- Packaging：
-
- Series：
-
- Operating Temperature：
-
- Mounting Type：
-
- Type：
-
- Features：
-
- Termination：
-
- Housing Material：
-
- Number of Positions or Pins (Grid)：
-
- Pitch - Mating：
-
- Contact Finish - Mating：
-
- Contact Material - Mating：
-
- Pitch - Post：
-
- Contact Finish - Post：
-
- Contact Finish Thickness - Post：
-
- Contact Material - Post：
-
- Conditions sélectionnées:
Découvrez les produits 2,307
 |
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Operating Temperature | Mounting Type | Type | Features | Termination | Housing Material | Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Material - Mating | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Operating Temperature | Mounting Type | Type | Features | Termination | Housing Material | Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Material - Mating | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | |
|
|
|
Aries Electronics |
2,527
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 14POS GOLD
|
Bulk | 518 | - | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Solder | Polyamide (PA46)，Nylon 4/6，Glass Filled | 14 (2 x 7) | 0.100" (2.54mm) | Gold | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass | ||
|
|
|
Aries Electronics |
6,009
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 8POS GOLD
|
Bulk | 518 | - | Surface Mount | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Solder | Polyamide (PA46)，Nylon 4/6，Glass Filled | 8 (2 x 4) | 0.100" (2.54mm) | Gold | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass | ||
|
|
|
Mill-Max Manufacturing Corp. |
4,311
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 28POS GOLD
|
Tube | 110 | -55°C ~ 125°C | Through Hole | DIP，0.6" (15.24mm) Row Spacing | Open Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 28 (2 x 14) | 0.100" (2.54mm) | Gold | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass Alloy | ||
|
|
|
Aries Electronics |
3,517
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 10POS GOLD
|
Bulk | Lo-PROfile，513 | - | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Closed Frame | Solder | Polyamide (PA46)，Nylon 4/6，Glass Filled | 10 (2 x 5) | 0.100" (2.54mm) | Gold | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass | ||
|
|
|
Aries Electronics |
1,734
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 40POS GOLD
|
Bulk | 518 | - | Through Hole | DIP，0.6" (15.24mm) Row Spacing | Open Frame | Solder | Polyamide (PA46)，Nylon 4/6，Glass Filled | 40 (2 x 20) | 0.100" (2.54mm) | Gold | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass | ||
|
|
|
Aries Electronics |
3,340
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET SIP 25POS GOLD
|
Bulk | 513 | - | Through Hole | SIP | - | Solder | Polyamide (PA46)，Nylon 4/6，Glass Filled | 25 (1 x 25) | 0.100" (2.54mm) | Gold | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass | ||
|
|
|
Aries Electronics |
1,290
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET SIP 40POS GOLD
|
Bulk | 518 | - | Through Hole | SIP | Open Frame | Solder | Polyamide (PA46)，Nylon 4/6，Glass Filled | 40 (1 x 40) | 0.100" (2.54mm) | Gold | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass | ||
|
|
|
Aries Electronics |
104
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 14POS GOLD
|
Bulk | Vertisockets 800 | - | Through Hole，Right Angle，Vertical | DIP，0.3" (7.62mm) Row Spacing | Closed Frame | Solder | Polyamide (PA46)，Nylon 4/6 | 14 (2 x 7) | 0.100" (2.54mm) | Gold | Phosphor Bronze | 0.100" (2.54mm) | Gold | 10μin (0.25μm) | Phosphor Bronze | ||
|
|
|
Mill-Max Manufacturing Corp. |
2,418
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 8POS GOLD
|
Tube | 110 | -55°C ~ 125°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 8 (2 x 4) | 0.100" (2.54mm) | Gold | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass Alloy | ||
|
|
|
ASSMANN WSW Components |
25,988
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 6POS GOLD
|
Tube | - | -40°C ~ 105°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Solder | Thermoplastic，Polyester | 6 (2 x 3) | 0.100" (2.54mm) | Gold | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Beryllium Copper | ||
|
|
|
Aries Electronics |
4,578
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 8POS GOLD
|
Bulk | 518 | - | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Solder | Polyamide (PA46)，Nylon 4/6，Glass Filled | 8 (2 x 4) | 0.100" (2.54mm) | Gold | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass | ||
|
|
|
Aries Electronics |
8,359
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET SIP 8POS GOLD
|
Bulk | 518 | - | Through Hole | SIP | Open Frame | Solder | Polyamide (PA46)，Nylon 4/6，Glass Filled | 8 (1 x 8) | 0.100" (2.54mm) | Gold | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass | ||
|
|
|
Mill-Max Manufacturing Corp. |
2,725
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 20POS GOLD
|
Tube | 110 | -55°C ~ 125°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 20 (2 x 10) | 0.100" (2.54mm) | Gold | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass Alloy | ||
|
|
|
Aries Electronics |
2,109
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 16POS GOLD
|
Bulk | 518 | - | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Solder | Polyamide (PA46)，Nylon 4/6，Glass Filled | 16 (2 x 8) | 0.100" (2.54mm) | Gold | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass | ||
|
|
|
Aries Electronics |
1,199
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 18POS GOLD
|
Bulk | 518 | - | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Solder | Polyamide (PA46)，Nylon 4/6，Glass Filled | 18 (2 x 9) | 0.100" (2.54mm) | Gold | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass | ||
|
|
|
Mill-Max Manufacturing Corp. |
943
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 40POS GOLD
|
Tube | 110 | -55°C ~ 125°C | Through Hole | DIP，0.6" (15.24mm) Row Spacing | Open Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 40 (2 x 20) | 0.100" (2.54mm) | Gold | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass Alloy | ||
|
|
|
Aries Electronics |
1,526
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 28POS GOLD
|
Bulk | 518 | - | Through Hole | DIP，0.6" (15.24mm) Row Spacing | Open Frame | Solder | Polyamide (PA46)，Nylon 4/6，Glass Filled | 28 (2 x 14) | 0.100" (2.54mm) | Gold | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass | ||
|
|
|
Aries Electronics |
4,385
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 32POS GOLD
|
Bulk | 518 | - | Through Hole | DIP，0.6" (15.24mm) Row Spacing | Open Frame | Solder | Polyamide (PA46)，Nylon 4/6，Glass Filled | 32 (2 x 16) | 0.100" (2.54mm) | Gold | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass | ||
|
|
|
Harwin Inc. |
122
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET SIP 20POS GOLD
|
Bulk | D01-995 | -55°C ~ 125°C | Through Hole | SIP | - | Wire Wrap | Polycyclohexylenedimethylene Terephthalate (PCT)，Glass Filled | 20 (1 x 20) | 0.100" (2.54mm) | Gold | Beryllium Copper | 0.100" (2.54mm) | Tin | 196.8μin (5.00μm) | Brass | ||
|
|
|
Aries Electronics |
191
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 16POS GOLD
|
Bulk | EJECT-A-DIP | -55°C ~ 105°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Closed Frame | Solder | Polyamide (PA46)，Nylon 4/6，Glass Filled | 16 (2 x 8) | 0.100" (2.54mm) | Gold | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass |
