- Operating Temperature：
-
- Type：
-
- Housing Material：
-
- Number of Positions or Pins (Grid)：
-
- Contact Finish - Mating：
-
- Contact Finish Thickness - Mating：
-
- Contact Material - Mating：
-
- Contact Finish - Post：
-
- Contact Finish Thickness - Post：
-
- Contact Material - Post：
-
- Conditions sélectionnées:
Découvrez les produits 253
 |
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Operating Temperature | Type | Housing Material | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Operating Temperature | Type | Housing Material | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | |
|
|
|
Aries Electronics |
269
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET ZIF 28POS TIN
|
- | DIP，ZIF (ZIP)，0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS)，Glass Filled | 28 (2 x 14) | Tin | 200μin (5.08μm) | Beryllium Copper | Tin | 200μin (5.08μm) | Beryllium Copper | ||
|
|
|
Aries Electronics |
632
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET ZIF 32POS TIN
|
- | DIP，ZIF (ZIP)，0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS)，Glass Filled | 32 (2 x 16) | Tin | 200μin (5.08μm) | Beryllium Copper | Tin | 200μin (5.08μm) | Beryllium Copper | ||
|
|
|
Aries Electronics |
364
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET ZIF 24POS GLD
|
- | DIP，ZIF (ZIP)，0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS)，Glass Filled | 24 (2 x 12) | Gold | - | Beryllium Copper | Gold | - | Beryllium Copper | ||
|
|
|
Aries Electronics |
182
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET ZIF 40POS TIN
|
- | DIP，ZIF (ZIP)，0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS)，Glass Filled | 40 (2 x 20) | Tin | 200μin (5.08μm) | Beryllium Copper | Tin | 200μin (5.08μm) | Beryllium Copper | ||
|
|
|
Aries Electronics |
2,051
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET ZIF 28POS GLD
|
- | DIP，ZIF (ZIP)，0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS)，Glass Filled | 28 (2 x 14) | Gold | - | Beryllium Copper | Gold | - | Beryllium Copper | ||
|
|
|
Aries Electronics |
2,009
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET ZIF 48POS GLD
|
- | DIP，ZIF (ZIP)，0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS)，Glass Filled | 48 (2 x 24) | Gold | - | Beryllium Copper | Gold | - | Beryllium Copper | ||
|
|
|
Aries Electronics |
122
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET ZIF 24POS TIN
|
- | DIP，ZIF (ZIP)，0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS)，Glass Filled | 24 (2 x 12) | Tin | 200μin (5.08μm) | Beryllium Copper | Tin | 200μin (5.08μm) | Beryllium Copper | ||
|
|
|
Aries Electronics |
499
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET ZIF 48POS TIN
|
- | DIP，ZIF (ZIP)，0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS)，Glass Filled | 48 (2 x 24) | Tin | 200μin (5.08μm) | Beryllium Copper | Tin | 200μin (5.08μm) | Beryllium Copper | ||
|
|
|
Aries Electronics |
160
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET ZIF 24POS
|
- | DIP，ZIF (ZIP)，0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS)，Glass Filled | 24 (2 x 12) | Nickel Boron | 50μin (1.27μm) | Beryllium Copper | Nickel Boron | 50μin (1.27μm) | Beryllium Copper | ||
|
|
|
Aries Electronics |
50
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET ZIF 40POS GLD
|
- | DIP，ZIF (ZIP)，0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS)，Glass Filled | 40 (2 x 20) | Gold | - | Beryllium Copper | Gold | - | Beryllium Copper | ||
|
|
|
Aries Electronics |
64
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET ZIF 32POS GLD
|
- | DIP，ZIF (ZIP)，0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS)，Glass Filled | 32 (2 x 16) | Gold | - | Beryllium Copper | Gold | - | Beryllium Copper | ||
|
|
|
Aries Electronics |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET ZIF 24POS TIN
|
- | DIP，ZIF (ZIP)，0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS)，Glass Filled | 24 (2 x 12) | Tin | 200μin (5.08μm) | Beryllium Copper | Tin | 200μin (5.08μm) | Beryllium Copper | ||
|
|
|
Aries Electronics |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET ZIF 24POS TIN
|
- | DIP，ZIF (ZIP)，0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS)，Glass Filled | 24 (2 x 12) | Tin | 200μin (5.08μm) | Beryllium Copper | Tin | 200μin (5.08μm) | Beryllium Copper | ||
|
|
|
Aries Electronics |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET ZIF 24POS TIN
|
- | DIP，ZIF (ZIP)，0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS)，Glass Filled | 24 (2 x 12) | Tin | 200μin (5.08μm) | Beryllium Copper | Tin | 200μin (5.08μm) | Beryllium Copper | ||
|
|
|
Aries Electronics |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET ZIF 24POS TIN
|
- | DIP，ZIF (ZIP)，0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS)，Glass Filled | 24 (2 x 12) | Tin | 200μin (5.08μm) | Beryllium Copper | Tin | 200μin (5.08μm) | Beryllium Copper | ||
|
|
|
Aries Electronics |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET ZIF 24POS TIN
|
- | DIP，ZIF (ZIP)，0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS)，Glass Filled | 24 (2 x 12) | Tin | 200μin (5.08μm) | Beryllium Copper | Tin | 200μin (5.08μm) | Beryllium Copper | ||
|
|
|
Aries Electronics |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET ZIF 24POS TIN
|
- | DIP，ZIF (ZIP)，0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS)，Glass Filled | 24 (2 x 12) | Tin | 200μin (5.08μm) | Beryllium Copper | Tin | 200μin (5.08μm) | Beryllium Copper | ||
|
|
|
Aries Electronics |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET ZIF 28POS TIN
|
- | DIP，ZIF (ZIP)，0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS)，Glass Filled | 28 (2 x 14) | Tin | 200μin (5.08μm) | Beryllium Copper | Tin | 200μin (5.08μm) | Beryllium Copper | ||
|
|
|
Aries Electronics |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET ZIF 28POS TIN
|
- | DIP，ZIF (ZIP)，0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS)，Glass Filled | 28 (2 x 14) | Tin | 200μin (5.08μm) | Beryllium Copper | Tin | 200μin (5.08μm) | Beryllium Copper | ||
|
|
|
Aries Electronics |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET ZIF 28POS TIN
|
- | DIP，ZIF (ZIP)，0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS)，Glass Filled | 28 (2 x 14) | Tin | 200μin (5.08μm) | Beryllium Copper | Tin | 200μin (5.08μm) | Beryllium Copper |
