- Operating Temperature：
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- Type：
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- Number of Positions or Pins (Grid)：
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- Contact Finish - Mating：
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- Contact Finish Thickness - Mating：
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- Contact Material - Mating：
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- Contact Finish - Post：
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- Contact Finish Thickness - Post：
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- Contact Material - Post：
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- Conditions sélectionnées:
Découvrez les produits 285
 |
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Operating Temperature | Mounting Type | Type | Housing Material | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Operating Temperature | Mounting Type | Type | Housing Material | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | |
|
|
|
Aries Electronics |
660
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 10POS GOLD
|
- | Through Hole，Right Angle，Vertical | DIP，0.2" (5.08mm) Row Spacing | Polyamide (PA46)，Nylon 4/6，Glass Filled | 10 (2 x 5) | Gold | 30μin (0.76μm) | Beryllium Copper | Tin | 200μin (5.08μm) | Brass | ||
|
|
|
Aries Electronics |
104
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 14POS GOLD
|
- | Through Hole，Right Angle，Vertical | DIP，0.3" (7.62mm) Row Spacing | Polyamide (PA46)，Nylon 4/6 | 14 (2 x 7) | Gold | 10μin (0.25μm) | Phosphor Bronze | Gold | 10μin (0.25μm) | Phosphor Bronze | ||
|
|
|
Aries Electronics |
472
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 10POS GOLD
|
- | Through Hole，Right Angle，Vertical | DIP，0.3" (7.62mm) Row Spacing | Polyamide (PA46)，Nylon 4/6，Glass Filled | 10 (2 x 5) | Gold | 30μin (0.76μm) | Beryllium Copper | Tin | 200μin (5.08μm) | Brass | ||
|
|
|
Aries Electronics |
268
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 10POS TIN
|
- | Through Hole，Right Angle，Horizontal | DIP，0.2" (5.08mm) Row Spacing | Polyamide (PA46)，Nylon 4/6 | 10 (2 x 5) | Tin | 200μin (5.08μm) | Phosphor Bronze | Tin | 200μin (5.08μm) | Phosphor Bronze | ||
|
|
|
Aries Electronics |
588
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 10POS GOLD
|
-55°C ~ 105°C | Through Hole，Right Angle，Horizontal | DIP，0.2" (5.08mm) Row Spacing | Polyamide (PA46)，Nylon 4/6，Glass Filled | 10 (2 x 5) | Gold | 30μin (0.76μm) | Beryllium Copper | Tin | 200μin (5.08μm) | Brass | ||
|
|
|
Aries Electronics |
1,326
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 10POS GOLD
|
-55°C ~ 105°C | Through Hole，Right Angle，Horizontal | DIP，0.4" (10.16mm) Row Spacing | Polyamide (PA46)，Nylon 4/6，Glass Filled | 10 (2 x 5) | Gold | 30μin (0.76μm) | Beryllium Copper | Tin | 200μin (5.08μm) | Brass | ||
|
|
|
Aries Electronics |
4,093
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 10POS TIN
|
- | Through Hole，Right Angle，Vertical | DIP，0.2" (5.08mm) Row Spacing | Polyamide (PA46)，Nylon 4/6 | 10 (2 x 5) | Tin | 200μin (5.08μm) | Phosphor Bronze | Tin | 200μin (5.08μm) | Phosphor Bronze | ||
|
|
|
Aries Electronics |
1,020
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 14POS TIN
|
- | Through Hole，Right Angle，Horizontal | DIP，0.3" (7.62mm) Row Spacing | Polyamide (PA46)，Nylon 4/6 | 14 (2 x 7) | Tin | 200μin (5.08μm) | Phosphor Bronze | Tin | 200μin (5.08μm) | Phosphor Bronze | ||
|
|
|
Aries Electronics |
127
