- Series：
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- Operating Temperature：
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- Mounting Type：
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- Type：
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- Termination：
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- Housing Material：
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- Contact Finish Thickness - Mating：
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- Contact Material - Mating：
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- Contact Finish Thickness - Post：
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- Contact Material - Post：
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- Conditions sélectionnées:
Découvrez les produits 34
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Series | Operating Temperature | Mounting Type | Type | Features | Termination | Housing Material | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Series | Operating Temperature | Mounting Type | Type | Features | Termination | Housing Material | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | |
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Mill-Max Manufacturing Corp. |
Enquête
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- |
-
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MOQ: 1 MPQ: 1
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CONN IC DIP SOCKET 38POS GOLD
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714 | -55°C ~ 125°C | Through Hole | DIP，0.1" (2.54mm) Row Spacing | Closed Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | Gold | 30μin (0.76μm) | Beryllium Copper | Gold | 30μin (0.76μm) | Brass Alloy | ||
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Aries Electronics |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 38POS GOLD
|
518 | - | Through Hole | DIP，0.2" (5.08mm) Row Spacing | Open Frame | Solder | Polyamide (PA46)，Nylon 4/6，Glass Filled | Gold | 10μin (0.25μm) | Beryllium Copper | Tin | 200μin (5.08μm) | Brass | ||
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|
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Aries Electronics |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 38POS GOLD
|
518 | - | Through Hole | DIP，0.2" (5.08mm) Row Spacing | Open Frame | Solder | Polyamide (PA46)，Nylon 4/6，Glass Filled | Gold | 10μin (0.25μm) | Beryllium Copper | Tin | 200μin (5.08μm) | Brass | ||
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|
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Aries Electronics |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 38POS GOLD
|
518 | - | Through Hole | DIP，0.2" (5.08mm) Row Spacing | Open Frame | Solder | Polyamide (PA46)，Nylon 4/6，Glass Filled | Gold | 10μin (0.25μm) | Beryllium Copper | Tin | 200μin (5.08μm) | Brass | ||
|
|
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Aries Electronics |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 38POS GOLD
|
518 | - | Through Hole | DIP，0.2" (5.08mm) Row Spacing | Open Frame | Solder | Polyamide (PA46)，Nylon 4/6，Glass Filled | Gold | 10μin (0.25μm) | Beryllium Copper | Gold | 10μin (0.25μm) | Brass | ||
|
|
|
Aries Electronics |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 38POS GOLD
|
Lo-PROfile，513 | - | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Closed Frame | Solder | Polyamide (PA46)，Nylon 4/6，Glass Filled | Gold | 10μin (0.25μm) | Beryllium Copper | Tin | 200μin (5.08μm) | Brass | ||
|
|
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Aries Electronics |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 38POS TIN
|
511 | -55°C ~ 105°C | Through Hole | DIP，0.6" (15.24mm) Row Spacing | Closed Frame | Solder | Polyamide (PA46)，Nylon 4/6，Glass Filled | Tin | 200μin (5.08μm) | Phosphor Bronze | Tin | 200μin (5.08μm) | Phosphor Bronze | ||
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Aries Electronics |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 38POS GOLD
|
