- Operating Temperature：
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- Features：
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- Termination：
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- Housing Material：
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- Number of Positions or Pins (Grid)：
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- Pitch - Mating：
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- Contact Finish Thickness - Mating：
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- Contact Material - Mating：
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- Pitch - Post：
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- Contact Finish - Post：
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- Contact Finish Thickness - Post：
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- Contact Material - Post：
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- Conditions sélectionnées:
Découvrez les produits 13
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Operating Temperature | Features | Termination | Housing Material | Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Operating Temperature | Features | Termination | Housing Material | Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | |
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Mill-Max Manufacturing Corp. |
83
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 64POS GOLD
|
Tube | 117 | -55°C ~ 125°C | Closed Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 64 (2 x 32) | 0.070" (1.78mm) | 30μin (0.76μm) | Beryllium Copper | 0.070" (1.78mm) | Tin-Lead | 200μin (5.08μm) | Brass Alloy | ||
|
|
|
Mill-Max Manufacturing Corp. |
66
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 64POS GOLD
|
Tube | 117 | -55°C ~ 125°C | Open Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 64 (2 x 32) | 0.070" (1.78mm) | 30μin (0.76μm) | Beryllium Copper | 0.070" (1.78mm) | Tin | 200μin (5.08μm) | Brass Alloy | ||
|
|
|
Mill-Max Manufacturing Corp. |
52
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 64POS GOLD
|
Tube | 117 | -55°C ~ 125°C | Open Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 64 (2 x 32) | 0.070" (1.78mm) | Flash | Beryllium Copper | 0.070" (1.78mm) | Tin | 200μin (5.08μm) | Brass Alloy | ||
|
|
Preci-Dip |
359
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 64POS GOLD
|
Tube | 117 | -55°C ~ 125°C | Open Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester，Glass Filled | 64 (2 x 32) | 0.070" (1.78mm) | Flash | Beryllium Copper | 0.070" (1.78mm) | Tin | - | Brass | |||
|
|
Preci-Dip |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 64POS GOLD
|
Tube | 117 | -55°C ~ 125°C | Open Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester，Glass Filled | 64 (2 x 32) | 0.070" (1.78mm) | 29.5μin (0.75μm) | Beryllium Copper | 0.070" (1.78mm) | Tin | - | Brass | |||
|
|
Preci-Dip |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 64POS GOLD
|
Tube | 117 | -55°C ~ 125°C | Open Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester，Glass Filled | 64 (2 x 32) | 0.070" (1.78mm) | Flash | Beryllium Copper | 0.070" (1.78mm) | Tin | - | Brass | |||
|
|
|
Samtec Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 64POS GOLD
|
Tube | HIC | - | Open Frame | Solder | Polyester，Glass Filled | 64 (2 x 32) | 0.070" (1.78mm) | 10μin (0.25μm) | Beryllium Copper | 0.070" (1.78mm) | Gold | 200μin (5.08μm) | Brass | ||
|
|
|
Harwin Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 64POS GOLD
|
Tube | D8864 | -55°C ~ 125°C | Open Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Glass Filled | 64 (2 x 32) | 0.070" (1.78mm) | Flash | Beryllium Copper | 0.070" (1.78mm) | Tin | 196.8μin (5.00μm) | Brass | ||
|
|
Preci-Dip |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 64POS GOLD
|
Tube | 117 | -55°C ~ 125°C | Open Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester，Glass Filled | 64 (2 x 32) | 0.070" (1.78mm) | 29.5μin (0.75μm) | Beryllium Copper | 0.070" (1.78mm) | Tin | - | Brass | |||
|
|
|
Mill-Max Manufacturing Corp. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 64POS GOLD
|
Tube | 217 | -55°C ~ 125°C | Closed Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 64 (2 x 32) | 0.070" (1.78mm) | 30μin (0.76μm) | Beryllium Copper | 0.070" (1.78mm) | Tin-Lead | 200μin (5.08μm) | Brass Alloy | ||
|
|
|
Mill-Max Manufacturing Corp. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 64POS GOLD
|
Tube | 127 | -55°C ~ 125°C | Open Frame | Wire Wrap | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 64 (2 x 32) | 0.070" (1.78mm) | 30μin (0.76μm) | Beryllium Copper | 0.070" (1.78mm) | Tin-Lead | 200μin (5.08μm) | Brass Alloy | ||
|
|
|
Mill-Max Manufacturing Corp. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 64POS GOLD
|
Tube | 127 | -55°C ~ 125°C | Open Frame | Wire Wrap | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 64 (2 x 32) | 0.070" (1.78mm) | 30μin (0.76μm) | Beryllium Copper | 0.070" (1.78mm) | Tin-Lead | 200μin (5.08μm) | Brass Alloy | ||
|
|
TE Connectivity AMP Connectors |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 7POS GOLD
|
Bulk | 800 | -55°C ~ 105°C | Open Frame | Solder | Polyester | 7 (1 x 7) | 0.100" (2.54mm) | 25μin (0.63μm) | Copper Alloy | 0.100" (2.54mm) | Tin-Lead | 80μin (2.03μm) | Copper Alloy |
