | - | Gold | 30μin (0.76μm) | Beryllium Copper | ||
|
|
|
3M |
21
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET PGA ZIF 625POS GOLD
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Textool | Through Hole | PGA，ZIF (ZIP) | - | Solder | Polyethersulfone (PES) | 625 (25 x 25) | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | ||
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|
|
3M |
20
|
3 jours |
-
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MOQ: 1 MPQ: 1
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CONN SOCKET SOIC 18POS GOLD
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Textool | Through Hole | SOIC | Closed Frame | Solder | Polyethersulfone (PES)，Glass Filled | 18 (2 x 9) | - | Gold | - | Beryllium Copper | - | Gold | 30μin (0.76μm) | Beryllium Copper | ||
|
|
|
3M |
1
|
3 jours |
-
|
MOQ: 1 MPQ: 1
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CONN SOCKET SOIC 28POS GOLD
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Textool | Through Hole | SOIC | Closed Frame | Solder | Polyethersulfone (PES)，Glass Filled | 28 (2 x 14) | - | Gold | - | Beryllium Copper | - | Gold | 30μin (0.76μm) | Beryllium Copper | ||
|
|
Texas Instruments |
108
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN TRANSIST TO-3 8POS GOLD
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- | Through Hole | Transistor，TO-3 | Closed Frame | Solder | Polyester，Glass Filled | 8 (Oval) | - | Gold | 30μin (0.76μm) | Beryllium Copper | - | Tin | 200μin (5.08μm) | Brass | |||
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|
|
3M |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN ZIG-ZAG 39POS GOLD
|
- | Through Hole | Zig-Zag | Closed Frame | Solder | Polysulfone (PSU)，Glass Filled | 39 (1 x 19，1 x 20) | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper |
