Douilles pour circuits intégrés, transistors - Zui Ai Technology（Taiwan）Company.

Packaging：

Series：

Operating Temperature：

Mounting Type：

Type：

Features：

Termination：

Housing Material：

Number of Positions or Pins (Grid)：

10 (1 x 10) (22)
10 (2 x 5) (45)
100 (4 x 25) (4)
11 (1 x 11) (10)
114 (13 x 13) (1)
12 (1 x 12) (15)
12 (2 x 6) (15)
128 (13 x 13) (1)
13 (1 x 13) (10)
132 (14 x 14) (1)
132 (4 x 33) (4)
14 (1 x 14) (14)
14 (2 x 7) (91)
144 (4 x 36) (2)
15 (1 x 15) (15)
16 (1 x 16) (14)
16 (2 x 8) (73)
160 (4 x 40) (2)
169 (17 x 17) (1)
17 (1 x 17) (16)
18 (1 x 18) (12)
18 (2 x 9) (60)
181 (15 x 15) (1)
19 (1 x 19) (13)
2 (1 x 2) (18)
20 (1 x 20) (67)
20 (2 x 10) (66)
20 (4 x 5) (25)
209 (17 x 17) (1)
21 (1 x 21) (11)
22 (1 x 22) (8)
22 (2 x 11) (36)
223 (18 x 18) (1)
23 (1 x 23) (9)
24 (1 x 24) (9)
24 (2 x 12) (46)
241 (18 x 18) (2)
25 (1 x 25) (26)
26 (1 x 26) (11)
26 (2 x 13) (7)
27 (1 x 27) (12)
28 (1 x 28) (11)
28 (2 x 14) (57)
28 (4 x 7) (23)
29 (1 x 29) (11)
3 (1 x 3) (13)
30 (1 x 30) (20)
30 (2 x 15) (21)
31 (1 x 31) (10)
32 (1 x 32) (8)
32 (2 x 16) (43)
32 (2 x 7，2 x 9) (21)
32 (4 x 8) (15)
321 (19 x 19) (9)
33 (1 x 33) (7)
34 (1 x 34) (22)
34 (2 x 17) (13)
35 (1 x 35) (10)
36 (1 x 36) (7)
36 (2 x 18) (17)
37 (1 x 37) (7)
370 (19 x 19) (4)
38 (1 x 38) (7)
38 (2 x 19) (13)
39 (1 x 39) (7)
4 (1 x 4) (29)
40 (1 x 40) (9)
40 (2 x 20) (46)
42 (2 x 21) (8)
44 (2 x 22) (2)
44 (4 x 11) (28)
462 (19 x 19) (1)
48 (2 x 24) (24)
5 (1 x 5) (13)
50 (2 x 25) (4)
52 (2 x 26) (2)
52 (4 x 13) (22)
6 (1 x 6) (12)
6 (2 x 3) (19)
60 (2 x 30) (4)
64 (2 x 32) (4)
68 (2 x 34) (2)
68 (4 x 17) (26)
7 (1 x 7) (9)
8 (1 x 8) (31)
8 (2 x 4) (74)
84 (2x42) (2)
84 (4 x 21) (25)
9 (1 x 9) (19)

