- Series：
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- Operating Temperature：
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- Mounting Type：
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- Type：
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- Termination：
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- Housing Material：
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- Number of Positions or Pins (Grid)：
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- Pitch - Mating：
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- Contact Finish - Mating：
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- Contact Finish Thickness - Mating：
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- Contact Material - Mating：
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- Pitch - Post：
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- Contact Finish - Post：
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- Contact Finish Thickness - Post：
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- Conditions sélectionnées:
Découvrez les produits 4,538
 |
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Operating Temperature | Mounting Type | Type | Termination | Housing Material | Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Operating Temperature | Mounting Type | Type | Termination | Housing Material | Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | |
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|
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ASSMANN WSW Components |
108,884
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 8POS TIN
|
Tube | - | -55°C ~ 85°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Solder | Polybutylene Terephthalate (PBT) | 8 (2 x 4) | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | ||
|
|
|
ASSMANN WSW Components |
81,814
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 14POS TIN
|
Tube | - | -55°C ~ 85°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Solder | Polybutylene Terephthalate (PBT) | 14 (2 x 7) | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | ||
|
|
|
ASSMANN WSW Components |
48,059
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 16POS TIN
|
Tube | - | -55°C ~ 85°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Solder | Polybutylene Terephthalate (PBT) | 16 (2 x 8) | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | ||
|
|
|
ASSMANN WSW Components |
36,980
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 18POS TIN
|
Tube | - | -55°C ~ 85°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Solder | Polybutylene Terephthalate (PBT) | 18 (2 x 9) | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | ||
|
|
|
ASSMANN WSW Components |
45,190
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 20POS TIN
|
Tube | - | -55°C ~ 85°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Solder | Polybutylene Terephthalate (PBT) | 20 (2 x 10) | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | ||
|
|
|
On Shore Technology Inc. |
28,344
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 28POS TIN
|
Tube | ED | -55°C ~ 110°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Solder | Polybutylene Terephthalate (PBT)，Glass Filled | 28 (2 x 14) | 0.100" (2.54mm) | Tin | 60μin (1.52μm) | Phosphor Bronze | 0.100" (2.54mm) | Tin | 60μin (1.52μm) | Phosphor Bronze | ||
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|
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3M |
13,906
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 8POS TIN
|
Tube | 4800 | -25°C ~ 85°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Solder | Polyester，Glass Filled | 8 (2 x 4) | 0.100" (2.54mm) | Tin | 35μin (0.90μm) | Phosphor Bronze | 0.100" (2.54mm) | Tin | 35μin (0.90μm) | Phosphor Bronze | ||
|
|
|
3M |
8,449
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 16POS TIN
|
Tube | 4800 | -25°C ~ 85°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Solder | Polyester，Glass Filled | 16 (2 x 8) | 0.100" (2.54mm) | Tin | 35μin (0.90μm) | Phosphor Bronze | 0.100" (2.54mm) | Tin | 35μin (0.90μm) | Phosphor Bronze | ||
|
|
|
ASSMANN WSW Components |
47,594
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 8POS TIN
|
Tube | - | -40°C ~ 105°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Solder | Thermoplastic，Polyester | 8 (2 x 4) | 0.100" (2.54mm) | Tin | - | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Beryllium Copper | ||
|
|
|
On Shore Technology Inc. |
2,645
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 14POS GOLD
|
Tube | SA | -40°C ~ 105°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Solder | Thermoplastic，Polyester，Glass Filled | 14 (2 x 7) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass | ||
|
|
|
3M |
19,400
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 28POS TIN
|
Tube | 4800 | -25°C ~ 85°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Solder | Polyester，Glass Filled | 28 (2 x 14) | 0.100" (2.54mm) | Tin | 35μin (0.90μm) | Phosphor Bronze | 0.100" (2.54mm) | Tin | 35μin (0.90μm) | Phosphor Bronze | ||
|
|
|
Mill-Max Manufacturing Corp. |
28,542
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 8POS GOLD
|
Tube | 110 | -55°C ~ 125°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 8 (2 x 4) | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass Alloy | ||
|
|
|
On Shore Technology Inc. |
7,780
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 14POS GOLD
|
Tube | SA | -40°C ~ 105°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Solder | Thermoplastic，Polyester，Glass Filled | 14 (2 x 7) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Gold | 80μin (2.03μm) | Brass | ||
|
|
|
Mill-Max Manufacturing Corp. |
8,743
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 6POS GOLD
|
Tube | 110 | -55°C ~ 125°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 6 (2 x 3) | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass Alloy | ||
|
|
|
On Shore Technology Inc. |
6,028
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 16POS GOLD
|
Tube | SA | -40°C ~ 105°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Solder | Thermoplastic，Polyester，Glass Filled | 16 (2 x 8) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass | ||
|
|
|
ASSMANN WSW Components |
8,465
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 14POS TIN
|
Tube | - | -40°C ~ 105°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Solder | Thermoplastic，Polyester | 14 (2 x 7) | 0.100" (2.54mm) | Tin | - | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Beryllium Copper | ||
|
|
|
ASSMANN WSW Components |
16,495
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 16POS TIN
|
Tube | - | -40°C ~ 105°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Solder | Thermoplastic，Polyester | 16 (2 x 8) | 0.100" (2.54mm) | Tin | - | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Beryllium Copper | ||
|
|
|
Mill-Max Manufacturing Corp. |
3,743
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 8POS GOLD
|
Tube | 115 | -55°C ~ 125°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 8 (2 x 4) | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass Alloy | ||
|
|
|
Molex，LLC |
96,800
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN CAM SOCKET 32POS GOLD
|
Tape & Reel (TR) | 105028 | - | Surface Mount | Camera Socket | Solder | Thermoplastic | 32 (4 x 8) | 0.035" (0.90mm) | Gold | 12μin (0.30μm) | Copper Alloy | 0.035" (0.90mm) | Nickel | 50μin (1.27μm) | Copper Alloy | ||
|
|
|
Molex，LLC |
97,189
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN CAM SOCKET 32POS GOLD
|
Cut Tape (CT) | 105028 | - | Surface Mount | Camera Socket | Solder | Thermoplastic | 32 (4 x 8) | 0.035" (0.90mm) | Gold | 12μin (0.30μm) | Copper Alloy | 0.035" (0.90mm) | Nickel | 50μin (1.27μm) | Copper Alloy |
