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- Conditions sélectionnées:
Découvrez les produits 19,045
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Mounting Type | Type | Features | Termination | Housing Material | Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | |
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Mounting Type | Type | Features | Termination | Housing Material | Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | |
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Molex，LLC |
96,800
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3 jours |
-
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MOQ: 1 MPQ: 1
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CONN CAM SOCKET 32POS GOLD
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Tape & Reel (TR) | 105028 | Surface Mount | Camera Socket | Open Frame | Solder | Thermoplastic | 32 (4 x 8) | 0.035" (0.90mm) | Gold | 12μin (0.30μm) | Copper Alloy | 0.035" (0.90mm) | Nickel | 50μin (1.27μm) | Copper Alloy | ||
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Molex，LLC |
97,189
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3 jours |
-
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MOQ: 1 MPQ: 1
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CONN CAM SOCKET 32POS GOLD
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Cut Tape (CT) | 105028 | Surface Mount | Camera Socket | Open Frame | Solder | Thermoplastic | 32 (4 x 8) | 0.035" (0.90mm) | Gold | 12μin (0.30μm) | Copper Alloy | 0.035" (0.90mm) | Nickel | 50μin (1.27μm) | Copper Alloy | ||
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|
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Molex，LLC |
97,189
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN CAM SOCKET 32POS GOLD
|
- | 105028 | Surface Mount | Camera Socket | Open Frame | Solder | Thermoplastic | 32 (4 x 8) | 0.035" (0.90mm) | Gold | 12μin (0.30μm) | Copper Alloy | 0.035" (0.90mm) | Nickel | 50μin (1.27μm) | Copper Alloy | ||
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Aries Electronics |
2,527
|
3 jours |
-
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MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 14POS GOLD
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Bulk | 518 | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Solder | Polyamide (PA46)，Nylon 4/6，Glass Filled | 14 (2 x 7) | 0.100" (2.54mm) | Gold | 10μin (0.25μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass | ||
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|
|
Aries Electronics |
6,009
|
3 jours |
-
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MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 8POS GOLD
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Bulk | 518 | Surface Mount | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Solder | Polyamide (PA46)，Nylon 4/6，Glass Filled | 8 (2 x 4) | 0.100" (2.54mm) | Gold | 10μin (0.25μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass | ||
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Aries Electronics |
3,517
|
3 jours |
-
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MOQ: 1 MPQ: 1
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CONN IC DIP SOCKET 10POS GOLD
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Bulk | Lo-PROfile，513 | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Closed Frame | Solder | Polyamide (PA46)，Nylon 4/6，Glass Filled | 10 (2 x 5) | 0.100" (2.54mm) | Gold | 10μin (0.25μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass | ||
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Aries Electronics |
1,734
|
3 jours |
-
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MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 40POS GOLD
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Bulk | 518 | Through Hole | DIP，0.6" (15.24mm) Row Spacing | Open Frame | Solder | Polyamide (PA46)，Nylon 4/6，Glass Filled | 40 (2 x 20) | 0.100" (2.54mm) | Gold | 10μin (0.25μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass | ||
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|
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Aries Electronics |
3,340
|
3 jours |
-
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MOQ: 1 MPQ: 1
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CONN SOCKET SIP 25POS GOLD
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Bulk | 513 | Through Hole | SIP | - | Solder | Polyamide (PA46)，Nylon 4/6，Glass Filled | 25 (1 x 25) | 0.100" (2.54mm) | Gold | 10μin (0.25μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass | ||
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|
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Aries Electronics |
1,290
|
3 jours |
-
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MOQ: 1 MPQ: 1
|
CONN SOCKET SIP 40POS GOLD
|
Bulk | 518 | Through Hole | SIP | Open Frame | Solder | Polyamide (PA46)，Nylon 4/6，Glass Filled | 40 (1 x 40) | 0.100" (2.54mm) | Gold | 10μin (0.25μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass | ||
