- Packaging：
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- Series：
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- Operating Temperature：
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- Mounting Type：
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- Type：
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- Features：
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- Termination：
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- Housing Material：
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- Number of Positions or Pins (Grid)：
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- Pitch - Mating：
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- Contact Finish - Mating：
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- Contact Finish Thickness - Mating：
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- Pitch - Post：
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- Contact Finish - Post：
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- Contact Finish Thickness - Post：
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- Conditions sélectionnées:
Découvrez les produits 1,178
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Operating Temperature | Mounting Type | Type | Features | Termination | Housing Material | Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Operating Temperature | Mounting Type | Type | Features | Termination | Housing Material | Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | |
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ASSMANN WSW Components |
47,594
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 8POS TIN
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Tube | - | -40°C ~ 105°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Solder | Thermoplastic，Polyester | 8 (2 x 4) | 0.100" (2.54mm) | Tin | - | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | ||
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|
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ASSMANN WSW Components |
8,465
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 14POS TIN
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Tube | - | -40°C ~ 105°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Solder | Thermoplastic，Polyester | 14 (2 x 7) | 0.100" (2.54mm) | Tin | - | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | ||
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ASSMANN WSW Components |
16,495
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 16POS TIN
|
Tube | - | -40°C ~ 105°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Solder | Thermoplastic，Polyester | 16 (2 x 8) | 0.100" (2.54mm) | Tin | - | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | ||
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ASSMANN WSW Components |
7,338
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 28POS TIN
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Tube | - | -40°C ~ 105°C | Through Hole | DIP，0.6" (15.24mm) Row Spacing | Open Frame | Solder | Thermoplastic，Polyester | 28 (2 x 14) | 0.100" (2.54mm) | Tin | - | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | ||
|
|
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ASSMANN WSW Components |
8,981
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 40POS TIN
|
Tube | - | -40°C ~ 105°C | Through Hole | DIP，0.6" (15.24mm) Row Spacing | Open Frame | Solder | Thermoplastic，Polyester | 40 (2 x 20) | 0.100" (2.54mm) | Tin | - | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | ||
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Aries Electronics |
269
|
3 jours |
-
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MOQ: 1 MPQ: 1
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CONN IC DIP SOCKET ZIF 28POS TIN
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Bulk | 55 | - | Through Hole | DIP，ZIF (ZIP)，0.6" (15.24mm) Row Spacing | Closed Frame | Solder | Polyphenylene Sulfide (PPS)，Glass Filled | 28 (2 x 14) | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | ||
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Aries Electronics |
632
|
3 jours |
-
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MOQ: 1 MPQ: 1
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CONN IC DIP SOCKET ZIF 32POS TIN
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Bulk | 55 | - | Through Hole | DIP，ZIF (ZIP)，0.6" (15.24mm) Row Spacing | Closed Frame | Solder | Polyphenylene Sulfide (PPS)，Glass Filled | 32 (2 x 16) | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | ||
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Sullins Connector Solutions |
829
|
3 jours |
-
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MOQ: 1 MPQ: 1
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CONN SOCKET TRANSIST 3POS GOLD
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Bulk | - | -55°C ~ 175°C | Through Hole | Transistor | Board Guide | Solder | Polyphenylene Sulfide (PPS) | 3 (Rectangular) | - | Gold | 30μin (0.76μm) | - | Gold | 30μin (0.76μm) | ||
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Aries Electronics |
364
|
3 jours |
-
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MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET ZIF 24POS GLD
