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- Operating Temperature:
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- Conditions sélectionnées:
Découvrez les produits 1,795
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Series | Operating Temperature | Type | Material | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Series | Operating Temperature | Type | Material | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | ||
Leader Tech Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.08 X 0.45 BD 16--8-45LPAH-BD-1
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | 0.080" (2.03mm) | 16.000" (406.40mm) | 0.450" (11.43mm) | Unplated | - | Adhesive | ||||
Leader Tech Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.13 X 0.37 NI 16--13-37AH-NI-16
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | 0.130" (3.30mm) | 16.000" (406.40mm) | 0.370" (9.40mm) | Nickel | Flash | Adhesive | ||||
Leader Tech Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.13 X 0.281 BD 16--13-28U-BD-16
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | 0.130" (3.30mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | Unplated | - | Adhesive | ||||
Leader Tech Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.14 X 0.37 NI 16--FOLDED SERIES
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | 0.140" (3.56mm) | 16.000" (406.40mm) | 0.370" (9.40mm) | Nickel | Flash | Adhesive | ||||
Leader Tech Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.11 X 0.32 SN 17.76--11-32AH-SN
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | 0.110" (2.79mm) | 17.760" (451.10mm) | 0.320" (8.13mm) | Tin | Flash | Adhesive | ||||
Leader Tech Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.04 X 0.34 BD 16--4-34D-BD-16--
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | 0.040" (1.02mm) | 16.000" (406.40mm) | 0.300" (7.62mm) | Unplated | - | Adhesive | ||||
Leader Tech Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.11 X 0.44 X 045 BD 16--11-45C-
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.450" (11.43mm) | Unplated | - | Adhesive | ||||
Leader Tech Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.11 X 0.44 X 050 BD 16--11-45C-
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.450" (11.43mm) | Unplated | - | Adhesive | ||||
Leader Tech Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.11 X 0.45 X 060 BD 16--11-45C-
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.450" (11.43mm) | Unplated | - | Adhesive | ||||
Leader Tech Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.11 X 0.44 X 070 BD 16--11-45C-
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.450" (11.43mm) | Unplated | - | Adhesive | ||||
Leader Tech Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.11 X 0.35 BD 15--11-35DTS-BD-1
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | 0.110" (2.79mm) | 15.000" (381.00mm) | 0.350" (8.89mm) | Unplated | - | Adhesive | ||||
Leader Tech Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.11 X 0.35 BD 15--11-35-DTS-BD-
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | 0.110" (2.79mm) | 15.000" (381.00mm) | 0.350" (8.89mm) | Unplated | - | Adhesive | ||||
Leader Tech Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.10 X 0.30 X 070 SN 16--10-30C-
|
TechMESH | -55°C ~ 121°C | Fingerstock | Beryllium Copper | 0.100" (2.54mm) | 16.000" (406.40mm) | 0.300" (7.62mm) | Tin | Flash | Adhesive | ||||
Leader Tech Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.11 X 0.354 BD 15--11-S-35DTS-B
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | 0.110" (2.79mm) | 15.000" (381.00mm) | 0.350" (8.89mm) | Unplated | - | Adhesive | ||||
Leader Tech Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.08 X 0.45 SN 16--8-45LPAH-SN-1
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | 0.080" (2.03mm) | 16.000" (406.40mm) | 0.450" (11.43mm) | Tin | Flash | Adhesive | ||||
Leader Tech Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.14 X 0.36 AG 16--FOLDED SERIES
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | 0.140" (3.56mm) | 16.000" (406.40mm) | 0.370" (9.40mm) | Silver | - | Adhesive | ||||
Laird Technologies EMI |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
PCLIP,STR,ZNY,CLO
|
- | - | - | - | - | - | - | - | - | - | ||||
Leader Tech Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.05 X 0.38 BD 16--4-38D-BD-16--
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | 0.040" (1.02mm) | 16.000" (406.40mm) | 0.380" (9.65mm) | Unplated | - | Adhesive | ||||
Leader Tech Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.07 X 0.30 ST 24--6-30T-ST-24--
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | 0.070" (1.78mm) | 24.000" (609.60mm) | 0.300" (7.62mm) | Tin | Flash | Adhesive | ||||
Leader Tech Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.23 X 0.60 BD 24--FOLDED SERIES
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | 0.230" (5.84mm) | 24.000" (609.60mm) | 0.600" (15.24mm) | Unplated | - | Adhesive |