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- Operating Temperature：
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- Conditions sélectionnées:
Découvrez les produits 3,471
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Series | Operating Temperature | Type | Material | Shape | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Series | Operating Temperature | Type | Material | Shape | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | |
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Leader Tech Inc. |
Enquête
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- |
-
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MOQ: 1 MPQ: 1
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0.07 X 0.34 BD 24--6-34T-BD-24--
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.070" (1.78mm) | 24.000" (609.60mm) | 0.340" (8.64mm) | Unplated | - | Adhesive | |||
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Leader Tech Inc. |
Enquête
|
- |
-
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MOQ: 1 MPQ: 1
|
0.07 X 0.14 BD 24--TWIST RIGHT A
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.070" (1.78mm) | 24.000" (609.60mm) | 0.140" (3.56mm) | Unplated | - | Adhesive | |||
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Leader Tech Inc. |
Enquête
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- |
-
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MOQ: 1 MPQ: 1
|
.187"H X .375"W X 48"L--RECTANGU
|
- | -40°C ~ 70°C | Fabric Over Foam | Polyurethane Foam，Nickel-Copper Polyester (NI/CU) | Rectangular | 0.187" (4.75mm) | 4.00 (1.22m) | 0.375" (9.53mm) | - | - | - | |||
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Leader Tech Inc. |
Enquête
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- |
-
|
MOQ: 1 MPQ: 1
|
.295"H X .355"W X 48"L--D SHAPED
|
- | -40°C ~ 70°C | Fabric Over Foam | Polyurethane Foam，Nickel-Copper Polyester (NI/CU) | D-Shape | 0.295" (7.49mm) | 4.00 (1.22m) | 0.355" (9.00mm) | - | - | - | |||
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Laird Technologies EMI |
Enquête
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- |
-
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MOQ: 1 MPQ: 1
|
AMRE,MON,RL
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- | - | - | - | - | - | - | - | - | - | - | |||
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Laird Technologies EMI |
Enquête
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- |
-
|
MOQ: 1 MPQ: 1
|
EGW,SS
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- | - | - | - | - | - | - | - | - | - | - | |||
|
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Laird Technologies EMI |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
NOSG COIL SNB PSA
|
Foldover | 121°C | Fingerstock | Beryllium Copper | - | 0.140" (3.56mm) | 16.000" (406.40mm) | 0.510" (12.95mm) | Tin | 299.21μin (7.60μm) | Adhesive | |||
|
|
Leader Tech Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.11 X 0.375 BD 16--FOLDED SERIE
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.380" (9.65mm) | Unplated | - | Adhesive | |||
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Leader Tech Inc. |
Enquête
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- |
-
|
MOQ: 1 MPQ: 1
|
0.09 X 0.78 BD 16--9-78D-A-BD-16
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.090" (2.29mm) | 16.000" (406.40mm) | 0.780" (19.81mm) | Unplated | - | Adhesive | |||
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Leader Tech Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.09 X 0.78 BD 16--9-78D-BD-16--
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.090" (2.29mm) | 16.000" (406.40mm) | 0.780" (19.81mm) | Unplated | - | Adhesive | |||
|
|
Laird Technologies EMI |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
AP,STR,SNB,USFT,PSA
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.140" (3.56mm) | 16.000" (406.40mm) | 0.370" (9.40mm) | Tin | 299.21μin (7.60μm) | Adhesive | |||
|
|
Laird Technologies EMI |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
AP,STR,NIB,USFT,PSA
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.140" (3.56mm) | 16.000" (406.40mm) | 0.370" (9.40mm) | Nickel | 299.21μin (7.60μm) | Adhesive | |||
|
|
Laird Technologies EMI |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
S3,STR,BF,USF,RIV
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.220" (5.59mm) | 15.000" (381.00mm) | 0.620" (15.75mm) | - | - | Rivet | |||
|
|
Laird Technologies EMI |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
NOSG,STR,BF,USFT
|
Foldover | 121°C | Fingerstock | Beryllium Copper | - | 0.080" (2.03mm) | 16.000" (406.40mm) | 0.250" (6.35mm) | - | - | - | |||
|
|
Leader Tech Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.13 X 0.37 BD 16--13-S-37AH-BD-
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.130" (3.30mm) | 16.000" (406.40mm) | 0.370" (9.40mm) | Unplated | - | Adhesive | |||
|
|
Leader Tech Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.11 X 0.28 BD 16--FOLDED SERIES
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | Unplated | - | Adhesive | |||
|
|
Leader Tech Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.14 X 0.37 BD 16--FOLDED SERIES
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.140" (3.56mm) | 16.000" (406.40mm) | 0.370" (9.40mm) | Unplated | - | Adhesive | |||
|
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Leader Tech Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.03 X 0.08 NI 24--TWIST RIGHT A
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.030" (0.76mm) | 24.000" (609.60mm) | 0.080" (2.03mm) | Nickel | Flash | Adhesive | |||
|
|
Leader Tech Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.10 X 0.30 CT BD 16--10-30CT-BD
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.300" (7.62mm) | 16.000" (406.40mm) | 0.100" (2.54mm) | Unplated | - | Adhesive | |||
|
|
Laird Technologies EMI |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
NOSG COIL BF USF PSA
|
Foldover | 121°C | Fingerstock | Beryllium Copper | - | 0.230" (5.84mm) | 24.000" (609.60mm) | 0.760" (19.30mm) | Unplated | - | Adhesive |
