- Series：
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- Type：
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- Material：
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- Width：
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- Plating - Thickness：
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- Attachment Method：
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- Conditions sélectionnées:
Découvrez les produits 9
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Series | Operating Temperature | Type | Material | Height | Width | Plating | Plating - Thickness | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Series | Operating Temperature | Type | Material | Height | Width | Plating | Plating - Thickness | Attachment Method | |
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Laird Technologies EMI |
Enquête
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- |
-
|
MOQ: 1 MPQ: 1
|
RFI EMI GROUNDING MATERIAL 25FT
|
Large Enclosure | 121°C | Fingerstock | Beryllium Copper | 0.250" (6.35mm) | 1.090" (27.69mm) | - | - | Hardware，Rivet，Solder | ||
|
|
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Laird Technologies EMI |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
PCBS COIL BF
|
- | - | - | - | - | 0.827" (21.00mm) | - | - | - | ||
|
|
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Laird Technologies EMI |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
NOSG COIL SNB PSA
|
Foldover | 121°C | Fingerstock | Beryllium Copper | 0.080" (2.03mm) | 0.250" (6.35mm) | Tin | 299.21μin (7.60μm) | Adhesive | ||
|
|
|
Laird Technologies EMI |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CSTR COIL SNB
|
Large Enclosure | 121°C | Fingerstock | Beryllium Copper | 0.410" (10.41mm) | 1.630" (41.40mm) | Tin | 299.21μin (7.60μm) | Hardware，Rivet，Solder | ||
|
|
|
Laird Technologies EMI |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
PCBS COIL BF
|
- | - | - | - | - | 0.520" (13.20mm) | - | - | - | ||
|
|
Laird Technologies EMI |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
PCBS COIL SNSAT
|
- | - | - | - | - | 0.827" (21.00mm) | - | - | - | |||
|
|
Laird Technologies EMI |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CSTR COIL NIE
|
Large Enclosure | 121°C | Fingerstock | Beryllium Copper | 0.410" (10.41mm) | 1.630" (41.40mm) | Nickel | 299.21μin (7.60μm) | Hardware，Rivet，Solder | |||
|
|
Laird Technologies EMI |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CSTR COIL BF USF
|
Large Enclosure | 121°C | Fingerstock | Beryllium Copper | 0.410" (10.41mm) | 1.630" (41.40mm) | Unplated | - | Adhesive | |||
|
|
Laird Technologies EMI |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CSTR COIL ZNY
|
Large Enclosure | 121°C | Fingerstock | Beryllium Copper | 0.250" (6.35mm) | 1.090" (27.69mm) | Zinc + Yellow Chromate | 299.21μin (7.60μm) | Hardware，Rivet，Solder |
