- Operating Temperature：
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- Type：
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- Material：
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- Height：
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- Length：
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- Plating：
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- Conditions sélectionnées:
Découvrez les produits 22
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Operating Temperature | Type | Material | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Operating Temperature | Type | Material | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | |
|
|
|
Laird Technologies EMI |
830
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
GASKET BECU ALLOY 8.1X609.6MM
|
121°C | Fingerstock | Beryllium Copper | 0.110" (2.79mm) | 24.000" (609.60mm) | 0.320" (8.13mm) | - | - | Adhesive | ||
|
|
|
Laird Technologies EMI |
114
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
GASKET BECU 9.4X406.40MM
|
121°C | Fingerstock | Beryllium Copper | 0.130" (3.30mm) | 16.000" (406.40mm) | 0.370" (9.40mm) | - | - | Adhesive | ||
|
|
|
Laird Technologies EMI |
219
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
GASKET BECU 8.1X406.4MM
|
121°C | Fingerstock | Beryllium Copper | 0.100" (2.54mm) | 16.000" (406.40mm) | 0.320" (8.13mm) | - | - | Adhesive | ||
|
|
|
Laird Technologies EMI |
359
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
GASKET BECU 27.94X609.6MM
|
121°C | Fingerstock | Beryllium Copper | 0.400" (10.16mm) | 24.000" (609.60mm) | 1.100" (27.94mm) | - | - | Adhesive | ||
|
|
|
Laird Technologies EMI |
447
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
GASKET BECU ALLOY 15.24X609.6MM
|
121°C | Fingerstock | Beryllium Copper | 0.220" (5.59mm) | 24.000" (609.60mm) | 0.600" (15.24mm) | - | - | Adhesive | ||
|
|
|
Laird Technologies EMI |
85
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
GASKET BECU 9.4X406.4MM
|
121°C | Fingerstock | Beryllium Copper | 0.130" (3.30mm) | 16.000" (406.40mm) | 0.370" (9.40mm) | - | - | Adhesive | ||
|
|
|
Laird Technologies EMI |
55
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
GASKET BECU 7.11X609.6MM
|
121°C | Fingerstock | Beryllium Copper | 0.110" (2.79mm) | 24.000" (609.60mm) | 0.280" (7.11mm) | - | - | Adhesive | ||
|
|
|
Laird Technologies EMI |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
GASKET BECU 9.4X406.4MM
|
121°C | Fingerstock | Beryllium Copper | 0.130" (3.30mm) | 16.000" (406.40mm) | 0.370" (9.40mm) | - | - | Adhesive | ||
|
|
|
Laird Technologies EMI |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
GASKET BECU 15.24X457.2MM
|
121°C | Fingerstock | Beryllium Copper | 0.220" (5.59mm) | 18.000" (457.20mm) | 0.600" (15.24mm) | - | - | Adhesive | ||
|
|
|
Laird Technologies EMI |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
GASKET BECU 15.24X457.2MM
|
121°C | Fingerstock | Beryllium Copper | 0.220" (5.59mm) | 18.000" (457.20mm) | 0.600" (15.24mm) | - | - | Slot | ||
|
|
|
Laird Technologies EMI |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
GASKET BECU 8.1X406.4MM
|
121°C | Fingerstock | Beryllium Copper | 0.090" (2.29mm) | 16.000" (406.40mm) | 0.320" (8.13mm) | - | - | Adhesive | ||
|
|
|
Laird Technologies EMI |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
GASKET BECU 15.24X457.2MM
|
121°C | Fingerstock | Beryllium Copper | 0.220" (5.59mm) | 18.000" (457.20mm) | 0.600" (15.24mm) | - | - | Slot | ||
|
|
|
Laird Technologies EMI |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
NOSG，STR,BF
|
121°C | Fingerstock | Beryllium Copper | 0.110" (2.79mm) | 24.000" (609.60mm) | 0.320" (8.13mm) | - | - | Adhesive | ||
|
|
|
Laird Technologies EMI |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
NOSG,STR,NID,PSA
|
121°C | Fingerstock | Beryllium Copper | 0.110" (2.79mm) | 24.000" (609.60mm) | 0.320" (8.13mm) | Nickel | 299.21μin (7.60μm) | Adhesive | ||
|
|
|
Laird Technologies EMI |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
NOSG，STR,NIB,PSA
|
121°C | Fingerstock | Beryllium Copper | 0.110" (2.79mm) | 24.000" (609.60mm) | 0.320" (8.13mm) | Nickel | 299.21μin (7.60μm) | Adhesive | ||
|
|
|
Laird Technologies EMI |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
NOSG,STR,SNB,PSA
|
121°C | Fingerstock | Beryllium Copper | 0.090" (2.29mm) | 16.000" (406.40mm) | 0.320" (8.13mm) | Tin | 299.21μin (7.60μm) | Adhesive | ||
|
|
|
Laird Technologies EMI |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
NOSG,STR,SNB,PSA
|
121°C | Fingerstock | Beryllium Copper | 0.130" (3.30mm) | 16.000" (406.40mm) | 0.370" (9.40mm) | Tin | 299.21μin (7.60μm) | Adhesive | ||
|
|
Laird Technologies EMI |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
NOSG STR BF PSA
|
- | - | - | - | 24.000" (609.60mm) | 0.319" (8.10mm) | - | - | - | |||
|
|
|
Laird Technologies EMI |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
NOSG,STR,SNSAT,PSA
|
121°C | Fingerstock | Beryllium Copper | 0.220" (5.59mm) | 24.000" (609.60mm) | 0.600" (15.24mm) | Tin | 299.21μin (7.60μm) | Adhesive | ||
|
|
|
Laird Technologies EMI |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
NOSG,STR,NIB,PSA
|
121°C | Fingerstock | Beryllium Copper | 0.130" (3.30mm) | 16.000" (406.40mm) | 0.370" (9.40mm) | Tin | 299.21μin (7.60μm) | Adhesive |
