- Packaging：
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- Operating Temperature：
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- Contact Material - Mating：
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- Conditions sélectionnées:
Découvrez les produits 3,906
 |
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Operating Temperature | Mounting Type | Type | Features | Termination | Housing Material | Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Post | Contact Finish - Post | Contact Material - Post | |
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Operating Temperature | Mounting Type | Type | Features | Termination | Housing Material | Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Post | Contact Finish - Post | Contact Material - Post | |
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ASSMANN WSW Components |
47,594
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 8POS TIN
|
Tube | - | -40°C ~ 105°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Solder | Thermoplastic，Polyester | 8 (2 x 4) | 0.100" (2.54mm) | Tin | - | Beryllium Copper | 0.100" (2.54mm) | Tin | Beryllium Copper | ||
|
|
|
On Shore Technology Inc. |
2,645
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 14POS GOLD
|
Tube | SA | -40°C ~ 105°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Solder | Thermoplastic，Polyester，Glass Filled | 14 (2 x 7) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Tin | Brass | ||
|
|
|
Mill-Max Manufacturing Corp. |
28,542
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 8POS GOLD
|
Tube | 110 | -55°C ~ 125°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 8 (2 x 4) | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | Brass Alloy | ||
|
|
|
Mill-Max Manufacturing Corp. |
8,743
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 6POS GOLD
|
Tube | 110 | -55°C ~ 125°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 6 (2 x 3) | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | Brass Alloy | ||
|
|
|
On Shore Technology Inc. |
6,028
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 16POS GOLD
|
Tube | SA | -40°C ~ 105°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Solder | Thermoplastic，Polyester，Glass Filled | 16 (2 x 8) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Tin | Brass | ||
|
|
|
ASSMANN WSW Components |
8,465
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 14POS TIN
|
Tube | - | -40°C ~ 105°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Solder | Thermoplastic，Polyester | 14 (2 x 7) | 0.100" (2.54mm) | Tin | - | Beryllium Copper | 0.100" (2.54mm) | Tin | Beryllium Copper | ||
|
|
|
ASSMANN WSW Components |
16,495
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 16POS TIN
|
Tube | - | -40°C ~ 105°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Solder | Thermoplastic，Polyester | 16 (2 x 8) | 0.100" (2.54mm) | Tin | - | Beryllium Copper | 0.100" (2.54mm) | Tin | Beryllium Copper | ||
|
|
|
Mill-Max Manufacturing Corp. |
3,743
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 8POS GOLD
|
Tube | 115 | -55°C ~ 125°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 8 (2 x 4) | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | Brass Alloy | ||
|
|
|
Mill-Max Manufacturing Corp. |
3,668
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 24POS TIN
|
Tube | 110 | -55°C ~ 125°C | Through Hole | DIP，0.4" (10.16mm) Row Spacing | Open Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 24 (2 x 12) | 0.100" (2.54mm) | Tin | 100μin (2.54μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | Brass Alloy | ||
|
|
|
Mill-Max Manufacturing Corp. |
8,629
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 14POS GOLD
|
Tube | 110 | -55°C ~ 125°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 14 (2 x 7) | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Tin-Lead | Brass Alloy | ||
|
|
|
Mill-Max Manufacturing Corp. |
4,338
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 14POS GOLD
|
Tube | 110 | -55°C ~ 125°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 14 (2 x 7) | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | Brass Alloy | ||
|
|
|
Mill-Max Manufacturing Corp. |
2,842
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET PLCC 44POS TIN
|
Tube | 940 | -55°C ~ 125°C | Surface Mount | PLCC | Closed Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 44 (4 x 11) | 0.050" (1.27mm) | Tin | 150μin (3.81μm) | Beryllium Copper | 0.050" (1.27mm) | Tin | Brass Alloy | ||
|
|
|
Mill-Max Manufacturing Corp. |
2,567
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET PLCC 44POS TIN
|
Tube | 940 | -55°C ~ 125°C | Through Hole | PLCC | Closed Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 44 (4 x 11) | 0.100" (2.54mm) | Tin | 150μin (3.81μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | Brass Alloy | ||
|
|
|
Mill-Max Manufacturing Corp. |
20,612
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 16POS GOLD
|
Tube | 110 | -55°C ~ 125°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 16 (2 x 8) | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Tin-Lead | Brass Alloy | ||
|
|
|
Mill-Max Manufacturing Corp. |
6,589
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 16POS GOLD
|
Tube | 110 | -55°C ~ 125°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 16 (2 x 8) | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | Brass Alloy | ||
|
|
|
ASSMANN WSW Components |
7,338
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 28POS TIN
|
Tube | - | -40°C ~ 105°C | Through Hole | DIP，0.6" (15.24mm) Row Spacing | Open Frame | Solder | Thermoplastic，Polyester | 28 (2 x 14) | 0.100" (2.54mm) | Tin | - | Beryllium Copper | 0.100" (2.54mm) | Tin | Beryllium Copper | ||
|
|
|
Aries Electronics |
2,527
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 14POS GOLD
|
Bulk | 518 | - | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Solder | Polyamide (PA46)，Nylon 4/6，Glass Filled | 14 (2 x 7) | 0.100" (2.54mm) | Gold | 10μin (0.25μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | Brass | ||
|
|
|
Mill-Max Manufacturing Corp. |
1,677
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 18POS GOLD
|
Tube | 110 | -55°C ~ 125°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 18 (2 x 9) | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | Brass Alloy | ||
|
|
|
Mill-Max Manufacturing Corp. |
4,745
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET PLCC 52POS TIN
|
Tube | 940 | -55°C ~ 125°C | Through Hole | PLCC | Closed Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 52 (4 x 13) | 0.100" (2.54mm) | Tin | 150μin (3.81μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | Brass Alloy | ||
|
|
|
Mill-Max Manufacturing Corp. |
7,520
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 32POS TIN
|
Tube | 110 | -55°C ~ 125°C | Through Hole | DIP，0.6" (15.24mm) Row Spacing | Open Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 32 (2 x 16) | 0.100" (2.54mm) | Tin | 100μin (2.54μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | Brass Alloy |
