- Series：
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- Operating Temperature：
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- Type：
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- Features：
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- Termination：
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- Housing Material：
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- Contact Finish Thickness - Mating：
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- Contact Finish Thickness - Post：
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- Contact Material - Post：
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- Conditions sélectionnées:
Découvrez les produits 11
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Series | Operating Temperature | Type | Features | Termination | Housing Material | Contact Finish Thickness - Mating | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Series | Operating Temperature | Type | Features | Termination | Housing Material | Contact Finish Thickness - Mating | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | |
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Mill-Max Manufacturing Corp. |
Enquête
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- |
-
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MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 60POS GOLD
|
714 | -55°C ~ 125°C | DIP，0.1" (2.54mm) Row Spacing | Closed Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 30μin (0.76μm) | Gold | 30μin (0.76μm) | Brass Alloy | ||
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Aries Electronics |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 60POS GOLD
|
Lo-PROfile，513 | - | DIP，0.9" (22.86mm) Row Spacing | Closed Frame | Solder | Polyamide (PA46)，Nylon 4/6，Glass Filled | 10μin (0.25μm) | Tin | 200μin (5.08μm) | Brass | ||
|
|
|
Aries Electronics |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 60POS GOLD
|
Lo-PROfile，513 | - | DIP，0.9" (22.86mm) Row Spacing | Closed Frame | Solder | Polyamide (PA46)，Nylon 4/6，Glass Filled | 10μin (0.25μm) | Tin | 200μin (5.08μm) | Brass | ||
|
|
|
Aries Electronics |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 60POS GOLD
|
Lo-PROfile，513 | - | DIP，0.9" (22.86mm) Row Spacing | Closed Frame | Solder | Polyamide (PA46)，Nylon 4/6，Glass Filled | 10μin (0.25μm) | Gold | 10μin (0.25μm) | Brass | ||
|
|
|
Aries Electronics |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 60POS GOLD
|
Lo-PROfile，513 | - | DIP，0.9" (22.86mm) Row Spacing | Closed Frame | Solder | Polyamide (PA46)，Nylon 4/6，Glass Filled | 10μin (0.25μm) | Tin | 200μin (5.08μm) | Brass | ||
|
|
|
Aries Electronics |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 60POS GOLD
|
Lo-PROfile，513 | - | DIP，0.9" (22.86mm) Row Spacing | Closed Frame | Solder | Polyamide (PA46)，Nylon 4/6，Glass Filled | 10μin (0.25μm) | Gold | 10μin (0.25μm) | Brass | ||
|
|
|
Aries Electronics |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 60POS GOLD
|
503 | -55°C ~ 105°C | DIP，0.9" (22.86mm) Row Spacing | Closed Frame | Wire Wrap | Polyamide (PA46)，Nylon 4/6，Glass Filled | 10μin (0.25μm) | Tin | 200μin (5.08μm) | Phosphor Bronze | ||
|
|
|
Aries Electronics |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 60POS GOLD
|
503 | -55°C ~ 105°C | DIP，0.9" (22.86mm) Row Spacing | Closed Frame | Wire Wrap | Polyamide (PA46)，Nylon 4/6，Glass Filled | 10μin (0.25μm) | Tin | 200μin (5.08μm) | Phosphor Bronze | ||
|
|
|
Aries Electronics |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 60POS GOLD
|
503 | -55°C ~ 125°C | DIP，0.9" (22.86mm) Row Spacing | Closed Frame | Wire Wrap | Polyamide (PA46)，Nylon 4/6，Glass Filled | 10μin (0.25μm) | Gold | 10μin (0.25μm) | Phosphor Bronze | ||
|
|
|
Aries Electronics |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 60POS GOLD
|
503 | -55°C ~ 125°C | DIP，0.9" (22.86mm) Row Spacing | Closed Frame | Wire Wrap | Polyamide (PA46)，Nylon 4/6，Glass Filled | 10μin (0.25μm) | Gold | 10μin (0.25μm) | Phosphor Bronze | ||
|
|
|
Aries Electronics |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 60POS GOLD
|
518 | - | DIP，0.2" (5.08mm) Row Spacing | Open Frame | Solder | Polyamide (PA46)，Nylon 4/6，Glass Filled | 10μin (0.25μm) | Tin | 200μin (5.08μm) | Brass |
