Douilles pour circuits intégrés, transistors - Zui Ai Technology（Taiwan）Company.

Packaging：

Series：

Operating Temperature：

Mounting Type：

Type：

Features：

Termination：

Number of Positions or Pins (Grid)：

10 (1 x 10) (4)
10 (2 x 5) (4)
11 (1 x 11) (1)
1150 (2)
1151 (1)
1155 (40 x 40) (4)
1156 (34 x 34) (2)
1156 (40 x 40) (2)
12 (1 x 12) (3)
12 (2 x 6) (5)
1207 (33 x 34) (2)
1356 (32 x 41) (2)
1366 (32 x 41) (3)
14 (1 x 14) (1)
14 (2 x 7) (3)
15 (1 x 15) (1)
1567 (2)
16 (1 x 16) (2)
16 (2 x 8) (3)
18 (2 x 9) (5)
2 (1 x 2) (1)
20 (1 x 20) (2)
20 (2 x 10) (9)
20 (4 x 5) (5)
2011 (47 x 58) (10)
22 (2 x 11) (4)
24 (2 x 12) (15)
25 (1 x 25) (1)
28 (2 x 14) (7)
28 (4 x 7) (5)
3 (1 x 3) (1)
32 (2 x 16) (9)
32 (2 x 7，2 x 9) (6)
32 (4 x 8) (3)
321 (19 x 19) (4)
36 (2 x 18) (2)
3647 (6)
370 (19 x 19) (1)
4 (2 x 2) (2)
40 (2 x 20) (5)
42 (2 x 21) (2)
44 (4 x 11) (7)
478 (26 x 26) (1)
479 (26 x 26) (3)
48 (2 x 24) (2)
50 (2 x 25) (4)
52 (2 x 26) (4)
52 (4 x 13) (5)
6 (1 x 6) (1)
6 (2 x 3) (2)
638 (26 x 26) (2)
64 (2 x 32) (2)
68 (4 x 17) (5)
7 (1 x 7) (3)
771 (33 x 33) (2)
8 (1 x 8) (1)
8 (2 x 4) (5)
84 (4 x 21) (6)
9 (1 x 9) (1)
939 (31 x 31) (1)
947 (35 x 36) (3)
988 (35 x 36) (2)
989 (35 x 36) (13)