Lo-PROfile，513 | - | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Closed Frame | Solder | Polyamide (PA46)，Nylon 4/6，Glass Filled | Gold | 10μin (0.25μm) | Beryllium Copper | Tin | 200μin (5.08μm) | Brass | ||
|
|
|
Aries Electronics |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 38POS GOLD
|
518 | - | Through Hole | DIP，0.2" (5.08mm) Row Spacing | Open Frame | Solder | Polyamide (PA46)，Nylon 4/6，Glass Filled | Gold | 10μin (0.25μm) | Beryllium Copper | Tin | 200μin (5.08μm) | Brass | ||
|
|
|
Aries Electronics |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 38POS GOLD
|
518 | - | Through Hole | DIP，0.2" (5.08mm) Row Spacing | Open Frame | Solder | Polyamide (PA46)，Nylon 4/6，Glass Filled | Gold | 10μin (0.25μm) | Beryllium Copper | Gold | 10μin (0.25μm) | Brass | ||
|
|
|
Aries Electronics |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 38POS GOLD
|
Lo-PROfile，513 | - | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Closed Frame | Solder | Polyamide (PA46)，Nylon 4/6，Glass Filled | Gold | 10μin (0.25μm) | Beryllium Copper | Tin | 200μin (5.08μm) | Brass | ||
|
|
|
Aries Electronics |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 38POS TIN
|
501 | -55°C ~ 105°C | Through Hole | DIP，0.6" (15.24mm) Row Spacing | Closed Frame | Wire Wrap | Polyamide (PA46)，Nylon 4/6，Glass Filled | Tin | 200μin (5.08μm) | Phosphor Bronze | Tin | 200μin (5.08μm) | Phosphor Bronze | ||
|
|
|
Aries Electronics |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 38POS TIN
|
501 | -55°C ~ 125°C | Through Hole | DIP，0.6" (15.24mm) Row Spacing | Closed Frame | Wire Wrap | Polyamide (PA46)，Nylon 4/6，Glass Filled | Tin | 200μin (5.08μm) | Phosphor Bronze | Tin | 200μin (5.08μm) | Phosphor Bronze | ||
|
|
|
Aries Electronics |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 38POS GOLD
|
Lo-PROfile，513 | - | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Closed Frame | Solder | Polyamide (PA46)，Nylon 4/6，Glass Filled | Gold | 10μin (0.25μm) | Beryllium Copper | Gold | 10μin (0.25μm) | Brass | ||
|
|
|
Aries Electronics |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 38POS GOLD
|
508 | -55°C ~ 105°C | Through Hole | DIP，0.2" (5.08mm) Row Spacing | Closed Frame | Wire Wrap | Polyamide (PA46)，Nylon 4/6 | Gold | 10μin (0.25μm) | Beryllium Copper | Tin | 200μin (5.08μm) | Brass | ||
|
|
|
Aries Electronics |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 38POS GOLD
|
508 | -55°C ~ 105°C | Through Hole | DIP，0.2" (5.08mm) Row Spacing | Closed Frame | Wire Wrap | Polyamide (PA46)，Nylon 4/6 | Gold | 10μin (0.25μm) | Beryllium Copper | Tin | 200μin (5.08μm) | Brass | ||
|
|
|
Aries Electronics |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 38POS GOLD
|
511 | -55°C ~ 125°C | Through Hole | DIP，0.6" (15.24mm) Row Spacing | Closed Frame | Solder | Polyamide (PA46)，Nylon 4/6，Glass Filled | Gold | 10μin (0.25μm) | Phosphor Bronze | Gold | 10μin (0.25μm) | Phosphor Bronze | ||
|
|
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Aries Electronics |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 38POS GOLD
|
Vertisockets 800 | -55°C ~ 105°C | Through Hole，Right Angle，Horizontal | DIP，0.6" (15.24mm) Row Spacing | Closed Frame | Solder | Polyamide (PA46)，Nylon 4/6，Glass Filled | Gold | 30μin (0.76μm) | Beryllium Copper | Tin | 200μin (5.08μm) | Brass | ||
|
|
|
Aries Electronics |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 38POS GOLD
|
Vertisockets 800 | -55°C ~ 105°C | Through Hole，Right Angle，Horizontal | DIP，0.6" (15.24mm) Row Spacing | Closed Frame | Solder | Polyamide (PA46)，Nylon 4/6，Glass Filled | Gold | 30μin (0.76μm) | Beryllium Copper | Tin | 200μin (5.08μm) | Brass | ||
|
|
|
Aries Electronics |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 38POS GOLD
|
Vertisockets 800 | -55°C ~ 105°C | Through Hole，Right Angle，Horizontal | DIP，0.6" (15.24mm) Row Spacing | Closed Frame | Solder | Polyamide (PA46)，Nylon 4/6，Glass Filled | Gold | 30μin (0.76μm) | Beryllium Copper | Tin | 200μin (5.08μm) | Brass |
