- Packaging：
-
- Operating Temperature：
-
- Mounting Type：
-
- Type：
-
- Features：
-
- Termination：
-
- Housing Material：
-
- Number of Positions or Pins (Grid)：
-
- Pitch - Mating：
-
- Contact Finish - Mating：
-
- Contact Finish Thickness - Mating：
-
- Contact Material - Mating：
-
- Pitch - Post：
-
- Contact Finish - Post：
-
- Contact Finish Thickness - Post：
-
- Contact Material - Post：
-
- Conditions sélectionnées:
Découvrez les produits 167
 |
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Operating Temperature | Mounting Type | Type | Features | Termination | Housing Material | Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Operating Temperature | Mounting Type | Type | Features | Termination | Housing Material | Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | |
|
|
|
TE Connectivity AMP Connectors |
3,026
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 6POS GOLD
|
Tube | -55°C ~ 125°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Closed Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 6 (2 x 3) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Gold | Flash | Nickel | ||
|
|
|
TE Connectivity AMP Connectors |
2,064
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET SIP 10POS GOLD
|
Bulk | - | Through Hole | SIP | - | Solder | Thermoplastic | 10 (1 x 10) | 0.100" (2.54mm) | Gold | - | Beryllium Copper | 0.100" (2.54mm) | Gold | - | Beryllium Copper | ||
|
|
|
TE Connectivity AMP Connectors |
2,356
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 14POS GOLD
|
Tube | -55°C ~ 125°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Closed Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 14 (2 x 7) | 0.100" (2.54mm) | Gold | 25μin (0.63μm) | Beryllium Copper | 0.100" (2.54mm) | Gold | 25μin (0.63μm) | Nickel | ||
|
|
|
TE Connectivity AMP Connectors |
1,852
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 16POS GOLD
|
Tube | -55°C ~ 125°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Closed Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 16 (2 x 8) | 0.100" (2.54mm) | Gold | 25μin (0.63μm) | Beryllium Copper | 0.100" (2.54mm) | Gold | 25μin (0.63μm) | Nickel | ||
|
|
|
TE Connectivity AMP Connectors |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 32POS GOLD
|
Tube | -55°C ~ 125°C | Through Hole | DIP，0.6" (15.24mm) Row Spacing | Closed Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 32 (2 x 16) | 0.100" (2.54mm) | Gold | 25μin (0.63μm) | Beryllium Copper | 0.100" (2.54mm) | Gold | 25μin (0.63μm) | Nickel | ||
|
|
|
TE Connectivity AMP Connectors |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 40POS GOLD
|
Tube | -55°C ~ 125°C | Through Hole | DIP，0.6" (15.24mm) Row Spacing | Closed Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 40 (2 x 20) | 0.100" (2.54mm) | Gold | 25μin (0.63μm) | Beryllium Copper | 0.100" (2.54mm) | Gold | 25μin (0.63μm) | Nickel | ||
|
|
|
TE Connectivity AMP Connectors |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 20POS GOLD
|
Tube | -55°C ~ 125°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Closed Frame | Solder | Polyester | 20 (2 x 10) | 0.100" (2.54mm) | Gold | Flash | Copper Alloy | 0.100" (2.54mm) | Gold | - | Copper Alloy | ||
|
|
|
TE Connectivity AMP Connectors |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 28POS GOLD
|
Tube | -55°C ~ 125°C | Through Hole | DIP，0.6" (15.24mm) Row Spacing | Closed Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 28 (2 x 14) | 0.100" (2.54mm) | Gold | 25μin (0.63μm) | Beryllium Copper | 0.100" (2.54mm) | Gold | 25μin (0.63μm) | Nickel | ||
|
|
|
TE Connectivity AMP Connectors |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 24POS GOLD
|
