- Packaging：
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- Series：
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- Operating Temperature：
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- Mounting Type：
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- Termination：
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- Housing Material：
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- Number of Positions or Pins (Grid)：
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- Pitch - Mating：
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- Contact Finish - Mating：
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- Contact Finish Thickness - Mating：
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- Contact Material - Mating：
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- Contact Finish - Post：
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- Contact Finish Thickness - Post：
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- Contact Material - Post：
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- Conditions sélectionnées:
Découvrez les produits 305
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Operating Temperature | Mounting Type | Termination | Housing Material | Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Operating Temperature | Mounting Type | Termination | Housing Material | Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | |
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Aries Electronics |
269
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET ZIF 28POS TIN
|
Bulk | 55 | - | Through Hole | Solder | Polyphenylene Sulfide (PPS)，Glass Filled | 28 (2 x 14) | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Beryllium Copper | Tin | 200μin (5.08μm) | Beryllium Copper | ||
|
|
|
Aries Electronics |
632
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET ZIF 32POS TIN
|
Bulk | 55 | - | Through Hole | Solder | Polyphenylene Sulfide (PPS)，Glass Filled | 32 (2 x 16) | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Beryllium Copper | Tin | 200μin (5.08μm) | Beryllium Copper | ||
|
|
|
Aries Electronics |
364
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET ZIF 24POS GLD
|
Bulk | 55 | - | Through Hole | Solder | Polyphenylene Sulfide (PPS)，Glass Filled | 24 (2 x 12) | 0.100" (2.54mm) | Gold | - | Beryllium Copper | Gold | - | Beryllium Copper | ||
|
|
|
Aries Electronics |
182
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET ZIF 40POS TIN
|
Bulk | 55 | - | Through Hole | Solder | Polyphenylene Sulfide (PPS)，Glass Filled | 40 (2 x 20) | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Beryllium Copper | Tin | 200μin (5.08μm) | Beryllium Copper | ||
|
|
|
Aries Electronics |
2,051
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET ZIF 28POS GLD
|
Bulk | 55 | - | Through Hole | Solder | Polyphenylene Sulfide (PPS)，Glass Filled | 28 (2 x 14) | 0.100" (2.54mm) | Gold | - | Beryllium Copper | Gold | - | Beryllium Copper | ||
|
|
|
3M |
112
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET ZIF 28POS GLD
|
Bulk | Textool | -55°C ~ 125°C | Connector | Press-Fit | Polysulfone (PSU)，Glass Filled | 28 (2 x 14) | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | Gold | 30μin (0.76μm) | Beryllium Copper | ||
|
|
|
Aries Electronics |
2,009
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET ZIF 48POS GLD
|
Bulk | 55 | - | Through Hole | Solder | Polyphenylene Sulfide (PPS)，Glass Filled | 48 (2 x 24) | 0.100" (2.54mm) | Gold | - | Beryllium Copper | Gold | - | Beryllium Copper | ||
|
|
|
3M |
688
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET ZIF 40POS GLD
|
Bulk | Textool | -55°C ~ 125°C | Connector | Press-Fit | Polysulfone (PSU)，Glass Filled | 40 (2 x 20) | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | Gold | 30μin (0.76μm) | Beryllium Copper | ||
|
|
|
3M |
1,515
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET ZIF 48POS GLD
|
Tube | Textool | -55°C ~ 125°C | Connector | Press-Fit | Polysulfone (PSU)，Glass Filled | 48 (2 x 24) | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | Gold | 30μin (0.76μm) | Beryllium Copper | ||
|
|
|
3M |
193
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET ZIF 32POS GLD
|
Bulk | Textool | -55°C ~ 125°C | Connector | Press-Fit | Polysulfone (PSU)，Glass Filled | 32 (2 x 16) | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | Gold | 30μin (0.76μm) | Beryllium Copper | ||
|
|
|
3M |
249
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET ZIF 40POS GLD
|
Bulk | Textool | -55°C ~ 125°C | Connector | Press-Fit | Polysulfone (PSU)，Glass Filled | 40 (2 x 20) | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | Gold | 30μin (0.76μm) | Beryllium Copper | ||
|
|
|
Aries Electronics |
122
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET ZIF 24POS TIN
|
Bulk | 55 | - | Through Hole | Solder | Polyphenylene Sulfide (PPS)，Glass Filled | 24 (2 x 12) | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Beryllium Copper | Tin | 200μin (5.08μm) | Beryllium Copper | ||
|
|
|
Aries Electronics |
499
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET ZIF 48POS TIN
|
Bulk | 55 | - | Through Hole | Solder | Polyphenylene Sulfide (PPS)，Glass Filled | 48 (2 x 24) | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Beryllium Copper | Tin | 200μin (5.08μm) | Beryllium Copper | ||
|
|
|
3M |
134
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET ZIF 32POS GLD
|
Bulk | Textool | -55°C ~ 125°C | Connector | Press-Fit | Polysulfone (PSU)，Glass Filled | 32 (2 x 16) | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | Gold | 30μin (0.76μm) | Beryllium Copper | ||
|
|
|
3M |
132
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET ZIF 42POS GLD
|
Bulk | Textool | -55°C ~ 125°C | Connector | Press-Fit | Polysulfone (PSU)，Glass Filled | 42 (2 x 21) | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | Gold | 30μin (0.76μm) | Beryllium Copper | ||
|
|
|
3M |
198
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET ZIF 24POS GLD
|
Bulk | Textool | -55°C ~ 125°C | Connector | Press-Fit | Polysulfone (PSU)，Glass Filled | 24 (2 x 12) | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | Gold | 30μin (0.76μm) | Beryllium Copper | ||
|
|
|
Aries Electronics |
160
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET ZIF 24POS
|
Bulk | 55 | - | Through Hole | Solder | Polyphenylene Sulfide (PPS)，Glass Filled | 24 (2 x 12) | 0.100" (2.54mm) | Nickel Boron | 50μin (1.27μm) | Beryllium Copper | Nickel Boron | 50μin (1.27μm) | Beryllium Copper | ||
|
|
|
Aries Electronics |
50
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET ZIF 40POS GLD
|
Bulk | 55 | - | Through Hole | Solder | Polyphenylene Sulfide (PPS)，Glass Filled | 40 (2 x 20) | 0.100" (2.54mm) | Gold | - | Beryllium Copper | Gold | - | Beryllium Copper | ||
|
|
|
3M |
94
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET ZIF 24POS GLD
|
Bulk | Textool | -55°C ~ 125°C | Connector | Press-Fit | Polysulfone (PSU)，Glass Filled | 24 (2 x 12) | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | Gold | 30μin (0.76μm) | Beryllium Copper | ||
|
|
|
3M |
96
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET ZIF 28POS GLD
|
Bulk | Textool | -55°C ~ 125°C | Connector | Press-Fit | Polysulfone (PSU)，Glass Filled | 28 (2 x 14) | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | Gold | 30μin (0.76μm) | Beryllium Copper |
