- Packaging：
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- Operating Temperature：
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- Mounting Type：
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- Type：
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- Features：
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- Termination：
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- Housing Material：
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- Number of Positions or Pins (Grid)：
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- Contact Finish Thickness - Mating：
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- Pitch - Post：
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- Contact Finish - Post：
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- Contact Finish Thickness - Post：
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- Contact Material - Post：
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- Conditions sélectionnées:
Découvrez les produits 135
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Operating Temperature | Mounting Type | Type | Features | Termination | Housing Material | Number of Positions or Pins (Grid) | Contact Finish Thickness - Mating | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Operating Temperature | Mounting Type | Type | Features | Termination | Housing Material | Number of Positions or Pins (Grid) | Contact Finish Thickness - Mating | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | |
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Mill-Max Manufacturing Corp. |
240
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3 jours |
-
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MOQ: 1 MPQ: 1
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CONN SOCKET SIP 21POS GOLD
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Bulk | 317 | -55°C ~ 125°C | Through Hole | SIP | - | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 21 (1 x 21) | 30μin (0.76μm) | 0.070" (1.78mm) | Tin-Lead | 200μin (5.08μm) | Brass Alloy | ||
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|
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Mill-Max Manufacturing Corp. |
476
|
3 jours |
-
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MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 30POS GOLD
|
Tube | 117 | -55°C ~ 125°C | Through Hole | DIP，0.4" (10.16mm) Row Spacing | Open Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 30 (2 x 15) | 30μin (0.76μm) | 0.070" (1.78mm) | Tin-Lead | 200μin (5.08μm) | Brass Alloy | ||
|
|
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Mill-Max Manufacturing Corp. |
1,326
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 42POS GOLD
|
Tube | 117 | -55°C ~ 125°C | Through Hole | DIP，0.6" (15.24mm) Row Spacing | Open Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 42 (2 x 21) | 30μin (0.76μm) | 0.070" (1.78mm) | Tin-Lead | 200μin (5.08μm) | Brass Alloy | ||
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|
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Mill-Max Manufacturing Corp. |
228
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 42POS GOLD
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Tube | 117 | -55°C ~ 125°C | Through Hole | DIP，0.6" (15.24mm) Row Spacing | Open Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 42 (2 x 21) | 30μin (0.76μm) | 0.070" (1.78mm) | Tin | 200μin (5.08μm) | Brass Alloy | ||
|
|
|
Mill-Max Manufacturing Corp. |
199
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 56POS GOLD
|
Tube | 117 | -55°C ~ 125°C | Through Hole | DIP，0.6" (15.24mm) Row Spacing | Open Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 56 (2 x 28) | 30μin (0.76μm) | 0.070" (1.78mm) | Tin-Lead | 200μin (5.08μm) | Brass Alloy | ||
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|
|
Mill-Max Manufacturing Corp. |
370
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET 21POS .070 STR GOLD
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Bulk | 317 | -55°C ~ 125°C | Through Hole | SIP | - | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 21 (1 x 21) | 30μin (0.76μm) | 0.070" (1.78mm) | Tin | 200μin (5.08μm) | Brass Alloy | ||
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|
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Mill-Max Manufacturing Corp. |
126
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET 16POS .070 STR GOLD
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Bulk | 317 | -55°C ~ 125°C | Through Hole | SIP | - | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 16 (1 x 16) | 30μin (0.76μm) | 0.070" (1.78mm) | Tin | 200μin (5.08μm) | Brass Alloy | ||
|
|
|
Mill-Max Manufacturing Corp. |
318
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 30POS GOLD
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Tube | 117 | -55°C ~ 125°C | Through Hole | DIP，0.4" (10.16mm) Row Spacing | Open Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 30 (2 x 15) | 30μin (0.76μm) | 0.070" (1.78mm) | Tin | 200μin (5.08μm) | Brass Alloy | ||
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|
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Mill-Max Manufacturing Corp. |
