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- Contact Material - Mating：
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- Conditions sélectionnées:
Découvrez les produits 251
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Operating Temperature | Mounting Type | Type | Features | Termination | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | |
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Operating Temperature | Mounting Type | Type | Features | Termination | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | |
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Aries Electronics |
2,009
|
3 jours |
-
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MOQ: 1 MPQ: 1
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CONN IC DIP SOCKET ZIF 48POS GLD
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Bulk | 55 | - | Through Hole | DIP，ZIF (ZIP)，0.6" (15.24mm) Row Spacing | Closed Frame | Solder | Polyphenylene Sulfide (PPS)，Glass Filled | 0.100" (2.54mm) | Gold | - | Beryllium Copper | 0.100" (2.54mm) | Gold | - | Beryllium Copper | ||
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3M |
1,515
|
3 jours |
-
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MOQ: 1 MPQ: 1
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CONN IC DIP SOCKET ZIF 48POS GLD
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Tube | Textool | -55°C ~ 125°C | Connector | DIP，ZIF (ZIP)，0.6" (15.24mm) Row Spacing | Closed Frame | Press-Fit | Polysulfone (PSU)，Glass Filled | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | ||
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Mill-Max Manufacturing Corp. |
137
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 48POS GOLD
|
Tube | 110 | -55°C ~ 125°C | Through Hole | DIP，0.6" (15.24mm) Row Spacing | Open Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass Alloy | ||
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Aries Electronics |
499
|
3 jours |
-
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MOQ: 1 MPQ: 1
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CONN IC DIP SOCKET ZIF 48POS TIN
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Bulk | 55 | - | Through Hole | DIP，ZIF (ZIP)，0.6" (15.24mm) Row Spacing | Closed Frame | Solder | Polyphenylene Sulfide (PPS)，Glass Filled | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Beryllium Copper | ||
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|
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Mill-Max Manufacturing Corp. |
304
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 48POS GOLD
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Tube | 110 | -55°C ~ 125°C | Through Hole | DIP，0.6" (15.24mm) Row Spacing | Open Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Tin-Lead | 200μin (5.08μm) | Brass Alloy | ||
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Aries Electronics |
225
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 48POS GOLD
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Bulk | 518 | - | Through Hole | DIP，0.6" (15.24mm) Row Spacing | Open Frame | Solder | Polyamide (PA46)，Nylon 4/6，Glass Filled | 0.100" (2.54mm) | Gold | 10μin (0.25μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass | ||
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|
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Mill-Max Manufacturing Corp. |
158
|
3 jours |
-
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MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 48POS GOLD
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Tube | 117 | -55°C ~ 125°C | Through Hole | DIP，0.6" (15.24mm) Row Spacing | Open Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 0.070" (1.78mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.070" (1.78mm) | Tin | 200μin (5.08μm) | Brass Alloy | ||
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TE Connectivity AMP Connectors |
196
|
3 jours |
-
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MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 48POS GOLD
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Tube | 800 | -55°C ~ 105°C | Through Hole | DIP，0.6" (15.24mm) Row Spacing | Open Frame | Solder | Polyester | 0.100" (2.54mm) | Gold | 25μin (0.63μm) | Copper Alloy | 0.100" (2.54mm) | - | - | Copper Alloy | ||
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3M |
541
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 48POS TIN
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Tube | 4800 | -25°C ~ 85°C | Through Hole | DIP，0.6" (15.24mm) Row Spacing | Open Frame | Solder | Polyester，Glass Filled | 0.100" (2.54mm) | Tin | 35μin (0.90μm) | Phosphor Bronze | 0.100" (2.54mm) | Tin | 35μin (0.90μm) | Phosphor Bronze | ||
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3M |
410
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3 jours |
-
