- Mounting Type：
-
- Features：
-
- Housing Material：
-
- Number of Positions or Pins (Grid)：
-
- Pitch - Mating：
-
- Contact Finish - Mating：
-
- Contact Material - Mating：
-
- Pitch - Post：
-
- Contact Finish - Post：
-
- Contact Finish Thickness - Post：
-
- Conditions sélectionnées:
Découvrez les produits 2
 |
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Series | Mounting Type | Type | Features | Housing Material | Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Material - Mating | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Series | Mounting Type | Type | Features | Housing Material | Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Material - Mating | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | |
|
|
|
Molex，LLC |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET LGA 1366POS NICKEL
|
47594 | Surface Mount | LGA | Closed Frame | - | 1366 (32 x 41) | - | Nickel | - | - | Nickel | 3μin (0.08μm) | - | ||
|
|
TE Connectivity AMP Connectors |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 16POS TINLEAD
|
- | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Closed Frame，Elevated | Thermoplastic，Polyester，Glass Filled | 16 (2 x 8) | 0.100" (2.54mm) | Tin-Lead | Beryllium Copper | 0.100" (2.54mm) | Tin-Lead | 5μin (0.13μm) | Brass |