Pitch - Mating：

Contact Finish - Mating：

Contact Finish Thickness - Mating：

Contact Material - Mating：

Pitch - Post：

Contact Finish - Post：

Contact Finish Thickness - Post：

Contact Material - Post：

Image	Numéro de pièce	Fabricant	Quantité	Délai de livraison	Prix unitaire	Acheter	Description	Packaging	Series	Operating Temperature	Mounting Type	Type	Features	Termination	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Material - Post
Image	Numéro de pièce	Fabricant	Quantité	Délai de livraison	Prix unitaire	Acheter	Description	Packaging	Series	Operating Temperature	Mounting Type	Type	Features	Termination	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Material - Post
	1050281001	Molex，LLC	96,800	3 jours	-	CONN CAM SOCKET 32POS GOLD MOQ: 1 MPQ: 1	CONN CAM SOCKET 32POS GOLD	Tape & Reel (TR)	105028	-	Surface Mount	Camera Socket	Open Frame	Solder	32 (4 x 8)	0.035" (0.90mm)	Gold	12μin (0.30μm)	Copper Alloy	0.035" (0.90mm)	Nickel	50μin (1.27μm)	Copper Alloy
	1050281001	Molex，LLC	97,189	3 jours	-	CONN CAM SOCKET 32POS GOLD MOQ: 1 MPQ: 1	CONN CAM SOCKET 32POS GOLD	Cut Tape (CT)	105028	-	Surface Mount	Camera Socket	Open Frame	Solder	32 (4 x 8)	0.035" (0.90mm)	Gold	12μin (0.30μm)	Copper Alloy	0.035" (0.90mm)	Nickel	50μin (1.27μm)	Copper Alloy
	1050281001	Molex，LLC	97,189	3 jours	-	CONN CAM SOCKET 32POS GOLD MOQ: 1 MPQ: 1	CONN CAM SOCKET 32POS GOLD	-	105028	-	Surface Mount	Camera Socket	Open Frame	Solder	32 (4 x 8)	0.035" (0.90mm)	Gold	12μin (0.30μm)	Copper Alloy	0.035" (0.90mm)	Nickel	50μin (1.27μm)	Copper Alloy
	510-AG90D-10	TE Connectivity AMP Connectors	2,064	3 jours	-	CONN SOCKET SIP 10POS GOLD MOQ: 1 MPQ: 1	CONN SOCKET SIP 10POS GOLD	Bulk	500	-	Through Hole	SIP	-	Solder	10 (1 x 10)	0.100" (2.54mm)	Gold	-	Beryllium Copper	0.100" (2.54mm)	Gold	-	Beryllium Copper
	110-41-324-41-001000	Mill-Max Manufacturing Corp.	Enquête	-	-	CONN IC DIP SOCKET 24POS GOLD MOQ: 1 MPQ: 1	CONN IC DIP SOCKET 24POS GOLD	Tube	110	-	Through Hole	DIP，0.3" (7.62mm) Row Spacing	Open Frame	Solder	24 (2 x 12)	0.100" (2.54mm)	Gold	10μin (0.25μm)	Beryllium Copper	0.100" (2.54mm)	Tin	200μin (5.08μm)	Brass Alloy
	3-822516-6	TE Connectivity AMP Connectors	Enquête	-	-	CONN SOCKET PLCC 84POS TIN MOQ: 1 MPQ: 1	CONN SOCKET PLCC 84POS TIN	Tape & Reel (TR)	-	-	Surface Mount	PLCC	Closed Frame	Solder	84 (4 x 21)	0.050" (1.27mm)	Tin	100μin (2.54μm)	Phosphor Bronze	0.050" (1.27mm)	Tin	100μin (2.54μm)	Phosphor Bronze
	3-822516-6	TE Connectivity AMP Connectors	Enquête	-	-	CONN SOCKET PLCC 84POS TIN MOQ: 1 MPQ: 1	CONN SOCKET PLCC 84POS TIN	Cut Tape (CT)	-	-	Surface Mount	PLCC	Closed Frame	Solder	84 (4 x 21)	0.050" (1.27mm)	Tin	100μin (2.54μm)	Phosphor Bronze	0.050" (1.27mm)	Tin	100μin (2.54μm)	Phosphor Bronze
	3-822516-6	TE Connectivity AMP Connectors	Enquête	-	-	CONN SOCKET PLCC 84POS TIN MOQ: 1 MPQ: 1	CONN SOCKET PLCC 84POS TIN	-	-	-	Surface Mount	PLCC	Closed Frame	Solder	84 (4 x 21)	0.050" (1.27mm)	Tin	100μin (2.54μm)	Phosphor Bronze	0.050" (1.27mm)	Tin	100μin (2.54μm)	Phosphor Bronze
	110-11-624-41-001000	Mill-Max Manufacturing Corp.	Enquête	-	-	CONN IC DIP SOCKET 24POS GOLD MOQ: 1 MPQ: 1	CONN IC DIP SOCKET 24POS GOLD	Tube	110	-	Through Hole	DIP，0.6" (15.24mm) Row Spacing	Open Frame	Solder	24 (2 x 12)	0.100" (2.54mm)	Gold	10μin (0.25μm)	Beryllium Copper	0.100" (2.54mm)	Gold	10μin (0.25μm)	Brass Alloy
