- Operating Temperature：
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- Type：
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- Features：
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- Housing Material：
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- Number of Positions or Pins (Grid)：
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- Pitch - Mating：
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- Contact Finish - Mating：
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- Contact Finish Thickness - Mating：
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- Contact Material - Mating：
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- Pitch - Post：
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- Contact Finish - Post：
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- Contact Material - Post：
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- Conditions sélectionnées:
Découvrez les produits 38
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Operating Temperature | Mounting Type | Type | Features | Housing Material | Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Post | Contact Finish - Post | Contact Material - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Operating Temperature | Mounting Type | Type | Features | Housing Material | Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Post | Contact Finish - Post | Contact Material - Post | |
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Aries Electronics |
16
|
3 jours |
-
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MOQ: 1 MPQ: 1
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CONN SOCKET SOIC ZIF 44POS GOLD
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Bulk | 547 | - | Through Hole | SOIC，ZIF (ZIP) | Closed Frame | Polyphenylene Sulfide (PPS)，Glass Filled | 44 (2 x 22) | - | Gold | 20μin (0.51μm) | Beryllium Copper | 0.050" (1.27mm) | Gold | Beryllium Copper | ||
|
|
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Aries Electronics |
8
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET SOIC ZIF 44POS GOLD
|
Bulk | 547 | - | Through Hole | SOIC，ZIF (ZIP) | Closed Frame | Polyphenylene Sulfide (PPS)，Glass Filled | 44 (2 x 22) | - | Gold | 20μin (0.51μm) | Beryllium Copper | 0.050" (1.27mm) | Gold | Beryllium Copper | ||
|
|
TE Connectivity AMP Connectors |
2,223
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 8POS GOLD
|
Tube | 800 | -55°C ~ 105°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 8 (2 x 4) | 0.100" (2.54mm) | Gold | 20μin (0.51μm) | Beryllium Copper | 0.100" (2.54mm) | Gold | Copper | |||
|
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TE Connectivity AMP Connectors |
2,752
|
3 jours |
-
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MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 16POS GOLD
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Tube | 800 | -55°C ~ 105°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 16 (2 x 8) | 0.100" (2.54mm) | Gold | 20μin (0.51μm) | Beryllium Copper | 0.100" (2.54mm) | Gold | Copper | |||
|
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TE Connectivity AMP Connectors |
2,999
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 14POS GOLD
|
Tube | 800 | -55°C ~ 105°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 14 (2 x 7) | 0.100" (2.54mm) | Gold | 20μin (0.51μm) | Beryllium Copper | 0.100" (2.54mm) | Gold | Copper | |||
|
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TE Connectivity AMP Connectors |
2,434
|
3 jours |
-
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MOQ: 1 MPQ: 1
|
CONN SOCKET SIP 10POS GOLD
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Bulk | 510 | - | Through Hole | SIP | Closed Frame | Thermoplastic，Polyester | 10 (1 x 10) | 0.100" (2.54mm) | Gold | 20μin (0.51μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | Copper | |||
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TE Connectivity AMP Connectors |
1,107
|
3 jours |
-
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MOQ: 1 MPQ: 1
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CONN IC DIP SOCKET 28POS GOLD
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Tube | 800 | -55°C ~ 105°C | Through Hole | DIP，0.6" (15.24mm) Row Spacing | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 28 (2 x 14) | 0.100" (2.54mm) | Gold | 20μin (0.51μm) | Beryllium Copper | 0.100" (2.54mm) | Gold | Copper | |||
|
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TE Connectivity AMP Connectors |
1,227
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET SIP 20POS GOLD
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Bulk | 510 | - | Through Hole | SIP | Closed Frame | Thermoplastic，Polyester | 20 (1 x 20) | 0.100" (2.54mm) | Gold | 20μin (0.51μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | Copper | |||
|
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TE Connectivity AMP Connectors |
159
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 32POS GOLD
