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- Conditions sélectionnées:
Découvrez les produits 1,960
 |
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Operating Temperature | Mounting Type | Type | Features | Termination | Housing Material | Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Post | Contact Finish - Post | Contact Material - Post | |
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Operating Temperature | Mounting Type | Type | Features | Termination | Housing Material | Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Post | Contact Finish - Post | Contact Material - Post | |
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Mill-Max Manufacturing Corp. |
2,928
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 14POS GOLD
|
Tube | 110 | -55°C ~ 125°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 14 (2 x 7) | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Gold | Brass Alloy | ||
|
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Mill-Max Manufacturing Corp. |
7,762
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 16POS GOLD
|
Tube | 110 | -55°C ~ 125°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 16 (2 x 8) | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Gold | Brass Alloy | ||
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Aries Electronics |
104
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 14POS GOLD
|
Bulk | Vertisockets 800 | - | Through Hole，Right Angle，Vertical | DIP，0.3" (7.62mm) Row Spacing | Closed Frame | Solder | Polyamide (PA46)，Nylon 4/6 | 14 (2 x 7) | 0.100" (2.54mm) | Gold | 10μin (0.25μm) | Phosphor Bronze | 0.100" (2.54mm) | Gold | Phosphor Bronze | ||
|
|
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Mill-Max Manufacturing Corp. |
243
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 20POS GOLD
|
Tube | 110 | -55°C ~ 125°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 20 (2 x 10) | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Gold | Brass Alloy | ||
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Mill-Max Manufacturing Corp. |
1,249
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 24POS GOLD
|
Tube | 110 | -55°C ~ 125°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 24 (2 x 12) | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Gold | Brass Alloy | ||
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|
|
Mill-Max Manufacturing Corp. |
402
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 24POS GOLD
|
Tube | 110 | -55°C ~ 125°C | Through Hole | DIP，0.6" (15.24mm) Row Spacing | Open Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 24 (2 x 12) | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Gold | Brass Alloy | ||
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Mill-Max Manufacturing Corp. |
423
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 28POS GOLD
|
Tube | 110 | -55°C ~ 125°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 28 (2 x 14) | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Gold | Brass Alloy | ||
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Mill-Max Manufacturing Corp. |
323
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 28POS GOLD
|
Tube | 110 | -55°C ~ 125°C | Through Hole | DIP，0.6" (15.24mm) Row Spacing | Open Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 28 (2 x 14) | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Gold | Brass Alloy | ||
|
|
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Mill-Max Manufacturing Corp. |
266
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 20POS GOLD
|
Tube | 110 | -55°C ~ 125°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame，Decoupling Capacitor | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 20 (2 x 10) | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Gold | Brass Alloy | ||
|
|
|
Mill-Max Manufacturing Corp. |
459
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 40POS GOLD
|
Tube | 110 | -55°C ~ 125°C | Through Hole | DIP，0.6" (15.24mm) Row Spacing | Open Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 40 (2 x 20) | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Gold | Brass Alloy | ||
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Aries Electronics |
743
|
3 jours |
-
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MOQ: 1 MPQ: 1
|
CONN SOCKET SIP 40POS GOLD
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Bulk | 518 | - | Through Hole | SIP | Open Frame | Solder | Polyamide (PA46)，Nylon 4/6，Glass Filled | 40 (1 x 40) | 0.100" (2.54mm) | Gold | 10μin (0.25μm) | Beryllium Copper | 0.100" (2.54mm) | Gold | Brass | ||
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Aries Electronics |
115
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET ZIF 28POS TIN
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Bulk | Lo-PROfile，526 | -55°C ~ 105°C | Through Hole | DIP，ZIF (ZIP) | Closed Frame | Solder | Polyamide (PA46)，Nylon 4/6，Glass Filled | 28 (2 x 14) | 0.100" (2.54mm) | Tin | 10μin (0.25μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | Beryllium Copper | ||
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Aries Electronics |
107
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET ZIF 40POS TIN
|
Bulk | Lo-PROfile，526 | -55°C ~ 105°C | Through Hole | DIP，ZIF (ZIP) | Closed Frame | Solder | Polyamide (PA46)，Nylon 4/6，Glass Filled | 40 (2 x 20) | 0.100" (2.54mm) | Tin | 10μin (0.25μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | Beryllium Copper | ||
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Omron Electronics Inc-EMC Div |
249
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 24POS GOLD
|
Bulk | XR2 | -55°C ~ 125°C | Through Hole | DIP，0.6" (15.24mm) Row Spacing | Open Frame | Solder | Polybutylene Terephthalate (PBT)，Glass Filled | 24 (2 x 12) | 0.100" (2.54mm) | Gold | 10μin (0.25μm) | Beryllium Copper | 0.100" (2.54mm) | Gold | Beryllium Copper | ||
|
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Mill-Max Manufacturing Corp. |
228
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 14POS GOLD
|
Tube | 123 | -55°C ~ 125°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Wire Wrap | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 14 (2 x 7) | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Gold | Brass Alloy | ||
|
|
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Mill-Max Manufacturing Corp. |
126
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 32POS GOLD
|
Tube | 110 | -55°C ~ 125°C | Through Hole | DIP，0.6" (15.24mm) Row Spacing | Open Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 32 (2 x 16) | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Gold | Brass Alloy | ||
|
|
|
Mill-Max Manufacturing Corp. |
709
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 24POS GOLD
|
Tube | 110 | -55°C ~ 125°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame，Decoupling Capacitor | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 24 (2 x 12) | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Gold | Brass Alloy | ||
|
|
|
Aries Electronics |
127
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 16POS GOLD
|
Bulk | Vertisockets 800 | - | Through Hole，Right Angle，Horizontal | DIP，0.3" (7.62mm) Row Spacing | Closed Frame | Solder | Polyamide (PA46)，Nylon 4/6 | 16 (2 x 8) | 0.100" (2.54mm) | Gold | 10μin (0.25μm) | Phosphor Bronze | 0.100" (2.54mm) | Gold | Phosphor Bronze | ||
|
|
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Aries Electronics |
1,234
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 10POS GOLD
|
Bulk | Vertisockets 800 | - | Through Hole，Right Angle，Vertical | DIP，0.2" (5.08mm) Row Spacing | Closed Frame | Solder | Polyamide (PA46)，Nylon 4/6 | 10 (2 x 5) | 0.100" (2.54mm) | Gold | 10μin (0.25μm) | Phosphor Bronze | 0.100" (2.54mm) | Gold | Phosphor Bronze | ||
|
|
|
Mill-Max Manufacturing Corp. |
226
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 40POS GOLD
|
Tube | 110 | -55°C ~ 125°C | Through Hole | DIP，0.6" (15.24mm) Row Spacing | Open Frame，Decoupling Capacitor | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 40 (2 x 20) | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Gold | Brass Alloy |