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Aries Electronics |
660
|
3 jours |
-
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MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 10POS GOLD
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Bulk | Vertisockets 800 | Through Hole，Right Angle，Vertical | DIP，0.2" (5.08mm) Row Spacing | Closed Frame | Solder | Polyamide (PA46)，Nylon 4/6，Glass Filled | 10 (2 x 5) | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass | ||
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|
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Aries Electronics |
104
|
3 jours |
-
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MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 14POS GOLD
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Bulk | Vertisockets 800 | Through Hole，Right Angle，Vertical | DIP，0.3" (7.62mm) Row Spacing | Closed Frame | Solder | Polyamide (PA46)，Nylon 4/6 | 14 (2 x 7) | 0.100" (2.54mm) | Gold | 10μin (0.25μm) | Phosphor Bronze | 0.100" (2.54mm) | Gold | 10μin (0.25μm) | Phosphor Bronze | ||
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|
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Aries Electronics |
269
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET ZIF 28POS TIN
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Bulk | 55 | Through Hole | DIP，ZIF (ZIP)，0.6" (15.24mm) Row Spacing | Closed Frame | Solder | Polyphenylene Sulfide (PPS)，Glass Filled | 28 (2 x 14) | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Beryllium Copper | ||
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|
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Aries Electronics |
632
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET ZIF 32POS TIN
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Bulk | 55 | Through Hole | DIP，ZIF (ZIP)，0.6" (15.24mm) Row Spacing | Closed Frame | Solder | Polyphenylene Sulfide (PPS)，Glass Filled | 32 (2 x 16) | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Beryllium Copper | ||
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|
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Aries Electronics |
364
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET ZIF 24POS GLD
|
Bulk | 55 | Through Hole | DIP，ZIF (ZIP)，0.6" (15.24mm) Row Spacing | Closed Frame | Solder | Polyphenylene Sulfide (PPS)，Glass Filled | 24 (2 x 12) | 0.100" (2.54mm) | Gold | - | Beryllium Copper | 0.100" (2.54mm) | Gold | - | Beryllium Copper | ||
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|
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Aries Electronics |
182
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET ZIF 40POS TIN
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Bulk | 55 | Through Hole | DIP，ZIF (ZIP)，0.6" (15.24mm) Row Spacing | Closed Frame | Solder | Polyphenylene Sulfide (PPS)，Glass Filled | 40 (2 x 20) | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Beryllium Copper | ||
|
|
|
Aries Electronics |
2,051
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET ZIF 28POS GLD
|
Bulk | 55 | Through Hole | DIP，ZIF (ZIP)，0.6" (15.24mm) Row Spacing | Closed Frame | Solder | Polyphenylene Sulfide (PPS)，Glass Filled | 28 (2 x 14) | 0.100" (2.54mm) | Gold | - | Beryllium Copper | 0.100" (2.54mm) | Gold | - | Beryllium Copper | ||
|
|
|
Aries Electronics |
2,009
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET ZIF 48POS GLD
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Bulk | 55 | Through Hole | DIP，ZIF (ZIP)，0.6" (15.24mm) Row Spacing | Closed Frame | Solder | Polyphenylene Sulfide (PPS)，Glass Filled | 48 (2 x 24) | 0.100" (2.54mm) | Gold | - | Beryllium Copper | 0.100" (2.54mm) | Gold | - | Beryllium Copper | ||
|
|
|
Apex Microtechnology |
999
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN TRANSIST TO-3 8POS GOLD
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Bulk | Apex Precision Power | Through Hole | Transistor，TO-3 | Closed Frame | Solder | Polyester，Glass Filled | 8 (Oval) | - | Gold | 30μin (0.76μm) | Beryllium Copper | - | Tin | 200μin (5.08μm) | Brass | ||
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|
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3M |
72
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET QFN 64POS GOLD
|
Bulk | Textool | Through Hole | QFN | Open Frame | Solder | Polyethersulfone (PES) | 64 (4 x 16) | 0.020" (0.50mm) | Gold | - | Beryllium Copper | 0.020" (0.50mm) | Gold | - | Beryllium Copper | ||
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|
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3M |
43
|
3 jours |
-
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MOQ: 1 MPQ: 1
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CONN SOCKET QFN 88POS GOLD
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Tray | Textool | Through Hole | QFN | Open Frame | Solder | Polyethersulfone (PES) | 88 (4 x 22) | 0.016" (0.40mm) | Gold | - | Beryllium Copper | 0.016" (0.40mm) | Gold | - | Beryllium Copper |
