- Series:
-
- Operating Temperature:
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- Mounting Type:
-
- Features:
-
- Termination:
-
- Housing Material:
-
- Pitch - Mating:
-
- Contact Finish Thickness - Mating:
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- Contact Material - Mating:
-
- Pitch - Post:
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- Contact Finish - Post:
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- Contact Finish Thickness - Post:
-
- Contact Material - Post:
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- Conditions sélectionnées:
Découvrez les produits 44
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Operating Temperature | Mounting Type | Type | Features | Termination | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Operating Temperature | Mounting Type | Type | Features | Termination | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | ||
Aries Electronics |
126
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET SIP 7POS GOLD
|
Bulk | 513 | - | Through Hole | SIP | - | Solder | Polyamide (PA46),Nylon 4/6,Glass Filled | 0.100" (2.54mm) | Gold | 10μin (0.25μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass | ||||
Mill-Max Manufacturing Corp. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET SIP 7POS GOLD
|
Bulk | 346 | -55°C ~ 125°C | Through Hole | SIP | - | Press-Fit | Polycyclohexylenedimethylene Terephthalate (PCT),Polyester | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Tin-Lead | 200μin (5.08μm) | Brass Alloy | ||||
Mill-Max Manufacturing Corp. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET SIP 7POS GOLD
|
Bulk | 346 | -55°C ~ 125°C | Through Hole | SIP | - | Press-Fit | Polycyclohexylenedimethylene Terephthalate (PCT),Polyester | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass Alloy | ||||
Mill-Max Manufacturing Corp. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET SIP 7POS GOLD
|
Bulk | 714 | -55°C ~ 125°C | Through Hole | SIP | - | Solder | Polycyclohexylenedimethylene Terephthalate (PCT),Polyester | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Brass Alloy | ||||
Mill-Max Manufacturing Corp. |
487
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET SIP 7POS GOLD
|
Tube | 310 | -55°C ~ 125°C | Through Hole | SIP | - | Solder | Polycyclohexylenedimethylene Terephthalate (PCT),Polyester | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass Alloy | ||||
Harwin Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET SIP 7POS GOLD
|
Bulk | D01-997 | -55°C ~ 125°C | Through Hole | SIP | - | Solder | Polycyclohexylenedimethylene Terephthalate (PCT),Glass Filled | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Tin | 196.8μin (5.00μm) | Brass | ||||
Aries Electronics |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET SIP 7POS GOLD
|
Bulk | 518 | - | Through Hole | SIP | Open Frame | Solder | Polyamide (PA46),Nylon 4/6,Glass Filled | 0.100" (2.54mm) | Gold | 10μin (0.25μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass | ||||
Aries Electronics |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET SIP 7POS GOLD
|
Bulk | 518 | - | Through Hole | SIP | Open Frame | Solder | Polyamide (PA46),Nylon 4/6,Glass Filled | 0.100" (2.54mm) | Gold | 10μin (0.25μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass | ||||
Aries Electronics |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET SIP 7POS GOLD
|
Bulk | 518 | - | Through Hole | SIP | Open Frame | Solder | Polyamide (PA46),Nylon 4/6,Glass Filled | 0.100" (2.54mm) | Gold | 10μin (0.25μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass | ||||
Aries Electronics |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET SIP 7POS GOLD
|
Bulk | 513 | - | Through Hole | SIP | - | Solder | Polyamide (PA46),Nylon 4/6,Glass Filled | 0.100" (2.54mm) | Gold | 10μin (0.25μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass | ||||
Aries Electronics |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET SIP 7POS GOLD
|
Bulk | 518 | - | Through Hole | SIP | Open Frame | Solder | Polyamide (PA46),Nylon 4/6,Glass Filled | 0.100" (2.54mm) | Gold | 10μin (0.25μm) | Beryllium Copper | 0.100" (2.54mm) | Gold | 10μin (0.25μm) | Brass | ||||
Harwin Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET SIP 7POS GOLD
|
Bulk | D01-995 | -55°C ~ 125°C | Through Hole | SIP | - | Wire Wrap | Polycyclohexylenedimethylene Terephthalate (PCT),Glass Filled | 0.100" (2.54mm) | Gold | 10μin (0.25μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 196.8μin (5.00μm) | Brass | ||||
Aries Electronics |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET SIP 7POS GOLD
|
Bulk | 518 | - | Surface Mount | SIP | Open Frame | Solder | Polyamide (PA46),Nylon 4/6,Glass Filled | 0.100" (2.54mm) | Gold | 10μin (0.25μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass | ||||
Aries Electronics |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET SIP 7POS GOLD
|
Bulk | 513 | - | Through Hole | SIP | - | Solder | Polyamide (PA46),Nylon 4/6,Glass Filled | 0.100" (2.54mm) | Gold | 10μin (0.25μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass | ||||
Aries Electronics |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET SIP 7POS GOLD
|
Bulk | 513 | - | Through Hole | SIP | - | Solder | Polyamide (PA46),Nylon 4/6,Glass Filled | 0.100" (2.54mm) | Gold | 10μin (0.25μm) | Beryllium Copper | 0.100" (2.54mm) | Gold | 10μin (0.25μm) | Brass | ||||
Aries Electronics |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET SIP 7POS GOLD
|
Bulk | 518 | - | Through Hole | SIP | Open Frame | Solder | Polyamide (PA46),Nylon 4/6,Glass Filled | 0.100" (2.54mm) | Gold | 10μin (0.25μm) | Beryllium Copper | 0.100" (2.54mm) | Gold | 10μin (0.25μm) | Brass | ||||
Aries Electronics |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET SIP 7POS GOLD
|
Bulk | 513 | - | Through Hole | SIP | - | Solder | Polyamide (PA46),Nylon 4/6,Glass Filled | 0.100" (2.54mm) | Gold | 10μin (0.25μm) | Beryllium Copper | 0.100" (2.54mm) | Gold | 10μin (0.25μm) | Brass | ||||
Aries Electronics |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET SIP 7POS GOLD
|
Bulk | 517 | - | Through Hole,Right Angle | SIP | - | Solder | Polyamide (PA46),Nylon 4/6,Glass Filled | - | Gold | 30μin (0.76μm) | Beryllium Copper | - | Tin | 200μin (5.08μm) | Brass | ||||
Aries Electronics |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET SIP 7POS GOLD
|
Bulk | 508 | -55°C ~ 105°C | Through Hole | SIP | - | Wire Wrap | Polyamide (PA46),Nylon 4/6 | 0.100" (2.54mm) | Gold | 10μin (0.25μm) | Beryllium Copper | - | Tin | 200μin (5.08μm) | Brass | ||||
Aries Electronics |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET SIP 7POS GOLD
|
Bulk | 508 | -55°C ~ 105°C | Through Hole | SIP | - | Wire Wrap | Polyamide (PA46),Nylon 4/6 | 0.100" (2.54mm) | Gold | 10μin (0.25μm) | Beryllium Copper | - | Tin | 200μin (5.08μm) | Brass |