- Series：
-
- Operating Temperature：
-
- Mounting Type：
-
- Features：
-
- Termination：
-
- Housing Material：
-
- Number of Positions or Pins (Grid)：
-
- Pitch - Mating：
-
- Contact Finish - Mating：
-
- Contact Finish Thickness - Mating：
-
- Contact Material - Mating：
-
- Pitch - Post：
-
- Contact Finish - Post：
-
- Contact Finish Thickness - Post：
-
- Contact Material - Post：
-
- Conditions sélectionnées:
Découvrez les produits 1,054
 |
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Operating Temperature | Mounting Type | Features | Termination | Housing Material | Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Operating Temperature | Mounting Type | Features | Termination | Housing Material | Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | |
|
|
|
Aries Electronics |
80
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET PGA GOLD
|
Bulk | PGM | -55°C ~ 105°C | Through Hole | - | Solder | Polyamide (PA46)，Nylon 4/6，Glass Filled | - | 0.100" (2.54mm) | Gold | 10μin (0.25μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass | ||
|
|
|
Aries Electronics |
27
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET PGA GOLD
|
Bulk | PGM | -55°C ~ 105°C | Through Hole | - | Solder | Polyamide (PA46)，Nylon 4/6，Glass Filled | - | 0.100" (2.54mm) | Gold | 10μin (0.25μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass | ||
|
|
|
Mill-Max Manufacturing Corp. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET PGA 145POS GOLD
|
Bulk | 510 | -55°C ~ 125°C | Through Hole | Open Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 145 (15 x 15) | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | - | - | Brass Alloy | ||
|
|
|
Samtec Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET PGA 114POS GOLD
|
Bulk | MVAS | - | Through Hole | Open Frame | Solder | - | 114 (13 x 13) | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | - | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | - | ||
|
|
|
Aries Electronics |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET PGA GOLD
|
Bulk | PGM | -55°C ~ 105°C | Through Hole | - | Solder | Polyamide (PA46)，Nylon 4/6，Glass Filled | - | 0.100" (2.54mm) | Gold | 10μin (0.25μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass | ||
|
|
|
Aries Electronics |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET PGA GOLD
|
Bulk | PGM | -55°C ~ 105°C | Through Hole | - | Solder | Polyamide (PA46)，Nylon 4/6，Glass Filled | - | 0.100" (2.54mm) | Gold | 10μin (0.25μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass | ||
|
|
|
Aries Electronics |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET PGA GOLD
|
Bulk | PGM | -55°C ~ 105°C | Through Hole | - | Solder | Polyamide (PA46)，Nylon 4/6，Glass Filled | - | 0.100" (2.54mm) | Gold | 10μin (0.25μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass | ||
|
|
|
Aries Electronics |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET PGA GOLD
|
Bulk | PGM | -55°C ~ 105°C | Through Hole | - | Solder | Polyamide (PA46)，Nylon 4/6，Glass Filled | - | 0.100" (2.54mm) | Gold | 10μin (0.25μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass | ||
|
|
|
Aries Electronics |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET PGA GOLD
|
Bulk | PGM | -55°C ~ 105°C | Through Hole | - | Solder | Polyamide (PA46)，Nylon 4/6，Glass Filled | - | 0.100" (2.54mm) | Gold | 10μin (0.25μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass | ||
|
|
|
Aries Electronics |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET PGA GOLD
|
Bulk | PGM | -55°C ~ 105°C | Through Hole | - | Solder | Polyamide (PA46)，Nylon 4/6，Glass Filled | - | 0.100" (2.54mm) | Gold | 10μin (0.25μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass | ||
|
|
|
Aries Electronics |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET PGA GOLD
|
Bulk | PGM | -55°C ~ 105°C | Through Hole | - | Solder | Polyamide (PA46)，Nylon 4/6，Glass Filled | - | 0.100" (2.54mm) | Gold | 10μin (0.25μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass | ||
|
|
|
Aries Electronics |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET PGA GOLD
|
Bulk | PGM | -55°C ~ 105°C | Through Hole | - | Solder | Polyamide (PA46)，Nylon 4/6，Glass Filled | - | 0.100" (2.54mm) | Gold | 10μin (0.25μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass | ||
|
|
|
Aries Electronics |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET PGA GOLD
|
Bulk | PGM | -55°C ~ 105°C | Through Hole | - | Solder | Polyamide (PA46)，Nylon 4/6，Glass Filled | - | 0.100" (2.54mm) | Gold | 10μin (0.25μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass | ||
|
|
Preci-Dip |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET PGA 179POS GOLD
|
Bulk | 510 | -55°C ~ 125°C | Through Hole | Open Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester，Glass Filled | 179 (18 x 18) | 0.100" (2.54mm) | Gold | 29.5μin (0.75μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | - | Brass | |||
|
|
|
Aries Electronics |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET PGA GOLD
|
Bulk | PGM | -55°C ~ 105°C | Through Hole | - | Solder | Polyamide (PA46)，Nylon 4/6，Glass Filled | - | 0.100" (2.54mm) | Gold | 10μin (0.25μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass | ||
|
|
|
Aries Electronics |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET PGA GOLD
|
Bulk | PGM | -55°C ~ 105°C | Through Hole | - | Solder | Polyamide (PA46)，Nylon 4/6，Glass Filled | - | 0.100" (2.54mm) | Gold | 10μin (0.25μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass | ||
|
|
|
Aries Electronics |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET PGA GOLD
|
Bulk | PGM | -55°C ~ 105°C | Through Hole | - | Solder | Polyamide (PA46)，Nylon 4/6，Glass Filled | - | 0.100" (2.54mm) | Gold | 10μin (0.25μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass | ||
|
|
|
Aries Electronics |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET PGA GOLD
|
Bulk | PGM | -55°C ~ 105°C | Through Hole | - | Solder | Polyamide (PA46)，Nylon 4/6，Glass Filled | - | 0.100" (2.54mm) | Gold | 10μin (0.25μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass | ||
|
|
|
Aries Electronics |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET PGA GOLD
|
Bulk | PGM | -55°C ~ 105°C | Through Hole | - | Solder | Polyamide (PA46)，Nylon 4/6，Glass Filled | - | 0.100" (2.54mm) | Gold | 10μin (0.25μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass | ||
|
|
|
Aries Electronics |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET PGA GOLD
|
Bulk | PGM | -55°C ~ 105°C | Through Hole | - | Solder | Polyamide (PA46)，Nylon 4/6，Glass Filled | - | 0.100" (2.54mm) | Gold | 10μin (0.25μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass |