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 16POS GOLD
|
- | Through Hole，Right Angle，Horizontal | DIP，0.3" (7.62mm) Row Spacing | Polyamide (PA46)，Nylon 4/6 | 16 (2 x 8) | Gold | 10μin (0.25μm) | Phosphor Bronze | Gold | 10μin (0.25μm) | Phosphor Bronze | ||
|
|
|
Aries Electronics |
1,234
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 10POS GOLD
|
- | Through Hole，Right Angle，Vertical | DIP，0.2" (5.08mm) Row Spacing | Polyamide (PA46)，Nylon 4/6 | 10 (2 x 5) | Gold | 10μin (0.25μm) | Phosphor Bronze | Gold | 10μin (0.25μm) | Phosphor Bronze | ||
|
|
|
Aries Electronics |
135
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 16POS GOLD
|
- | Through Hole，Right Angle，Vertical | DIP，0.3" (7.62mm) Row Spacing | Polyamide (PA46)，Nylon 4/6，Glass Filled | 16 (2 x 8) | Gold | 30μin (0.76μm) | Beryllium Copper | Tin | 200μin (5.08μm) | Brass | ||
|
|
|
Aries Electronics |
453
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 12POS GOLD
|
- | Through Hole，Right Angle，Vertical | DIP，0.6" (15.24mm) Row Spacing | Polyamide (PA46)，Nylon 4/6，Glass Filled | 12 (2 x 6) | Gold | 30μin (0.76μm) | Beryllium Copper | Tin | 200μin (5.08μm) | Brass | ||
|
|
|
Aries Electronics |
929
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 18POS TIN
|
- | Through Hole，Right Angle，Vertical | DIP，0.6" (15.24mm) Row Spacing | Polyamide (PA46)，Nylon 4/6 | 18 (2 x 9) | Tin | 200μin (5.08μm) | Phosphor Bronze | Tin | 200μin (5.08μm) | Phosphor Bronze | ||
|
|
|
Aries Electronics |
177
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 12POS GOLD
|
- | Through Hole，Right Angle，Vertical | DIP，0.3" (7.62mm) Row Spacing | Polyamide (PA46)，Nylon 4/6，Glass Filled | 12 (2 x 6) | Gold | 30μin (0.76μm) | Beryllium Copper | Tin | 200μin (5.08μm) | Brass | ||
|
|
|
Aries Electronics |
178
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 16POS GOLD
|
-55°C ~ 105°C | Through Hole，Right Angle，Horizontal | DIP，0.2" (5.08mm) Row Spacing | Polyamide (PA46)，Nylon 4/6，Glass Filled | 16 (2 x 8) | Gold | 30μin (0.76μm) | Beryllium Copper | Tin | 200μin (5.08μm) | Brass | ||
|
|
|
Aries Electronics |
111
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 18POS GOLD
|
- | Through Hole，Right Angle，Horizontal | DIP，0.6" (15.24mm) Row Spacing | Polyamide (PA46)，Nylon 4/6 | 18 (2 x 9) | Gold | 10μin (0.25μm) | Phosphor Bronze | Gold | 10μin (0.25μm) | Phosphor Bronze | ||
|
|
|
Aries Electronics |
75
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 8POS GOLD
|
- | Through Hole，Right Angle，Horizontal | DIP，0.3" (7.62mm) Row Spacing | Polyamide (PA46)，Nylon 4/6 | 8 (2 x 4) | Gold | 10μin (0.25μm) | Phosphor Bronze | Gold | 10μin (0.25μm) | Phosphor Bronze | ||
|
|
|
Aries Electronics |
35
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 8POS GOLD
|
- | Through Hole，Right Angle，Vertical | DIP，0.3" (7.62mm) Row Spacing | Polyamide (PA46)，Nylon 4/6 | 8 (2 x 4) | Gold | 10μin (0.25μm) | Phosphor Bronze | Gold | 10μin (0.25μm) | Phosphor Bronze | ||
|
|
|
Aries Electronics |
39
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 12POS GOLD
|
-55°C ~ 105°C | Through Hole，Right Angle，Horizontal | DIP，0.3" (7.62mm) Row Spacing | Polyamide (PA46)，Nylon 4/6，Glass Filled | 12 (2 x 6) | Gold | 30μin (0.76μm) | Beryllium Copper | Tin | 200μin (5.08μm) | Brass | ||
|
|
|
Aries Electronics |
27
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 10POS GOLD
|
- | Through Hole，Right Angle，Horizontal | DIP，0.2" (5.08mm) Row Spacing | Polyamide (PA46)，Nylon 4/6 | 10 (2 x 5) | Gold | 10μin (0.25μm) | Phosphor Bronze | Gold | 10μin (0.25μm) | Phosphor Bronze |
