- Packaging：
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- Operating Temperature：
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- Type：
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- Features：
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- Termination：
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- Number of Positions or Pins (Grid)：
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- Contact Finish - Mating：
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- Contact Finish Thickness - Mating：
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- Contact Material - Mating：
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- Contact Finish - Post：
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- Contact Finish Thickness - Post：
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- Contact Material - Post：
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- Conditions sélectionnées:
Découvrez les produits 162
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Operating Temperature | Mounting Type | Type | Features | Termination | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Operating Temperature | Mounting Type | Type | Features | Termination | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | |
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|
|
ASSMANN WSW Components |
47,594
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 8POS TIN
|
Tube | - | -40°C ~ 105°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Solder | 8 (2 x 4) | Tin | - | Beryllium Copper | Tin | 200μin (5.08μm) | Beryllium Copper | ||
|
|
|
ASSMANN WSW Components |
8,465
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 14POS TIN
|
Tube | - | -40°C ~ 105°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Solder | 14 (2 x 7) | Tin | - | Beryllium Copper | Tin | 200μin (5.08μm) | Beryllium Copper | ||
|
|
|
ASSMANN WSW Components |
16,495
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 16POS TIN
|
Tube | - | -40°C ~ 105°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Solder | 16 (2 x 8) | Tin | - | Beryllium Copper | Tin | 200μin (5.08μm) | Beryllium Copper | ||
|
|
|
ASSMANN WSW Components |
7,338
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 28POS TIN
|
Tube | - | -40°C ~ 105°C | Through Hole | DIP，0.6" (15.24mm) Row Spacing | Open Frame | Solder | 28 (2 x 14) | Tin | - | Beryllium Copper | Tin | 200μin (5.08μm) | Beryllium Copper | ||
|
|
|
ASSMANN WSW Components |
8,981
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 40POS TIN
|
Tube | - | -40°C ~ 105°C | Through Hole | DIP，0.6" (15.24mm) Row Spacing | Open Frame | Solder | 40 (2 x 20) | Tin | - | Beryllium Copper | Tin | 200μin (5.08μm) | Beryllium Copper | ||
|
|
|
ASSMANN WSW Components |
9,101
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 6POS TIN
|
Tube | - | -40°C ~ 105°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Solder | 6 (2 x 3) | Tin | - | Beryllium Copper | Tin | 200μin (5.08μm) | Beryllium Copper | ||
|
|
|
ASSMANN WSW Components |
25,988
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 6POS GOLD
|
Tube | - | -40°C ~ 105°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Solder | 6 (2 x 3) | Gold | 10μin (0.25μm) | Beryllium Copper | Tin | 200μin (5.08μm) | Beryllium Copper | ||
|
|
|
ASSMANN WSW Components |
4,391
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 18POS TIN
|
Tube | - | -40°C ~ 105°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Solder | 18 (2 x 9) | Tin | - | Beryllium Copper | Tin | 200μin (5.08μm) | Beryllium Copper | ||
|
|
|
ASSMANN WSW Components |
3,778
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 20POS TIN
|
Tube | - | -40°C ~ 105°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Solder | 20 (2 x 10) | Tin | - | Beryllium Copper | Tin | 200μin (5.08μm) | Beryllium Copper | ||
|
|
|
ASSMANN WSW Components |
2,255
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 24POS TIN
|
Tube | - | -40°C ~ 105°C | Through Hole | DIP，0.6" (15.24mm) Row Spacing | Open Frame | Solder | 24 (2 x 12) | Tin | - | Beryllium Copper | Tin | 200μin (5.08μm) | Beryllium Copper | ||
|
|
|
ASSMANN WSW Components |
1,598
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 8POS GOLD
|
Tube | - | -40°C ~ 105°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Wire Wrap | 8 (2 x 4) | Gold | - | Beryllium Copper | Tin | 200μin (5.08μm) | Beryllium Copper | ||
|
|
|
ASSMANN WSW Components |
1,211
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 14POS GOLD
|
Tube | - | -40°C ~ 105°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Wire Wrap | 14 (2 x 7) | Gold | - | Beryllium Copper | Tin | 200μin (5.08μm) | Beryllium Copper | ||
|
|
|
ASSMANN WSW Components |
671
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 16POS GOLD
|
Tube | - | -40°C ~ 105°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Wire Wrap | 16 (2 x 8) | Gold | - | Beryllium Copper | Tin | 200μin (5.08μm) | Beryllium Copper | ||
|
|
|
ASSMANN WSW Components |
2,011
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 20POS GOLD
|
Tube | - | -40°C ~ 105°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Wire Wrap | 20 (2 x 10) | Gold | - | Beryllium Copper | Tin | 200μin (5.08μm) | Beryllium Copper | ||
|
|
|
ASSMANN WSW Components |
338
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 40POS GOLD
|
Tube | - | -40°C ~ 105°C | Through Hole | DIP，0.6" (15.24mm) Row Spacing | Open Frame | Wire Wrap | 40 (2 x 20) | Gold | - | Beryllium Copper | Tin | 200μin (5.08μm) | Beryllium Copper | ||
|
|
|
ASSMANN WSW Components |
133
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 32POS GOLD
|
Tube | - | -40°C ~ 105°C | Through Hole | DIP，0.6" (15.24mm) Row Spacing | Open Frame | Solder | 32 (2 x 16) | Gold | 10μin (0.25μm) | Beryllium Copper | Tin | 200μin (5.08μm) | Beryllium Copper | ||
|
|
|
ASSMANN WSW Components |
89
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 24POS GOLD
|
Tube | - | -40°C ~ 105°C | Through Hole | DIP，0.6" (15.24mm) Row Spacing | Open Frame | Wire Wrap | 24 (2 x 12) | Gold | - | Beryllium Copper | Tin | 200μin (5.08μm) | Beryllium Copper | ||
|
|
|
ASSMANN WSW Components |
380
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 28POS GOLD
|
Tube | - | -40°C ~ 105°C | Through Hole | DIP，0.6" (15.24mm) Row Spacing | Open Frame | Solder | 28 (2 x 14) | Gold | 30μin (0.76μm) | Beryllium Copper | Tin | 200μin (5.08μm) | Beryllium Copper | ||
|
|
|
ASSMANN WSW Components |
480
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 18POS GOLD
|
Tube | - | -40°C ~ 105°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Solder | 18 (2 x 9) | Gold | - | Beryllium Copper | Tin | 200μin (5.08μm) | Beryllium Copper | ||
|
|
|
ASSMANN WSW Components |
297
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 14POS GOLD
|
Tube | - | -40°C ~ 105°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Solder | 14 (2 x 7) | Gold | 10μin (0.25μm) | Beryllium Copper | Tin | 200μin (5.08μm) | Beryllium Copper |