Tube | -55°C ~ 125°C | Through Hole | DIP，0.6" (15.24mm) Row Spacing | Closed Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 24 (2 x 12) | 0.100" (2.54mm) | Gold | 25μin (0.63μm) | Beryllium Copper | 0.100" (2.54mm) | Gold | 25μin (0.63μm) | Nickel | ||
|
|
|
TE Connectivity AMP Connectors |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC SIP SOCKET 8POS GOLD
|
Tube | -55°C ~ 125°C | Through Hole | SIP | - | Solder | Polyester | 8 (1 x 8) | 0.100" (2.54mm) | Gold | - | Beryllium Copper | 0.100" (2.54mm) | Tin-Lead | - | Brass | ||
|
|
TE Connectivity AMP Connectors |
957
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 16POS GOLD
|
Tube | -55°C ~ 125°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Closed Frame | Solder | - | 16 (2 x 8) | 0.100" (2.54mm) | Gold | - | Beryllium Copper | 0.100" (2.54mm) | - | - | Brass | |||
|
|
TE Connectivity AMP Connectors |
2,469
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 14POS GOLD
|
Tube | -55°C ~ 125°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Closed Frame | Solder | - | 14 (2 x 7) | 0.100" (2.54mm) | Gold | - | Copper Alloy | 0.100" (2.54mm) | Gold | - | Copper Alloy | |||
|
|
TE Connectivity AMP Connectors |
969
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 40POS GOLD
|
Tube | -55°C ~ 125°C | Through Hole | DIP，0.6" (15.24mm) Row Spacing | Closed Frame | Solder | - | 40 (2 x 20) | 0.100" (2.54mm) | Gold | - | Beryllium Copper | 0.100" (2.54mm) | - | - | Brass | |||
|
|
TE Connectivity AMP Connectors |
947
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 32POS TIN
|
Tube | -55°C ~ 105°C | Through Hole | DIP，0.6" (15.24mm) Row Spacing | Closed Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 32 (2 x 16) | 0.100" (2.54mm) | Tin | - | Beryllium Copper | 0.100" (2.54mm) | Tin | - | Beryllium Copper | |||
|
|
TE Connectivity AMP Connectors |
384
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 40POS GOLD
|
Tube | -55°C ~ 125°C | Through Hole | DIP，0.6" (15.24mm) Row Spacing | Closed Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 40 (2 x 20) | 0.100" (2.54mm) | Gold | 25μin (0.63μm) | Beryllium Copper | 0.100" (2.54mm) | Gold | 25μin (0.63μm) | Beryllium Copper | |||
|
|
TE Connectivity AMP Connectors |
1,164
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 8POS GOLD
|
Tube | -55°C ~ 105°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Closed Frame | Solder | Polyester | 8 (2 x 4) | 0.100" (2.54mm) | Gold | 25μin (0.63μm) | Copper Alloy | 0.100" (2.54mm) | Tin-Lead | - | Copper Alloy | |||
|
|
TE Connectivity AMP Connectors |
14,336
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 8POS GOLD
|
Tube | -55°C ~ 125°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Closed Frame | Solder | - | 8 (2 x 4) | 0.100" (2.54mm) | Gold | 25μin (0.63μm) | Copper Alloy | 0.100" (2.54mm) | Gold | 25μin (0.63μm) | Copper Alloy | |||
|
|
TE Connectivity AMP Connectors |
104
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 22POS GOLD
|
Tube | -55°C ~ 125°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Closed Frame | Solder | - | 22 (2 x 11) | 0.100" (2.54mm) | Gold | - | Copper Alloy | 0.100" (2.54mm) | Gold | - | Copper Alloy | |||
|
|
TE Connectivity AMP Connectors |
32
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 8POS GOLD
|
Tube | -55°C ~ 125°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Closed Frame | Solder | - | 8 (2 x 4) | 0.100" (2.54mm) | Gold | - | Copper Alloy | 0.100" (2.54mm) | Gold | - | Copper Alloy | |||
|
|
TE Connectivity AMP Connectors |
64
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 32POS GOLD
|
Tube | -55°C ~ 125°C | Through Hole | DIP，0.6" (15.24mm) Row Spacing | Closed Frame | Solder | - | 32 (2 x 16) | 0.100" (2.54mm) | Gold | - | Beryllium Copper | 0.100" (2.54mm) | - | - | Brass |
