- Operating Temperature：
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- Mounting Type：
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- Type：
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- Housing Material：
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- Pitch - Mating：
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- Contact Finish Thickness - Mating：
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- Contact Material - Mating：
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- Pitch - Post：
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- Contact Finish Thickness - Post：
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- Contact Material - Post：
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- Conditions sélectionnées:
Découvrez les produits 9
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Operating Temperature | Mounting Type | Type | Housing Material | Pitch - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Operating Temperature | Mounting Type | Type | Housing Material | Pitch - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | |
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Preci-Dip |
Enquête
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- |
-
|
MOQ: 1 MPQ: 1
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BGA PIN ADAPTER 1.27MM SMD
|
Bulk | 550 | -55°C ~ 125°C | Through Hole | BGA | FR4 Epoxy Glass | 0.050" (1.27mm) | 10μin (0.25μm) | Beryllium Copper | 0.050" (1.27mm) | Gold | 10μin (0.25μm) | Brass | |||
|
|
Preci-Dip |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET BGA 478POS GOLD
|
Bulk | 514 | -55°C ~ 125°C | Surface Mount | BGA | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester，Glass Filled | 0.100" (2.54mm) | Flash | Beryllium Copper | 0.100" (2.54mm) | Tin | - | Brass | |||
|
|
Preci-Dip |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET BGA 478POS GOLD
|
Bulk | 514 | -55°C ~ 125°C | Surface Mount | BGA | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester，Glass Filled | 0.100" (2.54mm) | 29.5μin (0.75μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | - | Brass | |||
|
|
Preci-Dip |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
BGA SOLDER TAIL
|
Bulk | 550 | -55°C ~ 125°C | Through Hole | BGA | FR4 Epoxy Glass | 0.050" (1.27mm) | 10μin (0.25μm) | Brass | 0.050" (1.27mm) | Gold | 10μin (0.25μm) | Brass | |||
|
|
Preci-Dip |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
PGA SOLDER TAIL 1.27MM
|
Bulk | 558 | -55°C ~ 125°C | Through Hole | PGA | FR4 Epoxy Glass | 0.050" (1.27mm) | 10μin (0.25μm) | Beryllium Copper | 0.050" (1.27mm) | Gold | 10μin (0.25μm) | Brass | |||
|
|
Preci-Dip |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
BGA SURFACE MOUNT 1.27MM
|
Bulk | 558 | -55°C ~ 125°C | Surface Mount | BGA | FR4 Epoxy Glass | 0.050" (1.27mm) | 10μin (0.25μm) | Brass | 0.050" (1.27mm) | Gold | 10μin (0.25μm) | Brass | |||
|
|
Preci-Dip |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET PGA 478POS GOLD
|
Bulk | 518 | -55°C ~ 125°C | Through Hole | PGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Flash | Beryllium Copper | 0.050" (1.27mm) | Gold | Flash | Brass | |||
|
|
Preci-Dip |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET PGA 478POS GOLD
|
Bulk | 518 | -55°C ~ 125°C | Surface Mount | PGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Flash | Beryllium Copper | 0.050" (1.27mm) | Gold | Flash | Brass | |||
|
|
TE Connectivity AMP Connectors |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET PGA ZIF 478POS GOLD
|
- | - | - | Surface Mount | PGA，ZIF (ZIP) | Thermoplastic | 0.050" (1.27mm) | 30μin (0.76μm) | Copper Alloy | 0.050" (1.27mm) | Gold | 30μin (0.76μm) | Copper Alloy |
