- Packaging:
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- Operating Temperature:
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- Type:
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- Features:
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- Housing Material:
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- Number of Positions or Pins (Grid):
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- Contact Finish - Mating:
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- Contact Finish Thickness - Mating:
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- Contact Material - Mating:
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- Pitch - Post:
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- Contact Finish - Post:
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- Contact Finish Thickness - Post:
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- Contact Material - Post:
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- Conditions sélectionnées:
Découvrez les produits 486
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Operating Temperature | Mounting Type | Type | Features | Housing Material | Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Operating Temperature | Mounting Type | Type | Features | Housing Material | Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | ||
3M |
1,022
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET ZIF 14POS GLD
|
Bulk | Textool | -55°C ~ 125°C | Connector | DIP,ZIF (ZIP),0.3" (7.62mm) Row Spacing | Closed Frame | Polysulfone (PSU),Glass Filled | 14 (2 x 7) | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | ||||
3M |
1,089
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET ZIF 16POS GLD
|
Bulk | Textool | -55°C ~ 125°C | Connector | DIP,ZIF (ZIP),0.3" (7.62mm) Row Spacing | Closed Frame | Polysulfone (PSU),Glass Filled | 16 (2 x 8) | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | ||||
3M |
112
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET ZIF 28POS GLD
|
Bulk | Textool | -55°C ~ 125°C | Connector | DIP,ZIF (ZIP),0.6" (15.24mm) Row Spacing | Closed Frame | Polysulfone (PSU),Glass Filled | 28 (2 x 14) | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | ||||
3M |
688
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET ZIF 40POS GLD
|
Bulk | Textool | -55°C ~ 125°C | Connector | DIP,ZIF (ZIP),0.6" (15.24mm) Row Spacing | Closed Frame | Polysulfone (PSU),Glass Filled | 40 (2 x 20) | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | ||||
3M |
1,515
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET ZIF 48POS GLD
|
Tube | Textool | -55°C ~ 125°C | Connector | DIP,ZIF (ZIP),0.6" (15.24mm) Row Spacing | Closed Frame | Polysulfone (PSU),Glass Filled | 48 (2 x 24) | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | ||||
3M |
193
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET ZIF 32POS GLD
|
Bulk | Textool | -55°C ~ 125°C | Connector | DIP,ZIF (ZIP),0.6" (15.24mm) Row Spacing | Closed Frame | Polysulfone (PSU),Glass Filled | 32 (2 x 16) | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | ||||
3M |
249
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET ZIF 40POS GLD
|
Bulk | Textool | -55°C ~ 125°C | Connector | DIP,ZIF (ZIP),0.6" (15.24mm) Row Spacing | Closed Frame | Polysulfone (PSU),Glass Filled | 40 (2 x 20) | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | ||||
3M |
134
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET ZIF 32POS GLD
|
Bulk | Textool | -55°C ~ 125°C | Connector | DIP,ZIF (ZIP),0.6" (15.24mm) Row Spacing | Closed Frame | Polysulfone (PSU),Glass Filled | 32 (2 x 16) | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | ||||
3M |
157
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET ZIF 18POS GLD
|
Bulk | Textool | -55°C ~ 125°C | Connector | DIP,ZIF (ZIP),0.3" (7.62mm) Row Spacing | Closed Frame | Polysulfone (PSU),Glass Filled | 18 (2 x 9) | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | ||||
3M |
132
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET ZIF 42POS GLD
|
Bulk | Textool | -55°C ~ 125°C | Connector | DIP,ZIF (ZIP),0.6" (15.24mm) Row Spacing | Closed Frame | Polysulfone (PSU),Glass Filled | 42 (2 x 21) | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | ||||
3M |
198
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET ZIF 24POS GLD
|
Bulk | Textool | -55°C ~ 125°C | Connector | DIP,ZIF (ZIP),0.6" (15.24mm) Row Spacing | Closed Frame | Polysulfone (PSU),Glass Filled | 24 (2 x 12) | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | ||||
3M |
129
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET ZIF 64POS GLD
|
Bulk | Textool | -55°C ~ 125°C | Connector | DIP,ZIF (ZIP),0.9" (22.86mm) Row Spacing | Closed Frame | Polysulfone (PSU),Glass Filled | 64 (2 x 32) | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | ||||
Mill-Max Manufacturing Corp. |
640
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET SIP 64POS GOLD
|
Bulk | 346 | -55°C ~ 125°C | Through Hole | SIP | - | Polycyclohexylenedimethylene Terephthalate (PCT),Polyester | 64 (1 x 64) | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Tin-Lead | 200μin (5.08μm) | Brass Alloy | ||||
3M |
94
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET ZIF 24POS GLD
|
Bulk | Textool | -55°C ~ 125°C | Connector | DIP,ZIF (ZIP),0.6" (15.24mm) Row Spacing | Closed Frame | Polysulfone (PSU),Glass Filled | 24 (2 x 12) | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | ||||
3M |
96
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET ZIF 22POS GLD
|
Tube | Textool | -55°C ~ 125°C | Connector | DIP,ZIF (ZIP),0.4" (10.16mm) Row Spacing | Closed Frame | Polysulfone (PSU),Glass Filled | 22 (2 x 11) | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | ||||
3M |
21
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET ZIF 24POS GLD
|
Bulk | Textool | -55°C ~ 125°C | Connector | DIP,ZIF (ZIP),0.3" (7.62mm) Row Spacing | Closed Frame | Polysulfone (PSU),Glass Filled | 24 (2 x 12) | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | ||||
3M |
96
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET ZIF 28POS GLD
|
Bulk | Textool | -55°C ~ 125°C | Connector | DIP,ZIF (ZIP),0.6" (15.24mm) Row Spacing | Closed Frame | Polysulfone (PSU),Glass Filled | 28 (2 x 14) | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | ||||
3M |
57
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET ZIF 40POS GLD
|
Bulk | Textool | -55°C ~ 125°C | Connector | DIP,ZIF (ZIP),1.0" (25.40mm) Row Spacing | Closed Frame | Polysulfone (PSU),Glass Filled | 40 (2 x 20) | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | ||||
3M |
29
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET ZIF 64POS GLD
|
Bulk | Textool | -55°C ~ 125°C | Connector | DIP,ZIF (ZIP),0.9" (22.86mm) Row Spacing | Closed Frame | Polysulfone (PSU),Glass Filled | 64 (2 x 32) | 0.070" (1.78mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.070" (1.78mm) | Gold | 30μin (0.76μm) | Beryllium Copper | ||||
3M |
37
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET ZIF 28POS GLD
|
Bulk | Textool | -55°C ~ 125°C | Connector | DIP,ZIF (ZIP),0.6" (15.24mm) Row Spacing | Closed Frame | Polysulfone (PSU),Glass Filled | 28 (2 x 14) | 0.070" (1.78mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper |