- Operating Temperature:
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- Type:
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- Material:
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- Height:
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- Length:
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- Width:
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- Plating:
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- Plating - Thickness:
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- Conditions sélectionnées:
Découvrez les produits 1,317
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Operating Temperature | Type | Material | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Operating Temperature | Type | Material | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | ||
ITT Cannon,LLC |
183,600
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
MICRO UNIVERSAL CONTACT Z 1.8MM
|
- | Shield Finger,Pre-Loaded | Titanium Copper | 0.071" (1.80mm) | 0.098" (2.50mm) | 0.038" (0.96mm) | Nickel | 118.11μin (3.00μm) | Solder | ||||
ITT Cannon,LLC |
196,508
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
MICRO UNIVERSAL CONTACT Z 1.8MM
|
- | Shield Finger,Pre-Loaded | Titanium Copper | 0.071" (1.80mm) | 0.098" (2.50mm) | 0.038" (0.96mm) | Nickel | 118.11μin (3.00μm) | Solder | ||||
ITT Cannon,LLC |
196,508
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
MICRO UNIVERSAL CONTACT Z 1.8MM
|
- | Shield Finger,Pre-Loaded | Titanium Copper | 0.071" (1.80mm) | 0.098" (2.50mm) | 0.038" (0.96mm) | Nickel | 118.11μin (3.00μm) | Solder | ||||
Harwin Inc. |
165,000
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD CLIP MICRO TIN SMD
|
-25°C ~ 150°C | Shield Clip | Stainless Steel | 0.054" (1.37mm) | 0.256" (6.50mm) | 0.035" (0.90mm) | Tin | 118.11μin (3.00μm) | Solder | ||||
Harwin Inc. |
171,519
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD CLIP MICRO TIN SMD
|
-25°C ~ 150°C | Shield Clip | Stainless Steel | 0.054" (1.37mm) | 0.256" (6.50mm) | 0.035" (0.90mm) | Tin | 118.11μin (3.00μm) | Solder | ||||
Harwin Inc. |
171,519
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD CLIP MICRO TIN SMD
|
-25°C ~ 150°C | Shield Clip | Stainless Steel | 0.054" (1.37mm) | 0.256" (6.50mm) | 0.035" (0.90mm) | Tin | 118.11μin (3.00μm) | Solder | ||||
ITT Cannon,LLC |
95,000
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
UNIVERSAL CONTACT 1.3MM SMD
|
- | Shield Finger,Pre-Loaded | Beryllium Copper | 0.051" (1.30mm) | 0.137" (3.48mm) | 0.035" (0.90mm) | Nickel | 118.11μin (3.00μm) | Solder | ||||
ITT Cannon,LLC |
112,249
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
UNIVERSAL CONTACT 1.3MM SMD
|
- | Shield Finger,Pre-Loaded | Beryllium Copper | 0.051" (1.30mm) | 0.137" (3.48mm) | 0.035" (0.90mm) | Nickel | 118.11μin (3.00μm) | Solder | ||||
ITT Cannon,LLC |
112,249
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
UNIVERSAL CONTACT 1.3MM SMD
|
- | Shield Finger,Pre-Loaded | Beryllium Copper | 0.051" (1.30mm) | 0.137" (3.48mm) | 0.035" (0.90mm) | Nickel | 118.11μin (3.00μm) | Solder | ||||
ITT Cannon,LLC |
238,000
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
UNIVERSAL CONTACT 1.8MM SMD
|
- | Shield Finger,Pre-Loaded | Beryllium Copper | 0.071" (1.80mm) | 0.132" (3.35mm) | 0.035" (0.90mm) | Nickel | 118.11μin (3.00μm) | Solder | ||||
ITT Cannon,LLC |
242,742
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
UNIVERSAL CONTACT 1.8MM SMD
|
- | Shield Finger,Pre-Loaded | Beryllium Copper | 0.071" (1.80mm) | 0.132" (3.35mm) | 0.035" (0.90mm) | Nickel | 118.11μin (3.00μm) | Solder | ||||
ITT Cannon,LLC |
242,742
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
UNIVERSAL CONTACT 1.8MM SMD
|
- | Shield Finger,Pre-Loaded | Beryllium Copper | 0.071" (1.80mm) | 0.132" (3.35mm) | 0.035" (0.90mm) | Nickel | 118.11μin (3.00μm) | Solder | ||||
ITT Cannon,LLC |
156,000
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
UNIVERSAL CONTACT 2.5MM SMD
|
- | Shield Finger,Pre-Loaded | Beryllium Copper | 0.098" (2.50mm) | 0.192" (4.87mm) | 0.043" (1.10mm) | Gold | 5.906μin (0.15μm) | Solder | ||||
ITT Cannon,LLC |
160,470
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
UNIVERSAL CONTACT 2.5MM SMD
|
- | Shield Finger,Pre-Loaded | Beryllium Copper | 0.098" (2.50mm) | 0.192" (4.87mm) | 0.043" (1.10mm) | Gold | 5.906μin (0.15μm) | Solder | ||||
ITT Cannon,LLC |
160,470
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
UNIVERSAL CONTACT 2.5MM SMD
|
- | Shield Finger,Pre-Loaded | Beryllium Copper | 0.098" (2.50mm) | 0.192" (4.87mm) | 0.043" (1.10mm) | Gold | 5.906μin (0.15μm) | Solder | ||||
Harwin Inc. |
260,000
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD CLIP MICRO TIN SMD
|
-25°C ~ 150°C | Shield Clip | Stainless Steel | 0.035" (0.90mm) | 0.177" (4.50mm) | 0.024" (0.60mm) | Tin | 118.11μin (3.00μm) | Solder | ||||
Harwin Inc. |
274,269
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD CLIP MICRO TIN SMD
|
-25°C ~ 150°C | Shield Clip | Stainless Steel | 0.035" (0.90mm) | 0.177" (4.50mm) | 0.024" (0.60mm) | Tin | 118.11μin (3.00μm) | Solder | ||||
Harwin Inc. |
274,269
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD CLIP MICRO TIN SMD
|
-25°C ~ 150°C | Shield Clip | Stainless Steel | 0.035" (0.90mm) | 0.177" (4.50mm) | 0.024" (0.60mm) | Tin | 118.11μin (3.00μm) | Solder | ||||
Harwin Inc. |
145,000
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD CLIP MINI TIN SMD
|
-40°C ~ 85°C | Shield Clip | Stainless Steel | 0.083" (2.10mm) | 0.233" (5.92mm) | 0.043" (1.10mm) | Tin | 118.11μin (3.00μm) | Solder | ||||
Harwin Inc. |
154,577
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD CLIP MINI TIN SMD
|
-40°C ~ 85°C | Shield Clip | Stainless Steel | 0.083" (2.10mm) | 0.233" (5.92mm) | 0.043" (1.10mm) | Tin | 118.11μin (3.00μm) | Solder |