	104-13-320-41-770000	Mill-Max Manufacturing Corp.	Enquête	-	-	CONN IC DIP SOCKET 20POS GOLD MOQ: 1 MPQ: 1	CONN IC DIP SOCKET 20POS GOLD	Tube	104	-	Through Hole	DIP，0.3" (7.62mm) Row Spacing	Open Frame	Press-Fit	20 (2 x 10)	0.100" (2.54mm)	Gold	30μin (0.76μm)	Beryllium Copper	0.100" (2.54mm)	Gold	10μin (0.25μm)	Brass Alloy
	104-13-642-41-770000	Mill-Max Manufacturing Corp.	Enquête	-	-	CONN IC DIP SOCKET 42POS GOLD MOQ: 1 MPQ: 1	CONN IC DIP SOCKET 42POS GOLD	Tube	104	-	Through Hole	DIP，0.6" (15.24mm) Row Spacing	Open Frame	Press-Fit	42 (2 x 21)	0.100" (2.54mm)	Gold	30μin (0.76μm)	Beryllium Copper	0.100" (2.54mm)	Gold	10μin (0.25μm)	Brass Alloy
	104-13-628-41-770000	Mill-Max Manufacturing Corp.	Enquête	-	-	CONN IC DIP SOCKET 28POS GOLD MOQ: 1 MPQ: 1	CONN IC DIP SOCKET 28POS GOLD	Tube	104	-	Through Hole	DIP，0.6" (15.24mm) Row Spacing	Open Frame	Press-Fit	28 (2 x 14)	0.100" (2.54mm)	Gold	30μin (0.76μm)	Beryllium Copper	0.100" (2.54mm)	Gold	10μin (0.25μm)	Brass Alloy
	1051420132	Molex，LLC	Enquête	-	-	CONN SOCKET LGA 2011POS GOLD MOQ: 1 MPQ: 1	CONN SOCKET LGA 2011POS GOLD	Tray	105142	-	Surface Mount	LGA	Open Frame	Solder	2011 (47 x 58)	0.040" (1.02mm)	Gold	15μin (0.38μm)	Copper Alloy	0.040" (1.01mm)	-	-	-
	1051420133	Molex，LLC	Enquête	-	-	CONN SOCKET LGA 2011POS GOLD MOQ: 1 MPQ: 1	CONN SOCKET LGA 2011POS GOLD	Tray	105142	-	Surface Mount	LGA	Open Frame	Solder	2011 (47 x 58)	0.040" (1.02mm)	Gold	30μin (0.76μm)	Copper Alloy	0.040" (1.01mm)	-	-	-
	2-382465-3	TE Connectivity AMP Connectors	Enquête	-	-	CONN IC DIP SOCKET 20POS TIN MOQ: 1 MPQ: 1	CONN IC DIP SOCKET 20POS TIN	Tube	Diplomate DL	-55°C ~ 105°C	Through Hole	DIP，0.3" (7.62mm) Row Spacing	Closed Frame	Solder	20 (2 x 10)	0.100" (2.54mm)	Tin	-	Phosphor Bronze	0.100" (2.54mm)	Tin	-	Phosphor Bronze
	2-382467-3	TE Connectivity AMP Connectors	Enquête	-	-	CONN IC DIP SOCKET 28POS TIN MOQ: 1 MPQ: 1	CONN IC DIP SOCKET 28POS TIN	Tube	Diplomate DL	-55°C ~ 105°C	Through Hole	DIP，0.6" (15.24mm) Row Spacing	Open Frame	Solder	28 (2 x 14)	0.100" (2.54mm)	Tin	-	Phosphor Bronze	0.100" (2.54mm)	Tin	-	Phosphor Bronze
	2-382470-3	TE Connectivity AMP Connectors	Enquête	-	-	CONN IC DIP SOCKET 32POS TIN MOQ: 1 MPQ: 1	CONN IC DIP SOCKET 32POS TIN	Tube	Diplomate DL	-55°C ~ 105°C	Through Hole	DIP，0.6" (15.24mm) Row Spacing	Open Frame	Solder	32 (2 x 16)	0.100" (2.54mm)	Tin	-	Phosphor Bronze	0.100" (2.54mm)	Tin-Lead	-	Phosphor Bronze
	2-641616-2	TE Connectivity AMP Connectors	Enquête	-	-	CONN IC DIP SOCKET 40POS GOLD MOQ: 1 MPQ: 1	CONN IC DIP SOCKET 40POS GOLD	Tube	Diplomate DL	-55°C ~ 125°C	Through Hole	DIP，0.6" (15.24mm) Row Spacing	Open Frame	Solder	40 (2 x 20)	0.100" (2.54mm)	Gold	30μin (0.76μm)	Beryllium Copper	0.100" (2.54mm)	Gold	30μin (0.76μm)	Beryllium Copper
	5916716-1	TE Connectivity AMP Connectors	Enquête	-	-	CONN SOCKET PGA ZIF 321POS GOLD MOQ: 1 MPQ: 1	CONN SOCKET PGA ZIF 321POS GOLD	Tray	-	-	Through Hole	PGA，ZIF (ZIP)	Open Frame	Solder	321 (19 x 19)	0.100" (2.54mm)	Gold	30μin (0.76μm)	Copper Alloy	0.100" (2.54mm)	Gold	30μin (0.76μm)	Copper Alloy
	822516-7	TE Connectivity AMP Connectors	Enquête	-	-	CONN SOCKET PLCC 32POS TIN MOQ: 1 MPQ: 1	CONN SOCKET PLCC 32POS TIN	Tube	-	-	Surface Mount	PLCC	Closed Frame	Solder	32 (2 x 7，2 x 9)	0.050" (1.27mm)	Tin	100μin (2.54μm)	Phosphor Bronze	0.050" (1.27mm)	Tin	100μin (2.54μm)	Phosphor Bronze

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