- Operating Temperature:
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- Mounting Type:
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- Type:
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- Features:
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- Termination:
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- Number of Positions or Pins (Grid):
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- Pitch - Mating:
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- Contact Finish Thickness - Mating:
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- Contact Material - Mating:
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- Pitch - Post:
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- Contact Finish Thickness - Post:
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- Contact Material - Post:
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- Conditions sélectionnées:
Découvrez les produits 95
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Operating Temperature | Mounting Type | Type | Features | Termination | Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | ||
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Operating Temperature | Mounting Type | Type | Features | Termination | Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | ||
ASSMANN WSW Components |
108,884
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 8POS TIN
|
Tube | - | -55°C ~ 85°C | Through Hole | DIP,0.3" (7.62mm) Row Spacing | Open Frame | Solder | 8 (2 x 4) | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | ||||
ASSMANN WSW Components |
81,814
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 14POS TIN
|
Tube | - | -55°C ~ 85°C | Through Hole | DIP,0.3" (7.62mm) Row Spacing | Open Frame | Solder | 14 (2 x 7) | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | ||||
ASSMANN WSW Components |
48,059
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 16POS TIN
|
Tube | - | -55°C ~ 85°C | Through Hole | DIP,0.3" (7.62mm) Row Spacing | Open Frame | Solder | 16 (2 x 8) | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | ||||
ASSMANN WSW Components |
36,980
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 18POS TIN
|
Tube | - | -55°C ~ 85°C | Through Hole | DIP,0.3" (7.62mm) Row Spacing | Open Frame | Solder | 18 (2 x 9) | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | ||||
ASSMANN WSW Components |
45,190
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 20POS TIN
|
Tube | - | -55°C ~ 85°C | Through Hole | DIP,0.3" (7.62mm) Row Spacing | Open Frame | Solder | 20 (2 x 10) | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | ||||
ASSMANN WSW Components |
21,261
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET PLCC 44POS TIN
|
Tube | - | -40°C ~ 105°C | Through Hole | PLCC | Closed Frame | Solder | 44 (4 x 11) | 0.050" (1.27mm) | Tin | 160μin (4.06μm) | Phosphor Bronze | 0.100" (2.54mm) | Tin | 160μin (4.06μm) | Phosphor Bronze | ||||
ASSMANN WSW Components |
11,029
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET PLCC 68POS TIN
|
Tube | - | -40°C ~ 105°C | Through Hole | PLCC | Closed Frame | Solder | 68 (4 x 17) | 0.050" (1.27mm) | Tin | 160μin (4.06μm) | Phosphor Bronze | 0.100" (2.54mm) | Tin | 160μin (4.06μm) | Phosphor Bronze | ||||
ASSMANN WSW Components |
31,632
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 8POS TIN
|
Tube | - | -55°C ~ 85°C | Through Hole | DIP,0.3" (7.62mm) Row Spacing | Open Frame | Solder | 8 (2 x 4) | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | ||||
ASSMANN WSW Components |
10,803
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 6POS TIN
|
Tube | - | -55°C ~ 85°C | Through Hole | DIP,0.3" (7.62mm) Row Spacing | Open Frame | Solder | 6 (2 x 3) | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | ||||
ASSMANN WSW Components |
4,877
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 14POS TIN
|
Tube | - | -55°C ~ 85°C | Through Hole | DIP,0.3" (7.62mm) Row Spacing | Open Frame | Solder | 14 (2 x 7) | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | ||||
ASSMANN WSW Components |
16,375
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 16POS TIN
|
Tube | - | -55°C ~ 85°C | Through Hole | DIP,0.3" (7.62mm) Row Spacing | Open Frame | Solder | 16 (2 x 8) | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | ||||
ASSMANN WSW Components |
2,240
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 18POS TIN
|
Tube | - | -55°C ~ 85°C | Through Hole | DIP,0.3" (7.62mm) Row Spacing | Open Frame | Solder | 18 (2 x 9) | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | ||||
ASSMANN WSW Components |
5,841
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 24POS TIN
|
Tube | - | -55°C ~ 85°C | Through Hole | DIP,0.6" (15.24mm) Row Spacing | Open Frame | Solder | 24 (2 x 12) | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | ||||
CnC Tech |
12,656
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 6POS GOLD
|
Tube | - | -40°C ~ 105°C | Through Hole | DIP,0.3" (7.62mm) Row Spacing | Open Frame | Solder | 6 (2 x 3) | 0.100" (2.54mm) | Gold | - | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass | ||||
ASSMANN WSW Components |
10,713
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 28POS TIN
|
Tube | - | -55°C ~ 85°C | Through Hole | DIP,0.6" (15.24mm) Row Spacing | Open Frame | Solder | 28 (2 x 14) | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | ||||
CnC Tech |
7,305
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 8POS GOLD
|
Tube | - | -40°C ~ 105°C | Through Hole | DIP,0.3" (7.62mm) Row Spacing | Open Frame | Solder | 8 (2 x 4) | 0.100" (2.54mm) | Gold | - | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass | ||||
ASSMANN WSW Components |
4,245
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 20POS TIN
|
Tube | - | -55°C ~ 85°C | Through Hole | DIP,0.3" (7.62mm) Row Spacing | Open Frame | Solder | 20 (2 x 10) | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | ||||
ASSMANN WSW Components |
2,305
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 32POS TIN
|
Tube | - | -55°C ~ 85°C | Through Hole | DIP,0.6" (15.24mm) Row Spacing | Open Frame | Solder | 32 (2 x 16) | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | ||||
ASSMANN WSW Components |
12,892
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 40POS TIN
|
Tube | - | -55°C ~ 85°C | Through Hole | DIP,0.6" (15.24mm) Row Spacing | Open Frame | Solder | 40 (2 x 20) | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | ||||
ASSMANN WSW Components |
5,051
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 40POS TIN
|
Tube | - | -55°C ~ 85°C | Through Hole | DIP,0.6" (15.24mm) Row Spacing | Open Frame | Solder | 40 (2 x 20) | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | 0.100" (2.54mm) | Tin | - | Phosphor Bronze |