- Operating Temperature：
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- Mounting Type：
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- Type：
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- Features：
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- Termination：
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- Housing Material：
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- Number of Positions or Pins (Grid)：
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- Pitch - Mating：
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- Contact Finish - Mating：
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- Contact Finish Thickness - Mating：
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- Contact Material - Mating：
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- Pitch - Post：
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- Contact Finish - Post：
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- Contact Finish Thickness - Post：
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- Contact Material - Post：
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- Conditions sélectionnées:
Découvrez les produits 11
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Operating Temperature | Mounting Type | Type | Features | Termination | Housing Material | Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Operating Temperature | Mounting Type | Type | Features | Termination | Housing Material | Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | |
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3M |
140
|
3 jours |
-
|
MOQ: 1 MPQ: 1
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CONN IC DIP SOCKET ZIF 16POS GLD
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Bulk | -55°C ~ 105°C | Through Hole | DIP，ZIF (ZIP)，0.3" (7.62mm) Row Spacing | Closed Frame | Solder | Polyether Imide (PEI)，Glass Filled | 16 (2 x 8) | 0.100" (2.54mm) | Gold | 250μin (6.35μm) | Beryllium Copper | 0.100" (2.54mm) | Gold | 250μin (6.35μm) | Beryllium Copper | ||
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|
|
3M |
130
|
3 jours |
-
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MOQ: 1 MPQ: 1
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CONN SOCKET CLCC 68POS GOLD
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Tray | -55°C ~ 105°C | Through Hole | CLCC | Closed Frame | Solder | Polyphenylene Sulfide (PPS)，Glass Filled | 68 (4 x 17) | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | ||
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|
|
3M |
Enquête
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- |
-
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MOQ: 1 MPQ: 1
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CONN SOCKET CLCC 68POS GOLD
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Tray | -55°C ~ 105°C | Through Hole | CLCC | Closed Frame | Solder | Polyphenylene Sulfide (PPS)，Glass Filled | 68 (4 x 17) | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | ||
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|
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3M |
Enquête
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- |
-
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MOQ: 1 MPQ: 1
|
CONN SOCKET CLCC 68POS GOLD
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Tray | -55°C ~ 105°C | Through Hole | CLCC | Closed Frame | Solder | Polyphenylene Sulfide (PPS)，Glass Filled | 68 (4 x 17) | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | ||
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|
|
3M |
Enquête
|
- |
-
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MOQ: 1 MPQ: 1
|
CONN SOCKET CLCC 68POS GOLD
|
Tray | -55°C ~ 105°C | Through Hole | CLCC | Closed Frame | Solder | Polyphenylene Sulfide (PPS)，Glass Filled | 68 (4 x 17) | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | ||
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|
|
3M |
Enquête
|
- |
-
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MOQ: 1 MPQ: 1
|
OEM LCC SOCKETS 32 POS SOLID LID
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
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|
|
3M |
Enquête
|
- |
-
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MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET ZIF 32POS GLD
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Bulk | -55°C ~ 105°C | Through Hole | DIP，ZIF (ZIP)，0.6" (15.24mm) Row Spacing | Closed Frame | Solder | Polyether Imide (PEI)，Glass Filled | 32 (2 x 16) | 0.100" (2.54mm) | Gold | 250μin (6.35μm) | Beryllium Copper | 0.100" (2.54mm) | Gold | 250μin (6.35μm) | Beryllium Copper | ||
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|
|
3M |
Enquête
|
- |
-
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MOQ: 1 MPQ: 1
|
CONN SOCKET PLCC 84POS GOLD
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Bulk | -55°C ~ 105°C | Through Hole | PLCC | Open Frame | Solder | Polyphenylene Sulfide (PPS)，Glass Filled | 84 (4 x 21) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | ||
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|
|
3M |
Enquête
|
- |
-
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MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET ZIF 20POS GLD
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Bulk | -55°C ~ 105°C | Through Hole | DIP，ZIF (ZIP)，0.6" (15.24mm) Row Spacing | Closed Frame | Solder | Polyether Imide (PEI)，Glass Filled | 20 (2 x 10) | 0.100" (2.54mm) | Gold | 250μin (6.35μm) | Beryllium Copper | 0.100" (2.54mm) | Gold | 250μin (6.35μm) | Beryllium Copper | ||
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|
|
3M |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET ZIF 40POS GLD
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Bulk | -55°C ~ 105°C | Through Hole | DIP，ZIF (ZIP)，0.6" (15.24mm) Row Spacing | Closed Frame | Solder | Polyether Imide (PEI)，Glass Filled | 40 (2 x 20) | 0.100" (2.54mm) | Gold | 250μin (6.35μm) | Beryllium Copper | 0.100" (2.54mm) | Gold | 250μin (6.35μm) | Beryllium Copper | ||
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|
|
3M |
Enquête
|
- |
-
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MOQ: 1 MPQ: 1
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CONN SOCKET PQFP 100POS TIN-LEAD
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Bulk | 0°C ~ 105°C | Through Hole | QFP | Open Frame | Solder | Polyethersulfone (PES)，Glass Filled | 100 (4 x 25) | - | Tin-Lead | 200μin (5.08μm) | Beryllium Copper | - | Tin-Lead | 200μin (5.08μm) | Beryllium Copper |