Pitch - Mating：

Contact Finish - Mating：

Contact Finish Thickness - Mating：

Contact Material - Mating：

Pitch - Post：

Contact Finish - Post：

Contact Finish Thickness - Post：

Image	Numéro de pièce	Fabricant	Quantité	Délai de livraison	Prix unitaire	Acheter	Description	Packaging	Series	Operating Temperature	Mounting Type	Type	Features	Termination	Housing Material	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post
Image	Numéro de pièce	Fabricant	Quantité	Délai de livraison	Prix unitaire	Acheter	Description	Packaging	Series	Operating Temperature	Mounting Type	Type	Features	Termination	Housing Material	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post
	A 08-LC-TT	ASSMANN WSW Components	108,884	3 jours	-	CONN IC DIP SOCKET 8POS TIN MOQ: 1 MPQ: 1	CONN IC DIP SOCKET 8POS TIN	Tube	-	-55°C ~ 85°C	Through Hole	DIP，0.3" (7.62mm) Row Spacing	Open Frame	Solder	Polybutylene Terephthalate (PBT)	8 (2 x 4)	0.100" (2.54mm)	Tin	-	Phosphor Bronze	0.100" (2.54mm)	Tin	-
	A 14-LC-TT	ASSMANN WSW Components	81,814	3 jours	-	CONN IC DIP SOCKET 14POS TIN MOQ: 1 MPQ: 1	CONN IC DIP SOCKET 14POS TIN	Tube	-	-55°C ~ 85°C	Through Hole	DIP，0.3" (7.62mm) Row Spacing	Open Frame	Solder	Polybutylene Terephthalate (PBT)	14 (2 x 7)	0.100" (2.54mm)	Tin	-	Phosphor Bronze	0.100" (2.54mm)	Tin	-
	A 16-LC-TT	ASSMANN WSW Components	48,059	3 jours	-	CONN IC DIP SOCKET 16POS TIN MOQ: 1 MPQ: 1	CONN IC DIP SOCKET 16POS TIN	Tube	-	-55°C ~ 85°C	Through Hole	DIP，0.3" (7.62mm) Row Spacing	Open Frame	Solder	Polybutylene Terephthalate (PBT)	16 (2 x 8)	0.100" (2.54mm)	Tin	-	Phosphor Bronze	0.100" (2.54mm)	Tin	-
	A 18-LC-TT	ASSMANN WSW Components	36,980	3 jours	-	CONN IC DIP SOCKET 18POS TIN MOQ: 1 MPQ: 1	CONN IC DIP SOCKET 18POS TIN	Tube	-	-55°C ~ 85°C	Through Hole	DIP，0.3" (7.62mm) Row Spacing	Open Frame	Solder	Polybutylene Terephthalate (PBT)	18 (2 x 9)	0.100" (2.54mm)	Tin	-	Phosphor Bronze	0.100" (2.54mm)	Tin	-
	A 20-LC-TT	ASSMANN WSW Components	45,190	3 jours	-	CONN IC DIP SOCKET 20POS TIN MOQ: 1 MPQ: 1	CONN IC DIP SOCKET 20POS TIN	Tube	-	-55°C ~ 85°C	Through Hole	DIP，0.3" (7.62mm) Row Spacing	Open Frame	Solder	Polybutylene Terephthalate (PBT)	20 (2 x 10)	0.100" (2.54mm)	Tin	-	Phosphor Bronze	0.100" (2.54mm)	Tin	-
	ED281DT	On Shore Technology Inc.	28,344	3 jours	-	CONN IC DIP SOCKET 28POS TIN MOQ: 1 MPQ: 1	CONN IC DIP SOCKET 28POS TIN	Tube	ED	-55°C ~ 110°C	Through Hole	DIP，0.3" (7.62mm) Row Spacing	Open Frame	Solder	Polybutylene Terephthalate (PBT)，Glass Filled	28 (2 x 14)	0.100" (2.54mm)	Tin	60μin (1.52μm)	Phosphor Bronze	0.100" (2.54mm)	Tin	60μin (1.52μm)
	4808-3004-CP	3M	13,906	3 jours	-	CONN IC DIP SOCKET 8POS TIN MOQ: 1 MPQ: 1	CONN IC DIP SOCKET 8POS TIN	Tube	4800	-25°C ~ 85°C	Through Hole	DIP，0.3" (7.62mm) Row Spacing	Open Frame	Solder	Polyester，Glass Filled	8 (2 x 4)	0.100" (2.54mm)	Tin	35μin (0.90μm)	Phosphor Bronze	0.100" (2.54mm)	Tin	35μin (0.90μm)
	4816-3000-CP	3M	8,449	3 jours	-	CONN IC DIP SOCKET 16POS TIN MOQ: 1 MPQ: 1	CONN IC DIP SOCKET 16POS TIN	Tube	4800	-25°C ~ 85°C	Through Hole	DIP，0.3" (7.62mm) Row Spacing	Open Frame	Solder	Polyester，Glass Filled	16 (2 x 8)	0.100" (2.54mm)	Tin	35μin (0.90μm)	Phosphor Bronze	0.100" (2.54mm)	Tin	35μin (0.90μm)
	4828-3004-CP	3M	19,400	3 jours	-	CONN IC DIP SOCKET 28POS TIN MOQ: 1 MPQ: 1	CONN IC DIP SOCKET 28POS TIN	Tube	4800	-25°C ~ 85°C	Through Hole	DIP，0.3" (7.62mm) Row Spacing	Open Frame	Solder	Polyester，Glass Filled	28 (2 x 14)	0.100" (2.54mm)	Tin	35μin (0.90μm)	Phosphor Bronze	0.100" (2.54mm)	Tin	35μin (0.90μm)
