Packaging:
Mounting Type:
Termination:
Housing Material:
Number of Positions or Pins (Grid):
Pitch - Mating:
Contact Finish - Mating:
Contact Finish Thickness - Mating:
Contact Material - Mating:
Découvrez les produits 5
Image Numéro de pièce Fabricant Quantité Délai de livraison Prix ​​unitaire Acheter Description Packaging Mounting Type Features Termination Housing Material Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Pitch - Post
475960132
Molex,LLC
Enquête
-
-
MOQ: 1  MPQ: 1
CONN SOCKET LGA 1156POS GOLD
Tray Surface Mount Open Frame Solder Thermoplastic 1156 (40 x 40) 0.036" (0.91mm) Gold 15μin (0.38μm) Copper Alloy 0.036" (0.91mm)
475960232
Molex,LLC
Enquête
-
-
MOQ: 1  MPQ: 1
CONN SOCKET LGA 1155POS GOLD
Tray Surface Mount Open Frame Solder Thermoplastic 1155 (40 x 40) 0.036" (0.91mm) Gold 15μin (0.38μm) Copper Alloy 0.036" (0.91mm)
475960233
Molex,LLC
Enquête
-
-
MOQ: 1  MPQ: 1
CONN SOCKET LGA 1155POS GOLD
Tray Surface Mount Open Frame Solder Thermoplastic 1155 (40 x 40) 0.036" (0.91mm) Gold 30μin (0.76μm) Copper Alloy 0.036" (0.91mm)
475960532
Molex,LLC
Enquête
-
-
MOQ: 1  MPQ: 1
CONN SOCKET LGA 1156POS GOLD
Tray Surface Mount Closed Frame Solder Thermoplastic 1156 (40 x 40) 0.036" (0.91mm) Gold 15μin (0.38μm) Copper Alloy 0.036" (0.91mm)
475962032
Molex,LLC
Enquête
-
-
MOQ: 1  MPQ: 1
CONN SOCKET LGA 1155POS
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