- Series：
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- Operating Temperature：
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- Mounting Type：
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- Type：
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- Features：
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- Termination：
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- Housing Material：
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- Number of Positions or Pins (Grid)：
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- Pitch - Mating：
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- Contact Finish Thickness - Mating：
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- Contact Material - Mating：
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- Pitch - Post：
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- Contact Finish Thickness - Post：
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- Contact Material - Post：
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- Conditions sélectionnées:
Découvrez les produits 82
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Series | Operating Temperature | Mounting Type | Type | Features | Termination | Housing Material | Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Series | Operating Temperature | Mounting Type | Type | Features | Termination | Housing Material | Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | |
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3M |
43
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET QFN 88POS GOLD
|
Textool | - | Through Hole | QFN | Open Frame | Solder | Polyethersulfone (PES) | 88 (4 x 22) | 0.016" (0.40mm) | Gold | - | Beryllium Copper | 0.016" (0.40mm) | Gold | - | Beryllium Copper | ||
|
|
|
3M |
130
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET CLCC 68POS GOLD
|
OEM | -55°C ~ 105°C | Through Hole | CLCC | Closed Frame | Solder | Polyphenylene Sulfide (PPS)，Glass Filled | 68 (4 x 17) | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | ||
|
|
|
3M |
20
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET QFN 80POS GOLD
|
Textool | - | Through Hole | QFN | Open Frame | Solder | Polyethersulfone (PES) | 80 (4 x 20) | 0.020" (0.50mm) | Gold | - | Beryllium Copper | 0.020" (0.50mm) | Gold | - | Beryllium Copper | ||
|
|
|
Samtec Inc. |
290
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 14POS GOLD
|
ICA | -55°C ~ 125°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Solder | Polyester，Glass Filled | 14 (2 x 7) | 0.100" (2.54mm) | Gold | 10μin (0.25μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 10μin (0.25μm) | Brass | ||
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|
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Molex，LLC |
Enquête
|
- |
-
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MOQ: 1 MPQ: 1
|
CONN SOCKET LGA 2011POS GOLD
|
105142 | - | Surface Mount | LGA | Open Frame | Solder | Thermoplastic | 2011 (47 x 58) | 0.040" (1.02mm) | Gold | 15μin (0.38μm) | Copper Alloy | 0.040" (1.01mm) | - | - | - | ||
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|
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Molex，LLC |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
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CONN SOCKET LGA 2011POS GOLD
|
105142 | - | Surface Mount | LGA | Open Frame | Solder | Thermoplastic | 2011 (47 x 58) | 0.040" (1.02mm) | Gold | 30μin (0.76μm) | Copper Alloy | 0.040" (1.01mm) | - | - | - | ||
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|
|
3M |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET CLCC 68POS GOLD
|
OEM | -55°C ~ 105°C | Through Hole | CLCC | Closed Frame | Solder | Polyphenylene Sulfide (PPS)，Glass Filled | 68 (4 x 17) | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | ||
|
|
|
3M |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET CLCC 68POS GOLD
|
OEM | -55°C ~ 105°C | Through Hole | CLCC | Closed Frame | Solder | Polyphenylene Sulfide (PPS)，Glass Filled | 68 (4 x 17) | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | ||
|
|
|
3M |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET CLCC 68POS GOLD
|
OEM | -55°C ~ 105°C | Through Hole | CLCC | Closed Frame | Solder | Polyphenylene Sulfide (PPS)，Glass Filled | 68 (4 x 17) | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | ||
|
|
|
TE Connectivity AMP Connectors |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET PGA ZIF 370POS GOLD
|
- | - | Through Hole | PGA，ZIF (ZIP) | Open Frame | Solder | Liquid Crystal Polymer (LCP) | 370 (19 x 19) | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Phosphor Bronze | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Phosphor Bronze | ||
|
|
|
TE Connectivity AMP Connectors |
Enquête
|
- |
-
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MOQ: 1 MPQ: 1
|
CONN SOCKET PGA ZIF 370POS GOLD
|
- | - | Through Hole | PGA，ZIF (ZIP) | Open Frame | Solder | Liquid Crystal Polymer (LCP) | 370 (19 x 19) | 0.100" (2.54mm) | Gold | 15μin (0.38μm) | Phosphor Bronze | 0.100" (2.54mm) | Gold | 15μin (0.38μm) | Phosphor Bronze | ||
|
|
|
TE Connectivity AMP Connectors |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET PGA ZIF 321POS GOLD
|
- | - | Through Hole | PGA，ZIF (ZIP) | Open Frame | Solder | Liquid Crystal Polymer (LCP) | 321 (19 x 19) | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Phosphor Bronze | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Phosphor Bronze | ||
|
|
|
TE Connectivity AMP Connectors |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET PGA ZIF 321POS GOLD
|
- | - | Through Hole | PGA，ZIF (ZIP) | Open Frame | Solder | Liquid Crystal Polymer (LCP) | 321 (19 x 19) | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Phosphor Bronze | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Phosphor Bronze | ||
|
|
|
TE Connectivity AMP Connectors |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET PGA ZIF 321POS GOLD
|
- | - | Through Hole | PGA，ZIF (ZIP) | Open Frame | Solder | Liquid Crystal Polymer (LCP) | 321 (19 x 19) | 0.100" (2.54mm) | Gold | 15μin (0.38μm) | Phosphor Bronze | 0.100" (2.54mm) | Gold | 15μin (0.38μm) | Phosphor Bronze | ||
|
|
|
TE Connectivity AMP Connectors |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET SIP 4POS TIN
|
Diplomate DL | -55°C ~ 105°C | Through Hole | SIP | Closed Frame | Solder | Thermoplastic，Glass Filled | 4 (1 x 4) | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | ||
|
|
|
TE Connectivity AMP Connectors |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET SIP 3POS TIN
|
Diplomate DL | -55°C ~ 105°C | Through Hole | SIP | - | Solder | Thermoplastic，Glass Filled | 3 (1 x 3) | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | ||
|
|
|
TE Connectivity AMP Connectors |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET PGA ZIF 321POS GOLD
|
- | - | Through Hole | PGA，ZIF (ZIP) | Open Frame | Solder | Thermoplastic | 321 (19 x 19) | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Copper Alloy | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Copper Alloy | ||
|
|
|
TE Connectivity AMP Connectors |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET SIP 3POS TIN
|
Diplomate DL | -55°C ~ 105°C | Through Hole | SIP | - | Solder | Thermoplastic，Glass Filled | 3 (1 x 3) | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | ||
|
|
|
Molex，LLC |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET LGA 1366POS GOLD
|
47594 | - | Surface Mount | LGA | Open Frame | Solder | Liquid Crystal Polymer (LCP) | 1366 (32 x 41) | 0.040" (1.02mm) | Gold | 15μin (0.38μm) | Copper Alloy | 0.040" (1.01mm) | - | - | - | ||
|
|
|
Molex，LLC |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET LGA 1366POS GOLD
|
47594 | - | Surface Mount | LGA | Open Frame | Solder | Liquid Crystal Polymer (LCP) | 1366 (32 x 41) | 0.040" (1.02mm) | Gold | 30μin (0.76μm) | Copper Alloy | 0.040" (1.01mm) | - | - | - |