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Tube | 800 | -55°C ~ 105°C | Through Hole | DIP，0.6" (15.24mm) Row Spacing | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 32 (2 x 16) | 0.100" (2.54mm) | Gold | 20μin (0.51μm) | Beryllium Copper | 0.100" (2.54mm) | Gold | Copper | |||
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TE Connectivity AMP Connectors |
Enquête
|
- |
-
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MOQ: 1 MPQ: 1
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CONN SOCKET SIP 20POS TIN
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Bulk | 510 | - | Through Hole | SIP | Closed Frame | Thermoplastic，Polyester | 20 (2 x 10) | 0.100" (2.54mm) | Tin | - | Beryllium Copper | 0.100" (2.54mm) | Tin | Copper | |||
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TE Connectivity AMP Connectors |
Enquête
|
- |
-
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MOQ: 1 MPQ: 1
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CONN SOCKET TRANSIST TO-3 3POS
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Bulk | - | -55°C ~ 125°C | Chassis Mount | Transistor，TO-3 | Closed Frame | Diallyl Phthalate (DAP) | 3 (Round) | - | Tin-Lead | 20μin (0.51μm) | Beryllium Copper | - | Tin-Lead | Beryllium Copper | ||
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Samtec Inc. |
Enquête
|
- |
-
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MOQ: 1 MPQ: 1
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CONN ADAPTER PLUG 28POS GOLD
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Bulk | APA | - | Through Hole | - | Open Frame | Polybutylene Terephthalate (PBT)，Glass Filled | 28 (2 x 14) | 0.100" (2.54mm) | Gold | 20μin (0.51μm) | Phosphor Bronze | 0.100" (2.54mm) | Gold | Phosphor Bronze | ||
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|
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TE Connectivity AMP Connectors |
Enquête
|
- |
-
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MOQ: 1 MPQ: 1
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CONN IC DIP SOCKET 20POS GOLD
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- | 700 | -55°C ~ 125°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Closed Frame | Aluminum Alloy | 20 (2 x 10) | 0.100" (2.54mm) | Gold | 20μin (0.51μm) | Beryllium Copper | 0.100" (2.54mm) | Gold | Beryllium Copper | ||
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|
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TE Connectivity AMP Connectors |
Enquête
|
- |
-
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MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 8POS GOLD
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- | 700 | -55°C ~ 125°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Closed Frame | Aluminum Alloy | 8 (2 x 4) | 0.100" (2.54mm) | Gold | 20μin (0.51μm) | Beryllium Copper | 0.100" (2.54mm) | Gold | Beryllium Copper | ||
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|
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TE Connectivity AMP Connectors |
Enquête
|
- |
-
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MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 8POS GOLD
|
- | 700 | -55°C ~ 125°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Closed Frame | Aluminum Alloy | 8 (2 x 4) | 0.100" (2.54mm) | Gold | 20μin (0.51μm) | Beryllium Copper | 0.100" (2.54mm) | Gold | Beryllium Copper | ||
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|
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TE Connectivity AMP Connectors |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 16POS GOLD
|
- | 700 | -55°C ~ 125°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Closed Frame | Aluminum Alloy | 16 (2 x 8) | 0.100" (2.54mm) | Gold | 20μin (0.51μm) | Beryllium Copper | 0.100" (2.54mm) | Gold | Beryllium Copper | ||
|
|
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TE Connectivity AMP Connectors |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 6POS GOLD
|
- | 700 | -55°C ~ 125°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Closed Frame | Aluminum Alloy | 6 (2 x 3) | 0.100" (2.54mm) | Gold | 20μin (0.51μm) | Beryllium Copper | 0.100" (2.54mm) | Gold | Beryllium Copper | ||
|
|
|
TE Connectivity AMP Connectors |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 20POS GOLD
|
- | 700 | -55°C ~ 125°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Closed Frame | Aluminum Alloy | 20 (2 x 10) | 0.100" (2.54mm) | Gold | 20μin (0.51μm) | Beryllium Copper | 0.100" (2.54mm) | Gold | Beryllium Copper | ||
|
|
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TE Connectivity AMP Connectors |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 24POS GOLD
|
- | 700 | -55°C ~ 125°C | Through Hole | DIP，0.6" (15.24mm) Row Spacing | Closed Frame | Aluminum Alloy | 24 (2 x 12) | 0.100" (2.54mm) | Gold | 20μin (0.51μm) | Beryllium Copper | 0.100" (2.54mm) | Gold | Beryllium Copper | ||
|
|
|
TE Connectivity AMP Connectors |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 28POS GOLD
|
- | 700 | -55°C ~ 125°C | Through Hole | DIP，0.6" (15.24mm) Row Spacing | Closed Frame | Aluminum Alloy | 28 (2 x 14) | 0.100" (2.54mm) | Gold | 20μin (0.51μm) | Beryllium Copper | 0.100" (2.54mm) | Gold | Beryllium Copper |
