Packaging:
Number of Positions or Pins (Grid):
Contact Finish - Mating:
Contact Finish - Post:
Découvrez les produits 486
Image Numéro de pièce Fabricant Quantité Délai de livraison Prix ​​unitaire Acheter Description Packaging Series Operating Temperature Mounting Type Type Features Housing Material Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post
214-3339-00-0602J
3M
1,022
3 jours
-
MOQ: 1  MPQ: 1
CONN IC DIP SOCKET ZIF 14POS GLD
Bulk Textool -55°C ~ 125°C Connector DIP,ZIF (ZIP),0.3" (7.62mm) Row Spacing Closed Frame Polysulfone (PSU),Glass Filled 14 (2 x 7) 0.100" (2.54mm) Gold 30μin (0.76μm) Beryllium Copper 0.100" (2.54mm) Gold 30μin (0.76μm) Beryllium Copper
216-3340-00-0602J
3M
1,089
3 jours
-
MOQ: 1  MPQ: 1
CONN IC DIP SOCKET ZIF 16POS GLD
Bulk Textool -55°C ~ 125°C Connector DIP,ZIF (ZIP),0.3" (7.62mm) Row Spacing Closed Frame Polysulfone (PSU),Glass Filled 16 (2 x 8) 0.100" (2.54mm) Gold 30μin (0.76μm) Beryllium Copper 0.100" (2.54mm) Gold 30μin (0.76μm) Beryllium Copper
228-1277-00-0602J
3M
112
3 jours
-
MOQ: 1  MPQ: 1
CONN IC DIP SOCKET ZIF 28POS GLD
Bulk Textool -55°C ~ 125°C Connector DIP,ZIF (ZIP),0.6" (15.24mm) Row Spacing Closed Frame Polysulfone (PSU),Glass Filled 28 (2 x 14) 0.100" (2.54mm) Gold 30μin (0.76μm) Beryllium Copper 0.100" (2.54mm) Gold 30μin (0.76μm) Beryllium Copper
240-1280-00-0602J
3M
688
3 jours
-
MOQ: 1  MPQ: 1
CONN IC DIP SOCKET ZIF 40POS GLD
Bulk Textool -55°C ~ 125°C Connector DIP,ZIF (ZIP),0.6" (15.24mm) Row Spacing Closed Frame Polysulfone (PSU),Glass Filled 40 (2 x 20) 0.100" (2.54mm) Gold 30μin (0.76μm) Beryllium Copper 0.100" (2.54mm) Gold 30μin (0.76μm) Beryllium Copper
248-1282-00-0602J
3M
1,515
3 jours
-
MOQ: 1  MPQ: 1
CONN IC DIP SOCKET ZIF 48POS GLD
Tube Textool -55°C ~ 125°C Connector DIP,ZIF (ZIP),0.6" (15.24mm) Row Spacing Closed Frame Polysulfone (PSU),Glass Filled 48 (2 x 24) 0.100" (2.54mm) Gold 30μin (0.76μm) Beryllium Copper 0.100" (2.54mm) Gold 30μin (0.76μm) Beryllium Copper
232-1287-00-0602J
3M
193
3 jours
-
MOQ: 1  MPQ: 1
CONN IC DIP SOCKET ZIF 32POS GLD
Bulk Textool -55°C ~ 125°C Connector DIP,ZIF (ZIP),0.6" (15.24mm) Row Spacing Closed Frame Polysulfone (PSU),Glass Filled 32 (2 x 16) 0.100" (2.54mm) Gold 30μin (0.76μm) Beryllium Copper 0.100" (2.54mm) Gold 30μin (0.76μm) Beryllium Copper
240-1288-00-0602J
3M
249
3 jours
-
MOQ: 1  MPQ: 1
CONN IC DIP SOCKET ZIF 40POS GLD
Bulk Textool -55°C ~ 125°C Connector DIP,ZIF (ZIP),0.6" (15.24mm) Row Spacing Closed Frame Polysulfone (PSU),Glass Filled 40 (2 x 20) 0.100" (2.54mm) Gold 30μin (0.76μm) Beryllium Copper 0.100" (2.54mm) Gold 30μin (0.76μm) Beryllium Copper
232-1285-00-0602J
3M
134
3 jours
-
MOQ: 1  MPQ: 1
CONN IC DIP SOCKET ZIF 32POS GLD
Bulk Textool -55°C ~ 125°C Connector DIP,ZIF (ZIP),0.6" (15.24mm) Row Spacing Closed Frame Polysulfone (PSU),Glass Filled 32 (2 x 16) 0.100" (2.54mm) Gold 30μin (0.76μm) Beryllium Copper 0.100" (2.54mm) Gold 30μin (0.76μm) Beryllium Copper
218-3341-00-0602J
3M
157
3 jours
-
MOQ: 1  MPQ: 1
CONN IC DIP SOCKET ZIF 18POS GLD
Bulk Textool -55°C ~ 125°C Connector DIP,ZIF (ZIP),0.3" (7.62mm) Row Spacing Closed Frame Polysulfone (PSU),Glass Filled 18 (2 x 9) 0.100" (2.54mm) Gold 30μin (0.76μm) Beryllium Copper 0.100" (2.54mm) Gold 30μin (0.76μm) Beryllium Copper
242-1281-00-0602J
3M
132
3 jours
-
MOQ: 1  MPQ: 1
CONN IC DIP SOCKET ZIF 42POS GLD
Bulk Textool -55°C ~ 125°C Connector DIP,ZIF (ZIP),0.6" (15.24mm) Row Spacing Closed Frame Polysulfone (PSU),Glass Filled 42 (2 x 21) 0.100" (2.54mm) Gold 30μin (0.76μm) Beryllium Copper 0.100" (2.54mm) Gold 30μin (0.76μm) Beryllium Copper
224-1286-00-0602J
3M
198
3 jours
-
MOQ: 1  MPQ: 1
CONN IC DIP SOCKET ZIF 24POS GLD
Bulk Textool -55°C ~ 125°C Connector DIP,ZIF (ZIP),0.6" (15.24mm) Row Spacing Closed Frame Polysulfone (PSU),Glass Filled 24 (2 x 12) 0.100" (2.54mm) Gold 30μin (0.76μm) Beryllium Copper 0.100" (2.54mm) Gold 30μin (0.76μm) Beryllium Copper
264-4493-00-0602J
3M
129
3 jours
-
MOQ: 1  MPQ: 1
CONN IC DIP SOCKET ZIF 64POS GLD
Bulk Textool -55°C ~ 125°C Connector DIP,ZIF (ZIP),0.9" (22.86mm) Row Spacing Closed Frame Polysulfone (PSU),Glass Filled 64 (2 x 32) 0.100" (2.54mm) Gold 30μin (0.76μm) Beryllium Copper 0.100" (2.54mm) Gold 30μin (0.76μm) Beryllium Copper
346-93-164-41-013000
Mill-Max Manufacturing Corp.