158
|
3 jours |
-
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MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 48POS GOLD
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Tube | 117 | -55°C ~ 125°C | Through Hole | DIP，0.6" (15.24mm) Row Spacing | Open Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 48 (2 x 24) | 30μin (0.76μm) | 0.070" (1.78mm) | Tin | 200μin (5.08μm) | Brass Alloy | ||
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|
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Mill-Max Manufacturing Corp. |
171
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 64POS GOLD
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Tube | 117 | -55°C ~ 125°C | Through Hole | DIP，0.6" (15.24mm) Row Spacing | Open Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 64 (2 x 32) | 30μin (0.76μm) | 0.070" (1.78mm) | Tin | 200μin (5.08μm) | Brass Alloy | ||
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|
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Mill-Max Manufacturing Corp. |
203
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 68POS GOLD
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Tube | 117 | -55°C ~ 125°C | Through Hole | DIP，0.6" (15.24mm) Row Spacing | Open Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 68 (2 x 34) | 30μin (0.76μm) | 0.070" (1.78mm) | Tin | 200μin (5.08μm) | Brass Alloy | ||
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|
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Mill-Max Manufacturing Corp. |
83
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 64POS GOLD
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Tube | 117 | -55°C ~ 125°C | Through Hole | DIP，0.75" (19.05mm) Row Spacing | Closed Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 64 (2 x 32) | 30μin (0.76μm) | 0.070" (1.78mm) | Tin-Lead | 200μin (5.08μm) | Brass Alloy | ||
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|
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3M |
29
|
3 jours |
-
|
MOQ: 1 MPQ: 1
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CONN IC DIP SOCKET ZIF 64POS GLD
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Bulk | Textool | -55°C ~ 125°C | Connector | DIP，ZIF (ZIP)，0.9" (22.86mm) Row Spacing | Closed Frame | Press-Fit | Polysulfone (PSU)，Glass Filled | 64 (2 x 32) | 30μin (0.76μm) | 0.070" (1.78mm) | Gold | 30μin (0.76μm) | Beryllium Copper | ||
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|
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3M |
37
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET ZIF 28POS GLD
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Bulk | Textool | -55°C ~ 125°C | Connector | DIP，ZIF (ZIP)，0.6" (15.24mm) Row Spacing | Closed Frame | Press-Fit | Polysulfone (PSU)，Glass Filled | 28 (2 x 14) | 30μin (0.76μm) | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | ||
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3M |
86
|
3 jours |
-
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MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET ZIF 56POS GLD
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Bulk | Textool | -55°C ~ 125°C | Connector | DIP，ZIF (ZIP)，0.6" (15.24mm) Row Spacing | Closed Frame | Press-Fit | Polysulfone (PSU)，Glass Filled | 56 (2 x 28) | 30μin (0.76μm) | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | ||
|
|
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Mill-Max Manufacturing Corp. |
86
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 48POS GOLD
|
Tube | 117 | -55°C ~ 125°C | Through Hole | DIP，0.4" (10.16mm) Row Spacing | Open Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 48 (2 x 24) | 30μin (0.76μm) | 0.070" (1.78mm) | Tin-Lead | 200μin (5.08μm) | Brass Alloy | ||
|
|
|
Mill-Max Manufacturing Corp. |
66
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 64POS GOLD
|
Tube | 117 | -55°C ~ 125°C | Through Hole | DIP，0.75" (19.05mm) Row Spacing | Open Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 64 (2 x 32) | 30μin (0.76μm) | 0.070" (1.78mm) | Tin | 200μin (5.08μm) | Brass Alloy | ||
|
|
|
3M |
20
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET ZIF 32POS GLD
|
Bulk | Textool | -55°C ~ 125°C | Connector | DIP，ZIF (ZIP)，0.6" (15.24mm) Row Spacing | Closed Frame | Press-Fit | Polysulfone (PSU)，Glass Filled | 32 (2 x 16) | 30μin (0.76μm) | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | ||
|
|
|
3M |
24
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET ZIF 42POS GLD
|
Bulk | Textool | -55°C ~ 125°C | Connector | DIP，ZIF (ZIP)，0.6" (15.24mm) Row Spacing | Closed Frame | Press-Fit | Polysulfone (PSU)，Glass Filled | 42 (2 x 21) | 30μin (0.76μm) | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | ||
|
|
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Mill-Max Manufacturing Corp. |
276
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET SIP 8POS GOLD
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Tube | 317 | -55°C ~ 125°C | Through Hole | SIP | - | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 8 (1 x 8) | Flash | 0.070" (1.78mm) | Tin | 200μin (5.08μm) | Brass Alloy |
