- Series：
-
- Operating Temperature：
-
- Type：
-
- Material：
-
- Height：
-
- Length：
-
- Width：
-
- Plating：
-
- Plating - Thickness：
-
- Conditions sélectionnées:
Découvrez les produits 1,795
 |
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Series | Operating Temperature | Type | Material | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Series | Operating Temperature | Type | Material | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | |
|
|
|
Wurth Electronics Inc. |
1,637
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | 0.209" (5.30mm) | 0.157" (4.00mm) | 0.079" (2.00mm) | Gold | Flash | Solder | ||
|
|
|
Laird Technologies EMI |
6,601
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 2.03X9.53MM
|
- | - | Fingerstock | Beryllium Copper | 0.084" (2.13mm) | 0.375" (9.53mm) | 0.256" (6.50mm) | Unplated | - | Clip | ||
|
|
|
Harwin Inc. |
3,095
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
SMT RFI SHIELD CLIP 100% TIN
|
EZ BoardWare | -40°C ~ 125°C | Shield Clip | Stainless Steel | 0.140" (3.55mm) | 0.346" (8.79mm) | 0.090" (2.28mm) | Tin | 118.11μin (3.00μm) | Solder | ||
|
|
|
Laird Technologies EMI |
10,684
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
GASKET BECU 15.24X6.35MM
|
Slot Mount | 121°C | Fingerstock | Beryllium Copper | 0.220" (5.59mm) | 0.250" (6.35mm) | 0.600" (15.24mm) | - | - | Adhesive | ||
|
|
|
Laird Technologies EMI |
5,794
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
GASKET BECU 8.1X9.04MM
|
Slot Mount | 121°C | Fingerstock | Beryllium Copper | 0.110" (2.79mm) | 0.356" (9.04mm) | 0.320" (8.13mm) | - | - | Slot | ||
|
|
|
Laird Technologies EMI |
3,533
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
GASKET BECU 9.1X9.88MM
|
Slot Mount | 121°C | Fingerstock | Beryllium Copper | 0.128" (3.25mm) | 0.389" (9.88mm) | 0.358" (9.09mm) | - | - | Slot | ||
|
|
|
Laird Technologies EMI |
3,211
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
GASKET BECU 8.1X13.82MM
|
Slot Mount | 121°C | Fingerstock | Beryllium Copper | 0.110" (2.79mm) | 0.543" (13.79mm) | 0.320" (8.13mm) | - | - | Slot | ||
|
|
|
Laird Technologies EMI |
1,328
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
GASKET BECU 9.4X18.4MM
|
Slot Mount | 121°C | Fingerstock | Beryllium Copper | 0.130" (3.30mm) | 0.725" (18.42mm) | 0.370" (9.40mm) | - | - | Slot | ||
|
|
|
Laird Technologies EMI |
1,437
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CARD GUI CLIPON BECU 3.05X9.53MM
|
- | - | - | - | - | 0.375" (9.53mm) | 0.120" (3.05mm) | - | - | - | ||
|
|
|
Wurth Electronics Inc. |
123
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONDUCTIVE NI/CU GLASS SLEEVE 1M
|
WE-ST | -60°C ~ 160°C | Gasket Sleeve | Nickel-Copper (NI/CU) Glass Fiber | - | 39.370" (1.00m) | 0.079" (2.00mm) | - | - | - | ||
|
|
|
Laird Technologies EMI |
101
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
GASKET BECU 8.26X406.4MM
|
Dual Slot | 121°C | Fingerstock | Beryllium Copper | 0.140" (3.56mm) | 16.000" (406.40mm) | 0.325" (8.26mm) | - | - | Slot | ||
|
|
|
Laird Technologies EMI |
1,700
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 15.24X406.4MM
|
- | 121°C | Fingerstock | Beryllium Copper | 0.210" (5.33mm) | 16.000" (406.40mm) | 0.600" (15.24mm) | - | - | Clip | ||
|
|
|
Laird Technologies EMI |
541
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
FINGRSTCK BECU ALY 15.24X406.4MM
|
- | 121°C | Fingerstock | Beryllium Copper | 0.220" (5.59mm) | 16.000" (406.40mm) | 0.600" (15.24mm) | - | - | Slot | ||
|
|
|
Laird Technologies EMI |
3,784
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 8.1X406.4MM
|
- | 121°C | Fingerstock | Beryllium Copper | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.320" (8.13mm) | - | - | Slot | ||
|
|
|
Laird Technologies EMI |
134
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 12.7X609.6MM
|
Twist | 121°C | Fingerstock | Beryllium Copper | 0.120" (3.05mm) | 24.000" (609.60mm) | 0.500" (12.70mm) | - | - | Adhesive | ||
|
|
|
Laird Technologies EMI |
192
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 7.57X406.4MM
|
- | 121°C | Fingerstock | Beryllium Copper | 0.170" (4.32mm) | 16.000" (406.40mm) | 0.300" (7.62mm) | - | - | Clip | ||
|
|
|
Laird Technologies EMI |
184
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 7.57X406.4MM
|
- | 121°C | Fingerstock | Beryllium Copper | 0.100" (2.54mm) | 16.000" (406.40mm) | 0.297" (7.54mm) | - | - | Clip | ||
|
|
|
Laird Technologies EMI |
1,428
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 1.6X304.8MM
|
- | - | - | - | - | 12.000" (304.80mm) | 0.063" (1.60mm) | - | - | - | ||
|
|
|
Laird Technologies EMI |
104
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 8.4X406.4MM
|
- | 121°C | Fingerstock | Beryllium Copper | 0.350" (8.89mm) | 16.000" (406.40mm) | 0.330" (8.38mm) | - | - | Clip | ||
|
|
|
Laird Technologies EMI |
405
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 24MMX406.4MM
|
- | 121°C | Fingerstock | Beryllium Copper | 0.250" (6.35mm) | 0.375" (9.53mm) | 0.940" (23.88mm) | - | - | Hardware，Rivet，Solder |
