Fabricant:
Packaging:
Pitch - Mating:
Contact Finish - Mating:
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Découvrez les produits 44
Image Numéro de pièce Fabricant Quantité Délai de livraison Prix ​​unitaire Acheter Description Packaging Series Operating Temperature Mounting Type Type Features Termination Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post
07-0513-10
Aries Electronics
126
3 jours
-
MOQ: 1  MPQ: 1
CONN SOCKET SIP 7POS GOLD
Bulk 513 - Through Hole SIP - Solder Polyamide (PA46),Nylon 4/6,Glass Filled 0.100" (2.54mm) Gold 10μin (0.25μm) Beryllium Copper 0.100" (2.54mm) Tin 200μin (5.08μm) Brass
346-93-107-41-013000
Mill-Max Manufacturing Corp.
Enquête
-
-
MOQ: 1  MPQ: 1
CONN SOCKET SIP 7POS GOLD
Bulk 346 -55°C ~ 125°C Through Hole SIP - Press-Fit Polycyclohexylenedimethylene Terephthalate (PCT),Polyester 0.100" (2.54mm) Gold 30μin (0.76μm) Beryllium Copper 0.100" (2.54mm) Tin-Lead 200μin (5.08μm) Brass Alloy
346-43-107-41-013000
Mill-Max Manufacturing Corp.
Enquête
-
-
MOQ: 1  MPQ: 1
CONN SOCKET SIP 7POS GOLD
Bulk 346 -55°C ~ 125°C Through Hole SIP - Press-Fit Polycyclohexylenedimethylene Terephthalate (PCT),Polyester 0.100" (2.54mm) Gold 30μin (0.76μm) Beryllium Copper 0.100" (2.54mm) Tin 200μin (5.08μm) Brass Alloy
714-43-107-31-018000
Mill-Max Manufacturing Corp.
Enquête
-
-
MOQ: 1  MPQ: 1
CONN SOCKET SIP 7POS GOLD
Bulk 714 -55°C ~ 125°C Through Hole SIP - Solder Polycyclohexylenedimethylene Terephthalate (PCT),Polyester 0.100" (2.54mm) Gold 30μin (0.76μm) Beryllium Copper 0.100" (2.54mm) Gold 30μin (0.76μm) Brass Alloy
310-47-107-41-001000
Mill-Max Manufacturing Corp.
487
3 jours
-
MOQ: 1  MPQ: 1
CONN SOCKET SIP 7POS GOLD
Tube 310 -55°C ~ 125°C Through Hole SIP - Solder Polycyclohexylenedimethylene Terephthalate (PCT),Polyester 0.100" (2.54mm) Gold Flash Beryllium Copper 0.100" (2.54mm) Tin 200μin (5.08μm) Brass Alloy
D01-9970742
Harwin Inc.
Enquête
-
-
MOQ: 1  MPQ: 1
CONN SOCKET SIP 7POS GOLD
Bulk D01-997 -55°C ~ 125°C Through Hole SIP - Solder Polycyclohexylenedimethylene Terephthalate (PCT),Glass Filled 0.100" (2.54mm) Gold Flash Beryllium Copper 0.100" (2.54mm) Tin 196.8μin (5.00μm) Brass
07-0518-10
Aries Electronics
Enquête
-
-
MOQ: 1  MPQ: 1
CONN SOCKET SIP 7POS GOLD
Bulk 518 - Through Hole SIP Open Frame Solder Polyamide (PA46),Nylon 4/6,Glass Filled 0.100" (2.54mm) Gold 10μin (0.25μm) Beryllium Copper 0.100" (2.54mm) Tin 200μin (5.08μm) Brass
07-0518-10T
Aries Electronics
Enquête
-
-
MOQ: 1  MPQ: 1
CONN SOCKET SIP 7POS GOLD
Bulk 518 - Through Hole SIP Open Frame Solder Polyamide (PA46),Nylon 4/6,Glass Filled 0.100" (2.54mm) Gold 10μin (0.25μm) Beryllium Copper 0.100" (2.54mm) Tin 200μin (5.08μm) Brass
07-0518-10H
Aries Electronics
Enquête
-
-
MOQ: 1  MPQ: 1
CONN SOCKET SIP 7POS GOLD
Bulk 518 - Through Hole SIP Open Frame Solder Polyamide (PA46),Nylon 4/6,Glass Filled 0.100" (2.54mm) Gold 10μin (0.25μm) Beryllium Copper 0.100" (2.54mm) Tin 200μin (5.08μm) Brass
07-0513-10T
Aries Electronics
Enquête
-
-
MOQ: 1  MPQ: 1
CONN SOCKET SIP 7POS GOLD
Bulk 513 - Through Hole SIP - Solder Polyamide (PA46),Nylon 4/6,Glass Filled 0.100" (2.54mm) Gold 10μin (0.25μm) Beryllium Copper 0.100" (2.54mm) Tin 200μin (5.08μm) Brass
07-0518-11
Aries Electronics
Enquête
-
-
MOQ: 1  MPQ: 1
CONN SOCKET SIP 7POS GOLD
Bulk 518 - Through Hole SIP Open Frame Solder Polyamide (PA46),Nylon 4/6,Glass Filled 0.100" (2.54mm) Gold 10μin (0.25μm) Beryllium Copper 0.100" (2.54mm) Gold 10μin (0.25μm) Brass
D01-9950742
Harwin Inc.
