- Series:
-
- Operating Temperature:
-
- Type:
-
- Material:
-
- Shape:
-
- Height:
-
- Length:
-
- Width:
-
- Plating:
-
- Plating - Thickness:
-
- Conditions sélectionnées:
Découvrez les produits 3,471
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Series | Operating Temperature | Type | Material | Shape | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Series | Operating Temperature | Type | Material | Shape | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | ||
Leader Tech Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.125 X 0.78 BD 16--11-78R2-BD-1
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.130" (3.30mm) | 16.000" (406.40mm) | 0.780" (19.81mm) | Unplated | - | Adhesive | ||||
Leader Tech Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.11 X 0.28 X 0.24 SN 16.0--FOLD
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | Tin | Flash | Adhesive | ||||
Leader Tech Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.14 X 0.37 SN 16--FOLDED SERIES
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.140" (3.56mm) | 16.000" (406.40mm) | 0.370" (9.40mm) | Tin | Flash | Adhesive | ||||
Laird Technologies EMI |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
PCLIP,STR,SNS,CLO
|
- | - | - | - | - | - | - | - | - | - | - | ||||
Laird Technologies EMI |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
PCLIP,STR,SNB,CLO
|
- | - | - | - | - | - | - | - | - | - | - | ||||
Laird Technologies EMI |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
PCLIP,STR,NIB,CLO
|
- | - | - | - | - | - | - | - | - | - | - | ||||
Leader Tech Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.07 X 0.30 NI 24--6-30T-NI-24--
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.060" (1.52mm) | 24.000" (609.60mm) | 0.300" (7.62mm) | Nickel | Flash | Adhesive | ||||
Leader Tech Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.07 X 0.14 SN 24--TWIST RIGHT A
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.070" (1.78mm) | 24.000" (609.60mm) | 0.140" (3.56mm) | Tin | Flash | Adhesive | ||||
Leader Tech Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.07 X 0.22 X 040 BD 16--TWIST C
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.060" (1.52mm) | 16.000" (406.40mm) | 0.220" (5.59mm) | Unplated | - | Adhesive | ||||
Leader Tech Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.12 X 0.90 BD 16--11-90S-BD-16-
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.900" (22.86mm) | Unplated | - | Adhesive | ||||
Leader Tech Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.25 X 0.78 BD 85.875 NTP--FOLDE
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.250" (6.35mm) | 7.16 (2.18m) | 0.780" (19.81mm) | Unplated | - | Adhesive | ||||
Leader Tech Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.10 X 0.30 X 0.045 BD 16--10-30
|
TechMESH | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.100" (2.54mm) | 16.000" (406.40mm) | 0.300" (7.62mm) | Unplated | - | Adhesive | ||||
Leader Tech Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.10 X 0.30 X 050 BD 16--10-30C-
|
TechMESH | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.100" (2.54mm) | 16.000" (406.40mm) | 0.300" (7.62mm) | Unplated | - | Adhesive | ||||
Leader Tech Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.10 X 0.30 X 065 BD 16--10-30C-
|
TechMESH | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.100" (2.54mm) | 16.000" (406.40mm) | 0.300" (7.62mm) | Unplated | - | Adhesive | ||||
Leader Tech Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.10 X 0.30 X 070 BD 16--10-30C-
|
TechMESH | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.100" (2.54mm) | 16.000" (406.40mm) | 0.300" (7.62mm) | Unplated | - | Adhesive | ||||
Leader Tech Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.11 X 0.28 SN 16--FOLDED SERIES
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | Tin | Flash | Adhesive | ||||
Leader Tech Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.11 X 0.32 SN 16--11-32AH-SN-16
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.320" (8.13mm) | Tin | Flash | Adhesive | ||||
Leader Tech Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.11 X 0.35 SN 15--11-35DT-SN-15
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.110" (2.79mm) | 15.000" (381.00mm) | 0.350" (8.89mm) | Tin | Flash | Adhesive | ||||
Leader Tech Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.11 X 0.375 SN 16--FOLDED SERIE
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.380" (9.65mm) | Tin | Flash | Adhesive | ||||
Leader Tech Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.09 X 0.78 SN 16--9-78D-SN-16--
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.090" (2.29mm) | 16.000" (406.40mm) | 0.780" (19.81mm) | Tin | Flash | Adhesive |