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MOQ: 1 MPQ: 1
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CONN IC DIP SOCKET 48POS TIN
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Tube | 4800 | -25°C ~ 85°C | Through Hole | DIP，0.6" (15.24mm) Row Spacing | Open Frame | Solder | Polyester，Glass Filled | 0.100" (2.54mm) | Tin | 35μin (0.90μm) | Phosphor Bronze | 0.100" (2.54mm) | Tin | 35μin (0.90μm) | Phosphor Bronze | ||
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On Shore Technology Inc. |
121
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 48POS GOLD
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Tube | SA | -40°C ~ 105°C | Through Hole | DIP，0.6" (15.24mm) Row Spacing | Open Frame | Solder | Thermoplastic，Polyester，Glass Filled | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass | ||
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|
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Mill-Max Manufacturing Corp. |
442
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 48POS TIN
|
Tube | 110 | -55°C ~ 125°C | Through Hole | DIP，0.6" (15.24mm) Row Spacing | Open Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 0.100" (2.54mm) | Tin | 100μin (2.54μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass Alloy | ||
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ASSMANN WSW Components |
38
|
3 jours |
-
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MOQ: 1 MPQ: 1
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CONN IC DIP SOCKET 48POS TIN
|
Tube | - | -40°C ~ 105°C | Through Hole | DIP，0.6" (15.24mm) Row Spacing | Open Frame | Solder | Thermoplastic，Polyester | 0.100" (2.54mm) | Tin | - | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Beryllium Copper | ||
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|
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Mill-Max Manufacturing Corp. |
86
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 48POS GOLD
|
Tube | 117 | -55°C ~ 125°C | Through Hole | DIP，0.4" (10.16mm) Row Spacing | Open Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 0.070" (1.78mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.070" (1.78mm) | Tin-Lead | 200μin (5.08μm) | Brass Alloy | ||
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|
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ASSMANN WSW Components |
73
|
3 jours |
-
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MOQ: 1 MPQ: 1
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CONN IC DIP SOCKET 48POS GOLD
|
Tube | - | -40°C ~ 105°C | Through Hole | DIP，0.6" (15.24mm) Row Spacing | Open Frame | Solder | Thermoplastic，Polyester | 0.100" (2.54mm) | Gold | 10μin (0.25μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Beryllium Copper | ||
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Mill-Max Manufacturing Corp. |
47
|
3 jours |
-
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MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 48POS GOLD
|
Tube | 115 | -55°C ~ 125°C | Through Hole | DIP，0.6" (15.24mm) Row Spacing | Open Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass Alloy | ||
|
|
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Mill-Max Manufacturing Corp. |
34
|
3 jours |
-
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MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 48POS GOLD
|
Tube | 110 | -55°C ~ 125°C | Surface Mount | DIP，0.6" (15.24mm) Row Spacing | Open Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Tin-Lead | 200μin (5.08μm) | Brass Alloy | ||
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|
|
On Shore Technology Inc. |
19
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 48POS GOLD
|
Tube | SA | -40°C ~ 105°C | Through Hole | DIP，0.6" (15.24mm) Row Spacing | Open Frame | Solder | Thermoplastic，Polyester，Glass Filled | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Tin | 80μin (2.03μm) | Brass | ||
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|
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Mill-Max Manufacturing Corp. |
15
|
3 jours |
-
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MOQ: 1 MPQ: 1
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CONN IC DIP SOCKET 48POS TINLEAD
|
Tube | 110 | -55°C ~ 125°C | Through Hole | DIP，0.6" (15.24mm) Row Spacing | Open Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 0.100" (2.54mm) | Tin-Lead | 200μin (5.08μm) | Beryllium Copper | 0.100" (2.54mm) | Tin-Lead | 200μin (5.08μm) | Brass Alloy | ||
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Mill-Max Manufacturing Corp. |
Enquête
|
- |
-
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MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 48POS GOLD
|
Tube | 115 | -55°C ~ 125°C | Through Hole | DIP，0.6" (15.24mm) Row Spacing | Open Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Tin-Lead | 200μin (5.08μm) | Brass Alloy |