Enquête
-
-
MOQ: 1  MPQ: 1
CONN SOCKET SIP 7POS GOLD
Bulk D01-995 -55°C ~ 125°C Through Hole SIP - Wire Wrap Polycyclohexylenedimethylene Terephthalate (PCT),Glass Filled 0.100" (2.54mm) Gold 10μin (0.25μm) Beryllium Copper 0.100" (2.54mm) Tin 196.8μin (5.00μm) Brass
07-0518-00
Aries Electronics
Enquête
-
-
MOQ: 1  MPQ: 1
CONN SOCKET SIP 7POS GOLD
Bulk 518 - Surface Mount SIP Open Frame Solder Polyamide (PA46),Nylon 4/6,Glass Filled 0.100" (2.54mm) Gold 10μin (0.25μm) Beryllium Copper 0.100" (2.54mm) Tin 200μin (5.08μm) Brass
07-0513-10H
Aries Electronics
Enquête
-
-
MOQ: 1  MPQ: 1
CONN SOCKET SIP 7POS GOLD
Bulk 513 - Through Hole SIP - Solder Polyamide (PA46),Nylon 4/6,Glass Filled 0.100" (2.54mm) Gold 10μin (0.25μm) Beryllium Copper 0.100" (2.54mm) Tin 200μin (5.08μm) Brass
07-0513-11
Aries Electronics
Enquête
-
-
MOQ: 1  MPQ: 1
CONN SOCKET SIP 7POS GOLD
Bulk 513 - Through Hole SIP - Solder Polyamide (PA46),Nylon 4/6,Glass Filled 0.100" (2.54mm) Gold 10μin (0.25μm) Beryllium Copper 0.100" (2.54mm) Gold 10μin (0.25μm) Brass
07-0518-11H
Aries Electronics
Enquête
-
-
MOQ: 1  MPQ: 1
CONN SOCKET SIP 7POS GOLD
Bulk 518 - Through Hole SIP Open Frame Solder Polyamide (PA46),Nylon 4/6,Glass Filled 0.100" (2.54mm) Gold 10μin (0.25μm) Beryllium Copper 0.100" (2.54mm) Gold 10μin (0.25μm) Brass
07-0513-11H
Aries Electronics
Enquête
-
-
MOQ: 1  MPQ: 1
CONN SOCKET SIP 7POS GOLD
Bulk 513 - Through Hole SIP - Solder Polyamide (PA46),Nylon 4/6,Glass Filled 0.100" (2.54mm) Gold 10μin (0.25μm) Beryllium Copper 0.100" (2.54mm) Gold 10μin (0.25μm) Brass
07-0517-90C
Aries Electronics
Enquête
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-
MOQ: 1  MPQ: 1
CONN SOCKET SIP 7POS GOLD
Bulk 517 - Through Hole,Right Angle SIP - Solder Polyamide (PA46),Nylon 4/6,Glass Filled - Gold 30μin (0.76μm) Beryllium Copper - Tin 200μin (5.08μm) Brass
07-0508-20
Aries Electronics
Enquête
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-
MOQ: 1  MPQ: 1
CONN SOCKET SIP 7POS GOLD
Bulk 508 -55°C ~ 105°C Through Hole SIP - Wire Wrap Polyamide (PA46),Nylon 4/6 0.100" (2.54mm) Gold 10μin (0.25μm) Beryllium Copper - Tin 200μin (5.08μm) Brass
07-0508-30
Aries Electronics
Enquête
-
-
MOQ: 1  MPQ: 1
CONN SOCKET SIP 7POS GOLD
Bulk 508 -55°C ~ 105°C Through Hole SIP - Wire Wrap Polyamide (PA46),Nylon 4/6 0.100" (2.54mm) Gold 10μin (0.25μm) Beryllium Copper - Tin 200μin (5.08μm) Brass