- Series:
-
- Operating Temperature:
-
- Material:
-
- Height:
-
- Length:
-
- Plating:
-
- Plating - Thickness:
-
- Attachment Method:
-
- Conditions sélectionnées:
Découvrez les produits 26
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Series | Operating Temperature | Type | Material | Height | Length | Plating | Plating - Thickness | Attachment Method | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Series | Operating Temperature | Type | Material | Height | Length | Plating | Plating - Thickness | Attachment Method | ||
Laird Technologies EMI |
491
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
GASKET BECU ALLOY 6.35X406.4MM
|
Foldover | 121°C | Fingerstock | Beryllium Copper | 0.080" (2.03mm) | 16.000" (406.40mm) | - | - | Adhesive | ||||
Laird Technologies EMI |
483
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 6.35X406.4MM
|
- | - | - | - | - | 16.000" (406.40mm) | - | - | - | ||||
Laird Technologies EMI |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTCK ULTRASFT 6.35X406.4MM
|
Foldover | 121°C | Fingerstock | Beryllium Copper | 0.080" (2.03mm) | 16.000" (406.40mm) | - | - | - | ||||
Leader Tech Inc. |
93
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
COPPER BERYLLIUM FINGERSTOCK EMI
|
- | - | Fingerstock | Beryllium Copper | 0.080" (2.03mm) | 16.000" (406.40mm) | - | - | - | ||||
Laird Technologies EMI |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
NOSG COIL BF PSA
|
Foldover | 121°C | Fingerstock | Beryllium Copper | 0.080" (2.03mm) | 16.000" (406.40mm) | Unplated | - | Adhesive | ||||
Laird Technologies EMI |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
NOSG,STR,BF
|
Foldover | 121°C | Fingerstock | Beryllium Copper | 0.080" (2.03mm) | 16.000" (406.40mm) | - | - | Adhesive | ||||
Laird Technologies EMI |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
NOSG COIL SNB PSA
|
Foldover | 121°C | Fingerstock | Beryllium Copper | 0.080" (2.03mm) | 25.000 (7.62m) | Tin | 299.21μin (7.60μm) | Adhesive | ||||
Laird Technologies EMI |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
NOSG,STR,ZNC,PSA
|
Foldover | 121°C | Fingerstock | Beryllium Copper | 0.080" (2.03mm) | 16.000" (406.40mm) | Zinc + Clear Chromate | 299.21μin (7.60μm) | Adhesive | ||||
Laird Technologies EMI |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
NOSG,STR,SNB,PSA
|
Foldover | 121°C | Fingerstock | Beryllium Copper | 0.080" (2.03mm) | 16.000" (406.40mm) | Tin | 299.21μin (7.60μm) | Adhesive | ||||
Laird Technologies EMI |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
NOSG,STR,NIB,PSA
|
Foldover | 121°C | Fingerstock | Beryllium Copper | 0.080" (2.03mm) | 16.000" (406.40mm) | Nickel | 299.21μin (7.60μm) | Adhesive | ||||
Leader Tech Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
.093"T X .250"W--8200-0050-81
|
- | -62°C ~ 260°C | Gasket | Conductive Elastomer | 0.093" (2.36mm) | - | - | - | - | ||||
Leader Tech Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
.250"W X .250"H X 6.75"L--SQUARE
|
- | -40°C ~ 70°C | Fabric Over Foam | Polyurethane Foam,Nickel-Copper Polyester (NI/CU) | 0.250" (6.35mm) | 6.750" (171.45mm) | - | - | - | ||||
Laird Technologies EMI |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
NOSG COIL BF USF PSA
|
Foldover | 121°C | Fingerstock | Beryllium Copper | 0.080" (2.03mm) | 16.000" (406.40mm) | Unplated | - | Adhesive | ||||
Laird Technologies EMI |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
NOSG COIL ZNY PSA
|
Foldover | 121°C | Fingerstock | Beryllium Copper | 0.080" (2.03mm) | 16.000" (406.40mm) | Zinc + Yellow Chromate | 299.21μin (7.60μm) | Adhesive | ||||
Laird Technologies EMI |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
NOSG COIL NIB PSA
|
Foldover | 121°C | Fingerstock | Beryllium Copper | 0.080" (2.03mm) | 16.000" (406.40mm) | Nickel | 299.21μin (7.60μm) | Adhesive | ||||
Laird Technologies EMI |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
NOSG,STR,SNB,USF,PSA
|
Foldover | 121°C | Fingerstock | Beryllium Copper | 0.080" (2.03mm) | 16.000" (406.40mm) | Tin | 299.21μin (7.60μm) | Adhesive | ||||
Leader Tech Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
8000 SERIES-ORIENTED WIRE--8200-
|
- | -62°C ~ 260°C | Gasket | Conductive Elastomer | 0.062" (1.57mm) | - | - | - | - | ||||
Laird Technologies EMI |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
NOSG,STR,BF,USFT
|
Foldover | 121°C | Fingerstock | Beryllium Copper | 0.080" (2.03mm) | 16.000" (406.40mm) | - | - | - | ||||
Leader Tech Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.07 X .25 X 045 CDC 16--7-21C-0
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | 0.070" (1.78mm) | 16.000" (406.40mm) | Cadmium + Clear Chromate | Flash | Adhesive | ||||
Leader Tech Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.07 X .25 X 045 BD 16--7-21C-04
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | 0.070" (1.78mm) | 16.000" (406.40mm) | Unplated | - | Adhesive |