	A-CCS 044-Z-SM	ASSMANN WSW Components	24,224	3 jours	-	IC SOCKET PLCC 44POS TIN SMD MOQ: 1 MPQ: 1	IC SOCKET PLCC 44POS TIN SMD	Tube	-	-40°C ~ 105°C	Surface Mount	PLCC	Closed Frame	Solder	Polyamide (PA9T)，Nylon 9T，Glass Filled	44 (4 x 11)	0.050" (1.27mm)	Tin	160μin (4.06μm)	Phosphor Bronze	0.050" (1.27mm)	Tin	160μin (4.06μm)
	A-CCS-044-Z-T	ASSMANN WSW Components	21,261	3 jours	-	CONN SOCKET PLCC 44POS TIN MOQ: 1 MPQ: 1	CONN SOCKET PLCC 44POS TIN	Tube	-	-40°C ~ 105°C	Through Hole	PLCC	Closed Frame	Solder	Polybutylene Terephthalate (PBT)	44 (4 x 11)	0.050" (1.27mm)	Tin	160μin (4.06μm)	Phosphor Bronze	0.100" (2.54mm)	Tin	160μin (4.06μm)
	A-CCS 068-Z-T	ASSMANN WSW Components	11,029	3 jours	-	CONN SOCKET PLCC 68POS TIN MOQ: 1 MPQ: 1	CONN SOCKET PLCC 68POS TIN	Tube	-	-40°C ~ 105°C	Through Hole	PLCC	Closed Frame	Solder	Polybutylene Terephthalate (PBT)	68 (4 x 17)	0.050" (1.27mm)	Tin	160μin (4.06μm)	Phosphor Bronze	0.100" (2.54mm)	Tin	160μin (4.06μm)
	20-0511-10	Aries Electronics	2,219	3 jours	-	CONN SOCKET SIP 20POS TIN MOQ: 1 MPQ: 1	CONN SOCKET SIP 20POS TIN	Bulk	511	-55°C ~ 105°C	Through Hole	SIP	-	Solder	Polyamide (PA46)，Nylon 4/6，Glass Filled	20 (1 x 20)	0.100" (2.54mm)	Tin	50μin (1.27μm)	Phosphor Bronze	0.100" (2.54mm)	Tin	50μin (1.27μm)
	14-810-90	Aries Electronics	104	3 jours	-	CONN IC DIP SOCKET 14POS GOLD MOQ: 1 MPQ: 1	CONN IC DIP SOCKET 14POS GOLD	Bulk	Vertisockets 800	-	Through Hole，Right Angle，Vertical	DIP，0.3" (7.62mm) Row Spacing	Closed Frame	Solder	Polyamide (PA46)，Nylon 4/6	14 (2 x 7)	0.100" (2.54mm)	Gold	10μin (0.25μm)	Phosphor Bronze	0.100" (2.54mm)	Gold	10μin (0.25μm)
	ED08DT	On Shore Technology Inc.	17,786	3 jours	-	CONN IC DIP SOCKET 8POS TIN MOQ: 1 MPQ: 1	CONN IC DIP SOCKET 8POS TIN	Tube	ED	-55°C ~ 110°C	Through Hole	DIP，0.3" (7.62mm) Row Spacing	Open Frame	Solder	Polybutylene Terephthalate (PBT)，Glass Filled	8 (2 x 4)	0.100" (2.54mm)	Tin	60μin (1.52μm)	Phosphor Bronze	0.100" (2.54mm)	Tin	60μin (1.52μm)
	ED14DT	On Shore Technology Inc.	10,923	3 jours	-	CONN IC DIP SOCKET 14POS TIN MOQ: 1 MPQ: 1	CONN IC DIP SOCKET 14POS TIN	Tube	ED	-55°C ~ 110°C	Through Hole	DIP，0.3" (7.62mm) Row Spacing	Open Frame	Solder	Polybutylene Terephthalate (PBT)，Glass Filled	14 (2 x 7)	0.100" (2.54mm)	Tin	60μin (1.52μm)	Phosphor Bronze	0.100" (2.54mm)	Tin	60μin (1.52μm)
	ED16DT	On Shore Technology Inc.	3,583	3 jours	-	CONN IC DIP SOCKET 16POS TIN MOQ: 1 MPQ: 1	CONN IC DIP SOCKET 16POS TIN	Tube	ED	-55°C ~ 110°C	Through Hole	DIP，0.3" (7.62mm) Row Spacing	Open Frame	Solder	Polybutylene Terephthalate (PBT)，Glass Filled	16 (2 x 8)	0.100" (2.54mm)	Tin	60μin (1.52μm)	Phosphor Bronze	0.100" (2.54mm)	Tin	60μin (1.52μm)
	A 08-LC-TR	ASSMANN WSW Components	31,632	3 jours	-	CONN IC DIP SOCKET 8POS TIN MOQ: 1 MPQ: 1	CONN IC DIP SOCKET 8POS TIN	Tube	-	-55°C ~ 85°C	Through Hole	DIP，0.3" (7.62mm) Row Spacing	Open Frame	Solder	Polybutylene Terephthalate (PBT)	8 (2 x 4)	0.100" (2.54mm)	Tin	-	Phosphor Bronze	0.100" (2.54mm)	Tin	-
	243-08-1-03	CnC Tech	15,341	3 jours	-	CONN IC DIP SOCKET 8POS TIN MOQ: 1 MPQ: 1	CONN IC DIP SOCKET 8POS TIN	Tube	-	-40°C ~ 105°C	Through Hole	DIP，0.3" (7.62mm) Row Spacing	Open Frame	Solder	Polybutylene Terephthalate (PBT)，Glass Filled	8 (2 x 4)	0.100" (2.54mm)	Tin	60μin (1.52μm)	Phosphor Bronze	0.100" (2.54mm)	Tin	60μin (1.52μm)
	ED18DT	On Shore Technology Inc.	14,114	3 jours	-	CONN IC DIP SOCKET 18POS TIN MOQ: 1 MPQ: 1	CONN IC DIP SOCKET 18POS TIN	Tube	ED	-55°C ~ 110°C	Through Hole	DIP，0.3" (7.62mm) Row Spacing	Open Frame	Solder	Polybutylene Terephthalate (PBT)，Glass Filled	18 (2 x 9)	0.100" (2.54mm)	Tin	60μin (1.52μm)	Phosphor Bronze	0.100" (2.54mm)	Tin	60μin (1.52μm)

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