- Fabricant：
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- Packaging：
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- Operating Temperature：
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- Mounting Type：
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- Type：
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- Features：
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- Termination：
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- Housing Material：
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- Number of Positions or Pins (Grid)：
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- Pitch - Mating：
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- Contact Finish - Mating：
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- Contact Finish Thickness - Mating：
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- Contact Material - Mating：
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- Contact Finish - Post：
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- Contact Finish Thickness - Post：
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- Conditions sélectionnées:
Découvrez les produits 17,050
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Operating Temperature | Mounting Type | Type | Features | Termination | Housing Material | Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | |
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Operating Temperature | Mounting Type | Type | Features | Termination | Housing Material | Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | |
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Mill-Max Manufacturing Corp. |
1,065
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN TRANSIST TO-5 4POS GOLD
|
Tube | 917 | -55°C ~ 125°C | Through Hole | Transistor，TO-5 | Closed Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 4 (Round) | - | Gold | 30μin (0.76μm) | Beryllium Copper | Tin | 200μin (5.08μm) | Brass Alloy | ||
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|
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Sullins Connector Solutions |
829
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET TRANSIST 3POS GOLD
|
Bulk | - | -55°C ~ 175°C | Through Hole | Transistor | Board Guide | Solder | Polyphenylene Sulfide (PPS) | 3 (Rectangular) | - | Gold | 30μin (0.76μm) | Beryllium Copper | Gold | 30μin (0.76μm) | Beryllium Copper | ||
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|
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3M |
683
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET SOIC 8POS GOLD
|
Bulk | Textool | -55°C ~ 150°C | Through Hole | SOIC | Closed Frame | Solder | Polyethersulfone (PES)，Glass Filled | 8 (2 x 4) | - | Gold | 30μin (0.76μm) | Beryllium Copper | Gold | 30μin (0.76μm) | Beryllium Copper | ||
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3M |
337
|
3 jours |
-
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MOQ: 1 MPQ: 1
|
CONN SOCKET SOIC 16POS GOLD
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Bulk | Textool | -55°C ~ 150°C | Through Hole | SOIC | Closed Frame | Solder | Polyethersulfone (PES)，Glass Filled | 16 (2 x 8) | - | Gold | - | Beryllium Copper | Gold | 30μin (0.76μm) | Beryllium Copper | ||
|
|
|
Apex Microtechnology |
999
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN TRANSIST TO-3 8POS GOLD
|
Bulk | Apex Precision Power | - | Through Hole | Transistor，TO-3 | Closed Frame | Solder | Polyester，Glass Filled | 8 (Oval) | - | Gold | 30μin (0.76μm) | Beryllium Copper | Tin | 200μin (5.08μm) | Brass | ||
|
|
|
Mill-Max Manufacturing Corp. |
2,068
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN TRANSIST TO-5 3POS GOLD
|
Tube | 917 | -55°C ~ 125°C | Through Hole | Transistor，TO-5 | Closed Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 3 (Round) | - | Gold | 30μin (0.76μm) | Beryllium Copper | Tin-Lead | 200μin (5.08μm) | Brass Alloy | ||
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|
|
Mill-Max Manufacturing Corp. |
1,622
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN TRANSIST TO-5 3POS GOLD
|
Tube | 917 | -55°C ~ 125°C | Surface Mount | Transistor，TO-5 | Closed Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 3 (Round) | - | Gold | 30μin (0.76μm) | Beryllium Copper | Tin | 200μin (5.08μm) | Brass Alloy | ||
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|
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Mill-Max Manufacturing Corp. |
3,220
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN TRANSIST TO-5 3POS GOLD
|
Tube | 917 | -55°C ~ 125°C | Through Hole | Transistor，TO-5 | Closed Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 3 (Round) | - | Gold | 30μin (0.76μm) | Beryllium Copper | Tin | 200μin (5.08μm) | Brass Alloy | ||
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|
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Mill-Max Manufacturing Corp. |
1,176
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN TRANSIST TO-5 8POS GOLD
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Tube | 917 | -55°C ~ 125°C | Through Hole | Transistor，TO-5 | Closed Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 8 (Round) | - | Gold | 30μin (0.76μm) | Beryllium Copper | Tin | 200μin (5.08μm) | Brass Alloy | ||
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TE Connectivity AMP Connectors |
1,077
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN TRANSIST TO-5 3POS GOLD
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Bulk | 8058 | -55°C ~ 125°C | Through Hole | Transistor，TO-5 | Closed Frame | Solder | Polytetrafluoroethylene (PTFE) | 3 (Round) | - | Gold | - | Beryllium Copper | Gold | - | Brass | ||
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TE Connectivity AMP Connectors |
378
|
3 jours |
-
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MOQ: 1 MPQ: 1
|
CONN TRANSIST TO-5 4POS GOLD
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Bulk | 8058 | -55°C ~ 125°C | Panel Mount | Transistor，TO-5 | - | Solder Cup | Polytetrafluoroethylene (PTFE) | 4 (Round) | - | Gold | - | Beryllium Copper | Gold | - | Brass | ||
|
|
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Sullins Connector Solutions |
144
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET TRANSIST 3POS GOLD
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Bulk | - | -55°C ~ 175°C | Through Hole | Transistor | Board Guide，Flange | Solder | Polyphenylene Sulfide (PPS) | 3 (Rectangular) | - | Gold | 30μin (0.76μm) | Beryllium Copper | Gold | 30μin (0.76μm) | Beryllium Copper | ||
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|
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Sullins Connector Solutions |
103
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN TRANSIST TO-220/TO-247 5POS
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Bulk | - | -65°C ~ 175°C | Through Hole | Transistor，TO-220 and TO-247 | - | Solder | Polyphenylene Sulfide (PPS) | 5 (Rectangular) | - | Gold | 30μin (0.76μm) | Beryllium Copper | Gold | 30μin (0.76μm) | Beryllium Copper | ||
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3M |
198
|
3 jours |
-
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MOQ: 1 MPQ: 1
|
CONN SOCKET SOIC 28POS GOLD
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Bulk | Textool | -55°C ~ 150°C | Through Hole | SOIC | Closed Frame | Solder | Polyethersulfone (PES)，Glass Filled | 28 (2 x 14) | - | Gold | - | Beryllium Copper | Gold | 30μin (0.76μm) | Beryllium Copper | ||
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3M |
63
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET QFN 48POS GOLD
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Bulk | Textool | - | Through Hole | QFN | Closed Frame | Solder | Polyethersulfone (PES) | 48 (4 x 12) | 0.016" (0.40mm) | Gold | - | Beryllium Copper | Gold | - | Beryllium Copper | ||
|
|
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TE Connectivity AMP Connectors |
359
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN TRANSIST TO-5 8POS GOLD
|
Bulk | 8058 | -55°C ~ 125°C | Through Hole | Transistor，TO-5 | Closed Frame | Solder | Polytetrafluoroethylene (PTFE) | 8 (Round) | - | Gold | - | Beryllium Copper | Gold | - | Brass | ||
|
|
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TE Connectivity AMP Connectors |
287
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN TRANSIST TO-3 4POS GOLD
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Bulk | 8080 | -55°C ~ 125°C | Through Hole | Transistor，TO-3 | Closed Frame | Solder | Fluoropolymer (FP) | 4 (Round) | - | Gold | - | Beryllium Copper | Gold | - | Beryllium Copper | ||
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|
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3M |
155
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET SOIC 14POS GOLD
|
Bulk | Textool | -55°C ~ 150°C | Through Hole | SOIC | Closed Frame | Solder | Polyethersulfone (PES)，Glass Filled | 14 (2 x 7) | - | Gold | - | Beryllium Copper | Gold | 30μin (0.76μm) | Beryllium Copper | ||
|
|
|
3M |
29
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET QFN 48POS GOLD
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Bulk | Textool | - | Through Hole | QFN | Closed Frame | Solder | Polyethersulfone (PES) | 48 (4 x 12) | 0.020" (0.50mm) | Gold | - | Beryllium Copper | Gold | - | Beryllium Copper | ||
|
|
|
Mill-Max Manufacturing Corp. |
1,353
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET TRANSIST TO-5 4POS
|
Tube | 917 | -55°C ~ 125°C | Through Hole | Transistor，TO-5 | Closed Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 4 (Round) | - | Gold | Flash | Beryllium Copper | Tin | 200μin (5.08μm) | Brass Alloy |