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Bulk | 55 | - | Through Hole | DIP，ZIF (ZIP)，0.6" (15.24mm) Row Spacing | Closed Frame | Solder | Polyphenylene Sulfide (PPS)，Glass Filled | 24 (2 x 12) | 0.100" (2.54mm) | Gold | - | 0.100" (2.54mm) | Gold | - | ||
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Aries Electronics |
182
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET ZIF 40POS TIN
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Bulk | 55 | - | Through Hole | DIP，ZIF (ZIP)，0.6" (15.24mm) Row Spacing | Closed Frame | Solder | Polyphenylene Sulfide (PPS)，Glass Filled | 40 (2 x 20) | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | ||
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Aries Electronics |
2,051
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET ZIF 28POS GLD
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Bulk | 55 | - | Through Hole | DIP，ZIF (ZIP)，0.6" (15.24mm) Row Spacing | Closed Frame | Solder | Polyphenylene Sulfide (PPS)，Glass Filled | 28 (2 x 14) | 0.100" (2.54mm) | Gold | - | 0.100" (2.54mm) | Gold | - | ||
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3M |
1,022
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET ZIF 14POS GLD
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Bulk | Textool | -55°C ~ 125°C | Connector | DIP，ZIF (ZIP)，0.3" (7.62mm) Row Spacing | Closed Frame | Press-Fit | Polysulfone (PSU)，Glass Filled | 14 (2 x 7) | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | ||
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3M |
1,089
|
3 jours |
-
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MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET ZIF 16POS GLD
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Bulk | Textool | -55°C ~ 125°C | Connector | DIP，ZIF (ZIP)，0.3" (7.62mm) Row Spacing | Closed Frame | Press-Fit | Polysulfone (PSU)，Glass Filled | 16 (2 x 8) | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | ||
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|
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3M |
112
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET ZIF 28POS GLD
|
Bulk | Textool | -55°C ~ 125°C | Connector | DIP，ZIF (ZIP)，0.6" (15.24mm) Row Spacing | Closed Frame | Press-Fit | Polysulfone (PSU)，Glass Filled | 28 (2 x 14) | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | ||
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Aries Electronics |
2,009
|
3 jours |
-
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MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET ZIF 48POS GLD
|
Bulk | 55 | - | Through Hole | DIP，ZIF (ZIP)，0.6" (15.24mm) Row Spacing | Closed Frame | Solder | Polyphenylene Sulfide (PPS)，Glass Filled | 48 (2 x 24) | 0.100" (2.54mm) | Gold | - | 0.100" (2.54mm) | Gold | - | ||
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3M |
688
|
3 jours |
-
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MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET ZIF 40POS GLD
|
Bulk | Textool | -55°C ~ 125°C | Connector | DIP，ZIF (ZIP)，0.6" (15.24mm) Row Spacing | Closed Frame | Press-Fit | Polysulfone (PSU)，Glass Filled | 40 (2 x 20) | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | ||
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|
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3M |
683
|
3 jours |
-
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MOQ: 1 MPQ: 1
|
CONN SOCKET SOIC 8POS GOLD
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Bulk | Textool | -55°C ~ 150°C | Through Hole | SOIC | Closed Frame | Solder | Polyethersulfone (PES)，Glass Filled | 8 (2 x 4) | - | Gold | 30μin (0.76μm) | - | Gold | 30μin (0.76μm) | ||
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|
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3M |
1,515
|
3 jours |
-
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MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET ZIF 48POS GLD
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Tube | Textool | -55°C ~ 125°C | Connector | DIP，ZIF (ZIP)，0.6" (15.24mm) Row Spacing | Closed Frame | Press-Fit | Polysulfone (PSU)，Glass Filled | 48 (2 x 24) | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | ||
|
|
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3M |
337
|
3 jours |
-
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MOQ: 1 MPQ: 1
|
CONN SOCKET SOIC 16POS GOLD
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Bulk | Textool | -55°C ~ 150°C | Through Hole | SOIC | Closed Frame | Solder | Polyethersulfone (PES)，Glass Filled | 16 (2 x 8) | - | Gold | - | - | Gold | 30μin (0.76μm) | ||
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|
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3M |
193
|
3 jours |
-
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MOQ: 1 MPQ: 1
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CONN IC DIP SOCKET ZIF 32POS GLD
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Bulk | Textool | -55°C ~ 125°C | Connector | DIP，ZIF (ZIP)，0.6" (15.24mm) Row Spacing | Closed Frame | Press-Fit | Polysulfone (PSU)，Glass Filled | 32 (2 x 16) | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | 0.100" (2.54mm) | Gold | 30μin (0.76μm) |
