- Operating Temperature：
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- Mounting Type：
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- Type：
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- Features：
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- Termination：
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- Housing Material：
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- Pitch - Mating：
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- Contact Finish - Mating：
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- Contact Finish Thickness - Mating：
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- Contact Material - Mating：
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- Pitch - Post：
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- Contact Finish - Post：
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- Contact Finish Thickness - Post：
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- Contact Material - Post：
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- Conditions sélectionnées:
Découvrez les produits 87
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Operating Temperature | Mounting Type | Type | Features | Termination | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Operating Temperature | Mounting Type | Type | Features | Termination | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | |
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Aries Electronics |
16
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3 jours |
-
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MOQ: 1 MPQ: 1
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CONN SOCKET SOIC ZIF 44POS GOLD
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Bulk | 547 | - | Through Hole | SOIC，ZIF (ZIP) | Closed Frame | Solder | Polyphenylene Sulfide (PPS)，Glass Filled | - | Gold | 20μin (0.51μm) | Beryllium Copper | 0.050" (1.27mm) | Gold | 20μin (0.51μm) | Beryllium Copper | ||
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|
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Aries Electronics |
8
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3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET SOIC ZIF 44POS GOLD
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Bulk | 547 | - | Through Hole | SOIC，ZIF (ZIP) | Closed Frame | Solder | Polyphenylene Sulfide (PPS)，Glass Filled | - | Gold | 20μin (0.51μm) | Beryllium Copper | 0.050" (1.27mm) | Gold | 20μin (0.51μm) | Beryllium Copper | ||
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On Shore Technology Inc. |
Enquête
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- |
-
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MOQ: 1 MPQ: 1
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CONN SOCKET PLCC 44POS
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Tube | ED | -55°C ~ 105°C | Surface Mount | PLCC | Closed Frame | Solder | Polyphenylene Sulfide (PPS) | 0.050" (1.27mm) | - | - | Phosphor Bronze | 0.050" (1.27mm) | - | - | Phosphor Bronze | ||
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On Shore Technology Inc. |
Enquête
|
- |
-
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MOQ: 1 MPQ: 1
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CONN SOCKET PLCC 44POS TIN
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Tube | ED | -55°C ~ 105°C | Through Hole | PLCC | Closed Frame | Solder | Polybutylene Terephthalate (PBT) | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | ||
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Mill-Max Manufacturing Corp. |
Enquête
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- |
-
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MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 44POS GOLD
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Bulk | 714 | -55°C ~ 125°C | Through Hole | DIP，0.1" (2.54mm) Row Spacing | Closed Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Brass Alloy | ||
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Aries Electronics |
Enquête
|
- |
-
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MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 44POS GOLD
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Bulk | 518 | - | Through Hole | DIP，0.2" (5.08mm) Row Spacing | Open Frame | Solder | Polyamide (PA46)，Nylon 4/6，Glass Filled | 0.100" (2.54mm) | Gold | 10μin (0.25μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass | ||
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Aries Electronics |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 44POS GOLD
|
Bulk | 518 | - | Through Hole | DIP，0.2" (5.08mm) Row Spacing | Open Frame | Solder | Polyamide (PA46)，Nylon 4/6，Glass Filled | 0.100" (2.54mm) | Gold | 10μin (0.25μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass | ||
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|
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Aries Electronics |
Enquête
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- |
-
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MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET ZIF 44POS TIN
|
Bulk | 55 | - | Through Hole | DIP，ZIF (ZIP)，0.3" (7.62mm) Row Spacing | Closed Frame | Solder | Polyphenylene Sulfide (PPS)，Glass Filled | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Beryllium Copper | ||
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|
|
Aries Electronics |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET ZIF 44POS TIN
|
Bulk | 55 | - | Through Hole | DIP，ZIF (ZIP)，0.3" (7.62mm) Row Spacing | Closed Frame | Solder | Polyphenylene Sulfide (PPS)，Glass Filled | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Beryllium Copper | ||
|
|
|
Aries Electronics |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET ZIF 44POS TIN
|
Bulk | 55 | - | Through Hole | DIP，ZIF (ZIP)，0.3" (7.62mm) Row Spacing | Closed Frame | Solder | Polyphenylene Sulfide (PPS)，Glass Filled | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Beryllium Copper | ||
|
|
|
Aries Electronics |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET ZIF 44POS TIN
|
Bulk | 55 | - | Through Hole | DIP，ZIF (ZIP)，0.6" (15.24mm) Row Spacing | Closed Frame | Solder | Polyphenylene Sulfide (PPS)，Glass Filled | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Beryllium Copper | ||
|
|
|
Aries Electronics |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET ZIF 44POS TIN
|
Bulk | 55 | - | Through Hole | DIP，ZIF (ZIP)，0.6" (15.24mm) Row Spacing | Closed Frame | Solder | Polyphenylene Sulfide (PPS)，Glass Filled | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Beryllium Copper | ||
|
|
|
Aries Electronics |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET ZIF 44POS TIN
|
Bulk | 55 | - | Through Hole | DIP，ZIF (ZIP)，0.6" (15.24mm) Row Spacing | Closed Frame | Solder | Polyphenylene Sulfide (PPS)，Glass Filled | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Beryllium Copper | ||
|
|
|
Aries Electronics |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 44POS GOLD
|
Bulk | 6556 | - | Through Hole | DIP，0.6" (15.24mm) Row Spacing | Open Frame | Solder | Polyphenylene Sulfide (PPS)，Glass Filled | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass | ||
|
|
|
Aries Electronics |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET ZIF 44POS TIN
|
Bulk | 55 | - | Through Hole | DIP，ZIF (ZIP)，0.3" (7.62mm) Row Spacing | Closed Frame | Solder | Polyphenylene Sulfide (PPS)，Glass Filled | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Beryllium Copper | ||
|
|
|
Aries Electronics |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET ZIF 44POS TIN
|
Bulk | 55 | - | Through Hole | DIP，ZIF (ZIP)，0.6" (15.24mm) Row Spacing | Closed Frame | Solder | Polyphenylene Sulfide (PPS)，Glass Filled | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Beryllium Copper | ||
|
|
|
Aries Electronics |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 44POS GOLD
|
Bulk | 6556 | - | Through Hole | DIP，0.6" (15.24mm) Row Spacing | Open Frame | Wire Wrap | Polyphenylene Sulfide (PPS)，Glass Filled | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass | ||
|
|
|
Aries Electronics |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 44POS GOLD
|
Bulk | 6556 | - | Through Hole | DIP，0.6" (15.24mm) Row Spacing | Open Frame | Wire Wrap | Polyphenylene Sulfide (PPS)，Glass Filled | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass | ||
|
|
|
Aries Electronics |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 44POS GOLD
|
Bulk | 6556 | - | Through Hole | DIP，0.6" (15.24mm) Row Spacing | Open Frame | Solder | Polyphenylene Sulfide (PPS)，Glass Filled | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Gold | 10μin (0.25μm) | Brass | ||
|
|
|
Aries Electronics |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET ZIF 44POS TIN
|
Bulk | 57 | - | Through Hole | DIP，ZIF (ZIP)，0.3" (7.62mm) Row Spacing | Closed Frame | Solder | Polyphenylene Sulfide (PPS)，Glass Filled | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Beryllium Copper |
