- Mounting Type：
-
- Features：
-
- Termination：
-
- Housing Material：
-
- Pitch - Mating：
-
- Contact Finish - Mating：
-
- Contact Finish Thickness - Mating：
-
- Contact Material - Mating：
-
- Pitch - Post：
-
- Contact Finish - Post：
-
- Contact Finish Thickness - Post：
-
- Contact Material - Post：
-
- Conditions sélectionnées:
Découvrez les produits 7
 |
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Mounting Type | Features | Termination | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Mounting Type | Features | Termination | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | |
|
|
|
Molex，LLC |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET LGA 1366POS NICKEL
|
- | 47594 | Surface Mount | Closed Frame | Solder | - | - | Nickel | 3μin (0.08μm) | - | - | Nickel | 3μin (0.08μm) | - | ||
|
|
|
Molex，LLC |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET LGA 1366POS GOLD
|
Tray | 47594 | Surface Mount | Open Frame | Solder | Liquid Crystal Polymer (LCP) | 0.040" (1.02mm) | Gold | 15μin (0.38μm) | Copper Alloy | 0.040" (1.01mm) | - | - | - | ||
|
|
|
Molex，LLC |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET LGA 1366POS GOLD
|
Tray | 47594 | Surface Mount | Open Frame | Solder | Liquid Crystal Polymer (LCP) | 0.040" (1.02mm) | Gold | 30μin (0.76μm) | Copper Alloy | 0.040" (1.01mm) | - | - | - | ||
|
|
TE Connectivity AMP Connectors |
101
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET LGA 1366POS GOLD
|
Tray | - | Surface Mount | Open Frame | Solder | Thermoplastic | 0.040" (1.02mm) | Gold | 15μin (0.38μm) | Copper Alloy | 0.040" (1.01mm) | - | - | Copper Alloy | |||
|
|
TE Connectivity AMP Connectors |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET LGA 1366POS
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - | |||
|
|
TE Connectivity AMP Connectors |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET LGA 1366POS GOLD
|
Tray | - | Surface Mount | Open Frame | Solder | Thermoplastic | 0.040" (1.02mm) | Gold | 30μin (0.76μm) | Copper Alloy | 0.040" (1.01mm) | - | - | Copper Alloy | |||
|
|
TE Connectivity AMP Connectors |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET LGA 1366POS GOLD
|
Tray | - | Surface Mount | Open Frame | Solder | Thermoplastic | 0.040" (1.02mm) | Gold | 30μin (0.76μm) | Copper Alloy | 0.040" (1.01mm) | - | - | - |
