- Operating Temperature:
-
- Type:
-
- Termination:
-
- Housing Material:
-
- Number of Positions or Pins (Grid):
-
- Contact Material - Mating:
-
- Contact Finish Thickness - Post:
-
- Contact Material - Post:
-
- Conditions sélectionnées:
Découvrez les produits 62
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Operating Temperature | Type | Features | Termination | Housing Material | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Operating Temperature | Type | Features | Termination | Housing Material | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | ||
3M |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 6POS GOLD
|
Bulk | 100 | -65°C ~ 125°C | DIP,0.3" (7.62mm) Row Spacing | Open Frame | Solder | Polyphenylene Sulfide (PPS),Glass Filled | 6 (2 x 3) | Beryllium Copper | Flash | Brass | ||||
3M |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 8POS GOLD
|
Bulk | 100 | -65°C ~ 125°C | DIP,0.3" (7.62mm) Row Spacing | Open Frame | Solder | Polyphenylene Sulfide (PPS),Glass Filled | 8 (2 x 4) | Beryllium Copper | Flash | Brass | ||||
3M |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 8POS GOLD
|
Bulk | 100 | -65°C ~ 125°C | DIP,0.3" (7.62mm) Row Spacing | Closed Frame,Seal Tape | Solder | Polyphenylene Sulfide (PPS),Glass Filled | 8 (2 x 4) | Beryllium Copper | Flash | Brass | ||||
3M |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 10POS GOLD
|
Bulk | 100 | -65°C ~ 125°C | DIP,0.3" (7.62mm) Row Spacing | Open Frame | Solder | Polyphenylene Sulfide (PPS),Glass Filled | 10 (2 x 5) | Beryllium Copper | Flash | Brass | ||||
3M |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 14POS GOLD
|
Bulk | 100 | -65°C ~ 125°C | DIP,0.3" (7.62mm) Row Spacing | Open Frame | Solder | Polyphenylene Sulfide (PPS),Glass Filled | 14 (2 x 7) | Beryllium Copper | Flash | Brass | ||||
3M |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 14POS GOLD
|
Bulk | 100 | -65°C ~ 125°C | DIP,0.3" (7.62mm) Row Spacing | Closed Frame,Seal Tape | Solder | Polyphenylene Sulfide (PPS),Glass Filled | 14 (2 x 7) | Beryllium Copper | Flash | Brass | ||||
3M |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 16POS GOLD
|
Bulk | 100 | -65°C ~ 125°C | DIP,0.3" (7.62mm) Row Spacing | Open Frame | Solder | Polyphenylene Sulfide (PPS),Glass Filled | 16 (2 x 8) | Beryllium Copper | Flash | Brass | ||||
3M |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 16POS GOLD
|
Bulk | 100 | -65°C ~ 125°C | DIP,0.3" (7.62mm) Row Spacing | Closed Frame,Seal Tape | Solder | Polyphenylene Sulfide (PPS),Glass Filled | 16 (2 x 8) | Beryllium Copper | Flash | Brass | ||||
3M |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 6POS GOLD
|
Bulk | 100 | -65°C ~ 125°C | DIP,0.3" (7.62mm) Row Spacing | Open Frame | Solder | Polyphenylene Sulfide (PPS),Glass Filled | 6 (2 x 3) | Beryllium Copper | Flash | Brass | ||||
3M |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 8POS GOLD
|
Bulk | 100 | -65°C ~ 125°C | DIP,0.3" (7.62mm) Row Spacing | Open Frame | Solder | Polyphenylene Sulfide (PPS),Glass Filled | 8 (2 x 4) | Beryllium Copper | Flash | Brass | ||||
3M |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 8POS GOLD
|
Bulk | 100 | -65°C ~ 125°C | DIP,0.3" (7.62mm) Row Spacing | Closed Frame,Seal Tape | Solder | Polyphenylene Sulfide (PPS),Glass Filled | 8 (2 x 4) | Beryllium Copper | Flash | Brass | ||||
3M |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 10POS GOLD
|
Bulk | 100 | -65°C ~ 125°C | DIP,0.3" (7.62mm) Row Spacing | Open Frame | Solder | Polyphenylene Sulfide (PPS),Glass Filled | 10 (2 x 5) | Beryllium Copper | Flash | Brass | ||||
3M |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 14POS GOLD
|
Bulk | 100 | -65°C ~ 125°C | DIP,0.3" (7.62mm) Row Spacing | Open Frame | Solder | Polyphenylene Sulfide (PPS),Glass Filled | 14 (2 x 7) | Beryllium Copper | Flash | Brass | ||||
3M |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 14POS GOLD
|
Bulk | 100 | -65°C ~ 125°C | DIP,0.3" (7.62mm) Row Spacing | Closed Frame,Seal Tape | Solder | Polyphenylene Sulfide (PPS),Glass Filled | 14 (2 x 7) | Beryllium Copper | Flash | Brass | ||||
3M |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 16POS GOLD
|
Bulk | 100 | -65°C ~ 125°C | DIP,0.3" (7.62mm) Row Spacing | Open Frame | Solder | Polyphenylene Sulfide (PPS),Glass Filled | 16 (2 x 8) | Beryllium Copper | Flash | Brass | ||||
3M |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 16POS GOLD
|
Bulk | 100 | -65°C ~ 125°C | DIP,0.3" (7.62mm) Row Spacing | Closed Frame,Seal Tape | Solder | Polyphenylene Sulfide (PPS),Glass Filled | 16 (2 x 8) | Beryllium Copper | Flash | Brass | ||||
3M |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 18POS GOLD
|
Bulk | 100 | -65°C ~ 125°C | DIP,0.3" (7.62mm) Row Spacing | Open Frame | Solder | Polyphenylene Sulfide (PPS),Glass Filled | 18 (2 x 9) | Beryllium Copper | Flash | Brass | ||||
3M |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 18POS GOLD
|
Bulk | 100 | -65°C ~ 125°C | DIP,0.3" (7.62mm) Row Spacing | Closed Frame,Seal Tape | Solder | Polyphenylene Sulfide (PPS),Glass Filled | 18 (2 x 9) | Beryllium Copper | Flash | Brass | ||||
3M |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 20POS GOLD
|
Bulk | 100 | -65°C ~ 125°C | DIP,0.3" (7.62mm) Row Spacing | Open Frame | Solder | Polyphenylene Sulfide (PPS),Glass Filled | 20 (2 x 10) | Beryllium Copper | Flash | Brass | ||||
3M |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 20POS GOLD
|
Bulk | 100 | -65°C ~ 125°C | DIP,0.3" (7.62mm) Row Spacing | Closed Frame,Seal Tape | Solder | Polyphenylene Sulfide (PPS),Glass Filled | 20 (2 x 10) | Beryllium Copper | Flash | Brass |