- Series：
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- Operating Temperature：
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- Mounting Type：
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- Termination：
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- Housing Material：
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- Number of Positions or Pins (Grid)：
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- Contact Finish - Mating：
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- Contact Finish Thickness - Mating：
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- Contact Material - Mating：
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- Contact Finish - Post：
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- Contact Finish Thickness - Post：
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- Contact Material - Post：
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- Conditions sélectionnées:
Découvrez les produits 293
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Series | Operating Temperature | Mounting Type | Termination | Housing Material | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Series | Operating Temperature | Mounting Type | Termination | Housing Material | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | |
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|
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3M |
1,022
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET ZIF 14POS GLD
|
Textool | -55°C ~ 125°C | Connector | Press-Fit | Polysulfone (PSU)，Glass Filled | 14 (2 x 7) | Gold | 30μin (0.76μm) | Beryllium Copper | Gold | 30μin (0.76μm) | Beryllium Copper | ||
|
|
|
3M |
1,089
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET ZIF 16POS GLD
|
Textool | -55°C ~ 125°C | Connector | Press-Fit | Polysulfone (PSU)，Glass Filled | 16 (2 x 8) | Gold | 30μin (0.76μm) | Beryllium Copper | Gold | 30μin (0.76μm) | Beryllium Copper | ||
|
|
|
3M |
157
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET ZIF 18POS GLD
|
Textool | -55°C ~ 125°C | Connector | Press-Fit | Polysulfone (PSU)，Glass Filled | 18 (2 x 9) | Gold | 30μin (0.76μm) | Beryllium Copper | Gold | 30μin (0.76μm) | Beryllium Copper | ||
|
|
|
3M |
140
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET ZIF 16POS GLD
|
OEM | -55°C ~ 105°C | Through Hole | Solder | Polyether Imide (PEI)，Glass Filled | 16 (2 x 8) | Gold | 250μin (6.35μm) | Beryllium Copper | Gold | 250μin (6.35μm) | Beryllium Copper | ||
|
|
|
3M |
21
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET ZIF 24POS GLD
|
Textool | -55°C ~ 125°C | Connector | Press-Fit | Polysulfone (PSU)，Glass Filled | 24 (2 x 12) | Gold | 30μin (0.76μm) | Beryllium Copper | Gold | 30μin (0.76μm) | Beryllium Copper | ||
|
|
|
3M |
4
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET ZIF 20POS GLD
|
Textool | -55°C ~ 125°C | Connector | Press-Fit | Polysulfone (PSU)，Glass Filled | 20 (2 x 10) | Gold | 30μin (0.76μm) | Beryllium Copper | Gold | 30μin (0.76μm) | Beryllium Copper | ||
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|
|
Aries Electronics |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET ZIF 24POS TIN
|
55 | - | Through Hole | Solder | Polyphenylene Sulfide (PPS)，Glass Filled | 24 (2 x 12) | Tin | 200μin (5.08μm) | Beryllium Copper | Tin | 200μin (5.08μm) | Beryllium Copper | ||
|
|
|
Aries Electronics |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET ZIF 24POS TIN
|
55 | - | Through Hole | Solder | Polyphenylene Sulfide (PPS)，Glass Filled | 24 (2 x 12) | Tin | 200μin (5.08μm) | Beryllium Copper | Tin | 200μin (5.08μm) | Beryllium Copper | ||
|
|
|
Aries Electronics |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET ZIF 24POS TIN
|
55 | - | Through Hole | Solder | Polyphenylene Sulfide (PPS)，Glass Filled | 24 (2 x 12) | Tin | 200μin (5.08μm) | Beryllium Copper | Tin | 200μin (5.08μm) | Beryllium Copper | ||
|
|
|
Aries Electronics |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET ZIF 28POS TIN
|
55 | - | Through Hole | Solder | Polyphenylene Sulfide (PPS)，Glass Filled | 28 (2 x 14) | Tin | 200μin (5.08μm) | Beryllium Copper | Tin | 200μin (5.08μm) | Beryllium Copper | ||
|
|
|
Aries Electronics |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET ZIF 28POS TIN
|
55 | - | Through Hole | Solder | Polyphenylene Sulfide (PPS)，Glass Filled | 28 (2 x 14) | Tin | 200μin (5.08μm) | Beryllium Copper | Tin | 200μin (5.08μm) | Beryllium Copper | ||
|
|
|
Aries Electronics |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET ZIF 28POS TIN
|
55 | - | Through Hole | Solder | Polyphenylene Sulfide (PPS)，Glass Filled | 28 (2 x 14) | Tin | 200μin (5.08μm) | Beryllium Copper | Tin | 200μin (5.08μm) | Beryllium Copper | ||
|
|
|
Aries Electronics |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET ZIF 24POS TIN
|
55 | - | Through Hole | Solder | Polyphenylene Sulfide (PPS)，Glass Filled | 24 (2 x 12) | Tin | 200μin (5.08μm) | Beryllium Copper | Tin | 200μin (5.08μm) | Beryllium Copper | ||
|
|
|
Aries Electronics |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET ZIF 32POS TIN
|
55 | - | Through Hole | Solder | Polyphenylene Sulfide (PPS)，Glass Filled | 32 (2 x 16) | Tin | 200μin (5.08μm) | Beryllium Copper | Tin | 200μin (5.08μm) | Beryllium Copper | ||
|
|
|
Aries Electronics |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET ZIF 32POS TIN
|
55 | - | Through Hole | Solder | Polyphenylene Sulfide (PPS)，Glass Filled | 32 (2 x 16) | Tin | 200μin (5.08μm) | Beryllium Copper | Tin | 200μin (5.08μm) | Beryllium Copper | ||
|
|
|
Aries Electronics |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET ZIF 32POS TIN
|
55 | - | Through Hole | Solder | Polyphenylene Sulfide (PPS)，Glass Filled | 32 (2 x 16) | Tin | 200μin (5.08μm) | Beryllium Copper | Tin | 200μin (5.08μm) | Beryllium Copper | ||
|
|
|
Aries Electronics |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET ZIF 24POS TIN
|
57 | - | Through Hole | Solder | Polyphenylene Sulfide (PPS)，Glass Filled | 24 (2 x 12) | Tin | 200μin (5.08μm) | Beryllium Copper | Tin | 200μin (5.08μm) | Beryllium Copper | ||
|
|
|
Aries Electronics |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET ZIF 24POS TIN
|
57 | - | Through Hole | Solder | Polyphenylene Sulfide (PPS)，Glass Filled | 24 (2 x 12) | Tin | 200μin (5.08μm) | Beryllium Copper | Tin | 200μin (5.08μm) | Beryllium Copper | ||
|
|
|
Aries Electronics |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET ZIF 24POS TIN
|
57 | - | Through Hole | Solder | Polyphenylene Sulfide (PPS)，Glass Filled | 24 (2 x 12) | Tin | 200μin (5.08μm) | Beryllium Copper | Tin | 200μin (5.08μm) | Beryllium Copper | ||
|
|
|
Aries Electronics |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET ZIF 24POS TIN
|
57 | - | Through Hole | Solder | Polyphenylene Sulfide (PPS)，Glass Filled | 24 (2 x 12) | Tin | 200μin (5.08μm) | Beryllium Copper | Tin | 200μin (5.08μm) | Beryllium Copper |
