- Operating Temperature:
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- Shape:
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- Height:
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- Plating:
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- Plating - Thickness:
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- Attachment Method:
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- Conditions sélectionnées:
Découvrez les produits 11
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Series | Operating Temperature | Type | Material | Shape | Height | Length | Plating | Plating - Thickness | Attachment Method | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Series | Operating Temperature | Type | Material | Shape | Height | Length | Plating | Plating - Thickness | Attachment Method | ||
Laird Technologies EMI |
159
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 4X609.6MM
|
Twist | 121°C | Fingerstock | Beryllium Copper | - | 0.030" (0.76mm) | 24.000" (609.60mm) | - | - | Adhesive | ||||
Laird Technologies EMI |
33
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 4X609.6MM
|
Twist | 121°C | Fingerstock | Beryllium Copper | - | 0.030" (0.76mm) | 24.000" (609.60mm) | Tin | 299.21μin (7.60μm) | Adhesive | ||||
Laird Technologies EMI |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
TWT,STR,BF,USFT,PSA
|
Twist | 121°C | Fingerstock | Beryllium Copper | - | 0.030" (0.76mm) | 24.000" (609.60mm) | - | - | Adhesive | ||||
Laird Technologies EMI |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
TWT,STR,SNSAT,RA,PSA
|
Twist | 121°C | Fingerstock | Beryllium Copper | - | 0.030" (0.76mm) | 24.000" (609.60mm) | Tin | 299.21μin (7.60μm) | Adhesive | ||||
Laird Technologies EMI |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
TWT,STR,ZNC,RA,PSA
|
Twist | 121°C | Fingerstock | Beryllium Copper | - | 0.030" (0.76mm) | 24.000" (609.60mm) | Zinc + Clear Chromate | 299.21μin (7.60μm) | Adhesive | ||||
Laird Technologies EMI |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
TWT,17S,NIB,PSA
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.030" (0.76mm) | 24.000" (609.60mm) | Nickel | 299.21μin (7.60μm) | Adhesive | ||||
Laird Technologies EMI |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
TWT,STR,SNB,USF,PSA
|
Twist | 121°C | Fingerstock | Beryllium Copper | - | 0.030" (0.76mm) | 24.000" (609.60mm) | Tin | 299.21μin (7.60μm) | Adhesive | ||||
Laird Technologies EMI |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
TWT,STR,NIB,USFT,PSA
|
Twist | 121°C | Fingerstock | Beryllium Copper | - | 0.030" (0.76mm) | 24.000" (609.60mm) | Nickel | 299.21μin (7.60μm) | Adhesive | ||||
Leader Tech Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
.060"H X .160" W X 48"L--RECTANG
|
- | -40°C ~ 70°C | Fabric Over Foam | Polyurethane Foam,Nickel-Copper Polyester (NI/CU) | Rectangular | 0.060" (1.52mm) | 4.00 (1.22m) | - | - | - | ||||
Leader Tech Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
.080"H X .160"W X 9"L--D SHAPED-
|
- | -40°C ~ 70°C | Fabric Over Foam | Polyurethane Foam,Nickel-Copper Polyester (NI/CU) | D-Shape | 0.080" (2.03mm) | 9.000" (228.60mm) | - | - | - | ||||
Leader Tech Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
.160"H X .160"W X 48"L--ROUND--C
|
- | -40°C ~ 70°C | Fabric Over Foam | Polyurethane Foam,Nickel-Copper Polyester (NI/CU) | Round | 0.160" (4.06mm) | 4.00 (1.22m) | - | - | - |