640
3 jours
-
MOQ: 1  MPQ: 1
CONN SOCKET SIP 64POS GOLD
Bulk 346 -55°C ~ 125°C Through Hole SIP - Polycyclohexylenedimethylene Terephthalate (PCT),Polyester 64 (1 x 64) 0.100" (2.54mm) Gold 30μin (0.76μm) Beryllium Copper 0.100" (2.54mm) Tin-Lead 200μin (5.08μm) Brass Alloy
224-1275-00-0602J
3M
94
3 jours
-
MOQ: 1  MPQ: 1
CONN IC DIP SOCKET ZIF 24POS GLD
Bulk Textool -55°C ~ 125°C Connector DIP,ZIF (ZIP),0.6" (15.24mm) Row Spacing Closed Frame Polysulfone (PSU),Glass Filled 24 (2 x 12) 0.100" (2.54mm) Gold 30μin (0.76μm) Beryllium Copper 0.100" (2.54mm) Gold 30μin (0.76μm) Beryllium Copper
222-3343-00-0602J
3M
96
3 jours
-
MOQ: 1  MPQ: 1
CONN IC DIP SOCKET ZIF 22POS GLD
Tube Textool -55°C ~ 125°C Connector DIP,ZIF (ZIP),0.4" (10.16mm) Row Spacing Closed Frame Polysulfone (PSU),Glass Filled 22 (2 x 11) 0.100" (2.54mm) Gold 30μin (0.76μm) Beryllium Copper 0.100" (2.54mm) Gold 30μin (0.76μm) Beryllium Copper
224-5248-00-0602J
3M
21
3 jours
-
MOQ: 1  MPQ: 1
CONN IC DIP SOCKET ZIF 24POS GLD
Bulk Textool -55°C ~ 125°C Connector DIP,ZIF (ZIP),0.3" (7.62mm) Row Spacing Closed Frame Polysulfone (PSU),Glass Filled 24 (2 x 12) 0.100" (2.54mm) Gold 30μin (0.76μm) Beryllium Copper 0.100" (2.54mm) Gold 30μin (0.76μm) Beryllium Copper
228-1371-00-0602J
3M
96
3 jours
-
MOQ: 1  MPQ: 1
CONN IC DIP SOCKET ZIF 28POS GLD
Bulk Textool -55°C ~ 125°C Connector DIP,ZIF (ZIP),0.6" (15.24mm) Row Spacing Closed Frame Polysulfone (PSU),Glass Filled 28 (2 x 14) 0.100" (2.54mm) Gold 30μin (0.76μm) Beryllium Copper 0.100" (2.54mm) Gold 30μin (0.76μm) Beryllium Copper
240-3639-00-0602J
3M
57
3 jours
-
MOQ: 1  MPQ: 1
CONN IC DIP SOCKET ZIF 40POS GLD
Bulk Textool -55°C ~ 125°C Connector DIP,ZIF (ZIP),1.0" (25.40mm) Row Spacing Closed Frame Polysulfone (PSU),Glass Filled 40 (2 x 20) 0.100" (2.54mm) Gold 30μin (0.76μm) Beryllium Copper 0.100" (2.54mm) Gold 30μin (0.76μm) Beryllium Copper
264-1300-00-0602J
3M
29
3 jours
-
MOQ: 1  MPQ: 1
CONN IC DIP SOCKET ZIF 64POS GLD
Bulk Textool -55°C ~ 125°C Connector DIP,ZIF (ZIP),0.9" (22.86mm) Row Spacing Closed Frame Polysulfone (PSU),Glass Filled 64 (2 x 32) 0.070" (1.78mm) Gold 30μin (0.76μm) Beryllium Copper 0.070" (1.78mm) Gold 30μin (0.76μm) Beryllium Copper
228-1290-00-0602J
3M
37
3 jours
-
MOQ: 1  MPQ: 1
CONN IC DIP SOCKET ZIF 28POS GLD
Bulk Textool -55°C ~ 125°C Connector DIP,ZIF (ZIP),0.6" (15.24mm) Row Spacing Closed Frame Polysulfone (PSU),Glass Filled 28 (2 x 14) 0.070" (1.78mm) Gold 30μin (0.76μm) Beryllium Copper 0.100" (2.54mm) Gold 30μin (0.76μm) Beryllium Copper