- Series：
-
- Operating Temperature：
-
- Type：
-
- Features：
-
- Termination：
-
- Housing Material：
-
- Pitch - Mating：
-
- Contact Finish - Mating：
-
- Contact Finish Thickness - Mating：
-
- Contact Material - Mating：
-
- Pitch - Post：
-
- Contact Finish - Post：
-
- Contact Finish Thickness - Post：
-
- Contact Material - Post：
-
- Conditions sélectionnées:
Découvrez les produits 73
 |
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Operating Temperature | Mounting Type | Type | Features | Termination | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Operating Temperature | Mounting Type | Type | Features | Termination | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | |
|
|
|
3M |
150
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET SIP ZIF 10POS GOLD
|
Bulk | Textool | -55°C ~ 125°C | Through Hole | SIP，ZIF (ZIP) | - | Solder | Polysulfone (PSU)，Glass Filled | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | ||
|
|
|
TE Connectivity AMP Connectors |
2,064
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET SIP 10POS GOLD
|
Bulk | 500 | - | Through Hole | SIP | - | Solder | Thermoplastic | 0.100" (2.54mm) | Gold | - | Beryllium Copper | 0.100" (2.54mm) | Gold | - | Beryllium Copper | ||
|
|
|
Aries Electronics |
524
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET SIP 10POS GOLD
|
Bulk | 518 | - | Through Hole | SIP | Open Frame | Solder | Polyamide (PA46)，Nylon 4/6，Glass Filled | 0.100" (2.54mm) | Gold | 10μin (0.25μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass | ||
|
|
|
Mill-Max Manufacturing Corp. |
275
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET SIP 10POS GOLD
|
Bulk | 346 | -55°C ~ 125°C | Through Hole | SIP | - | Press-Fit | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Tin-Lead | 200μin (5.08μm) | Brass Alloy | ||
|
|
|
Mill-Max Manufacturing Corp. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET SIP 10POS GOLD
|
Bulk | 346 | -55°C ~ 125°C | Through Hole | SIP | - | Press-Fit | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass Alloy | ||
|
|
|
Mill-Max Manufacturing Corp. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET SIP 10POS GOLD
|
Bulk | 714 | -55°C ~ 125°C | Through Hole | SIP | - | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Brass Alloy | ||
|
|
|
Aries Electronics |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET SIP 10POS GOLD
|
Bulk | 511 | -55°C ~ 125°C | Through Hole | SIP | - | Solder | Polyamide (PA46)，Nylon 4/6，Glass Filled | 0.100" (2.54mm) | Gold | 10μin (0.25μm) | Phosphor Bronze | 0.100" (2.54mm) | Gold | 10μin (0.25μm) | Phosphor Bronze | ||
|
|
|
TE Connectivity AMP Connectors |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET SIP 10POS TIN
|
Tube | Diplomate DL | -55°C ~ 105°C | Through Hole | SIP | Closed Frame | Solder | Thermoplastic，Glass Filled | 0.100" (2.54mm) | Tin | - | Beryllium Copper | 0.100" (2.54mm) | Tin | - | Beryllium Copper | ||
|
|
|
TE Connectivity AMP Connectors |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET SIP 10POS TIN
|
Tube | Diplomate DL | -55°C ~ 105°C | Through Hole | SIP | Closed Frame | Solder | Thermoplastic，Glass Filled | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | ||
|
|
TE Connectivity AMP Connectors |
2,434
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET SIP 10POS GOLD
|
Bulk | 510 | - | Through Hole | SIP | Closed Frame | Solder | Thermoplastic，Polyester | 0.100" (2.54mm) | Gold | 20μin (0.51μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 20μin (0.51μm) | Copper | |||
|
|
|
Mill-Max Manufacturing Corp. |
2,153
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET SIP 10POS GOLD
|
Tube | 310 | -55°C ~ 125°C | Through Hole | SIP | - | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass Alloy | ||
|
|
|
Harwin Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET SIP 10POS GOLD
|
Bulk | D01-997 | -55°C ~ 125°C | Through Hole | SIP | - | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Glass Filled | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Tin | 196.8μin (5.00μm) | Brass | ||
|
|
|
Aries Electronics |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET SIP 10POS GOLD
|
Bulk | 518 | - | Through Hole | SIP | Open Frame | Solder | Polyamide (PA46)，Nylon 4/6，Glass Filled | 0.100" (2.54mm) | Gold | 10μin (0.25μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass | ||
|
|
|
Aries Electronics |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET SIP 10POS GOLD
|
Bulk | 518 | - | Through Hole | SIP | Open Frame | Solder | Polyamide (PA46)，Nylon 4/6，Glass Filled | 0.100" (2.54mm) | Gold | 10μin (0.25μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass | ||
|
|
|
Omron Electronics Inc-EMC Div |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET SIP 10POS GOLD
|
Bulk | XR2 | -55°C ~ 125°C | Threaded | SIP | - | Solder | Polybutylene Terephthalate (PBT)，Glass Filled | 0.100" (2.54mm) | Gold | 10μin (0.25μm) | Beryllium Copper | 0.100" (2.54mm) | Gold | 10μin (0.25μm) | Brass | ||
|
|
|
Aries Electronics |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET SIP 10POS GOLD
|
Bulk | 513 | - | Through Hole | SIP | - | Solder | Polyamide (PA46)，Nylon 4/6，Glass Filled | 0.100" (2.54mm) | Gold | 10μin (0.25μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass | ||
|
|
|
Harwin Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET SIP 10POS GOLD
|
Bulk | D01-995 | -55°C ~ 125°C | Through Hole | SIP | - | Wire Wrap | Polycyclohexylenedimethylene Terephthalate (PCT)，Glass Filled | 0.100" (2.54mm) | Gold | 10μin (0.25μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 196.8μin (5.00μm) | Brass | ||
|
|
|
Aries Electronics |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET SIP 10POS GOLD
|
Bulk | 513 | - | Through Hole | SIP | - | Solder | Polyamide (PA46)，Nylon 4/6，Glass Filled | 0.100" (2.54mm) | Gold | 10μin (0.25μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass | ||
|
|
|
Aries Electronics |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET SIP 10POS GOLD
|
Bulk | 518 | - | Through Hole | SIP | Open Frame | Solder | Polyamide (PA46)，Nylon 4/6，Glass Filled | 0.100" (2.54mm) | Gold | 10μin (0.25μm) | Beryllium Copper | 0.100" (2.54mm) | Gold | 10μin (0.25μm) | Brass | ||
|
|
|
Aries Electronics |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET SIP 10POS GOLD
|
Bulk | 513 | - | Through Hole | SIP | - | Solder | Polyamide (PA46)，Nylon 4/6，Glass Filled | 0.100" (2.54mm) | Gold | 10μin (0.25μm) | Beryllium Copper | 0.100" (2.54mm) | Gold | 10μin (0.25μm) | Brass |
